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China factory - Shenzhen Hiner Technology Co.,LTD

Shenzhen Hiner Technology Co.,LTD

  • China,Shenzhen ,Guangdong
  • Verified Supplier

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China JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS
China JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS

  1. China JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS
  2. China JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS
  3. China JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS
  4. China JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS

JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS

  1. MOQ: 1000 pcs
  2. Price: Prices are determined according to different incoterms and quantities
  3. Get Latest Price
Payment Terms T/T
Supply Ability 2000PCS/Day
Delivery Time 1~2 Weeks
Packaging Details 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30cm
Mold No. HN23066
Cavity Size/mm 11.3*13.3*1.17
Overall Dimension/mm 322.6x135.9x12.19
Material PEI/MPPO
Matrix Quantity 3X7=21PCS
Height 12.19mm
Shaping Mode Plasitc Injection Mould
Flatness Less than 0.76mm
Color Black(According to customer needs)
Peculiarity Permanent antistatic
Temperature 180°C for 2 hours
Experience 14 years
Incoterms EXW,FOB,CIF,DDU,DDP
Clean Class General and ultrasonic cleaning
Ic Type BGA,QFP,QFN,LGA,PGA
Brand Name Hiner-pack
Model Number HN23066
Certification ISO 9001 ROHS SGS
Place of Origin Made In China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms T/T Supply Ability 2000PCS/Day
Delivery Time 1~2 Weeks Packaging Details 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30cm
Mold No. HN23066 Cavity Size/mm 11.3*13.3*1.17
Overall Dimension/mm 322.6x135.9x12.19 Material PEI/MPPO
Matrix Quantity 3X7=21PCS Height 12.19mm
Shaping Mode Plasitc Injection Mould Flatness Less than 0.76mm
Color Black(According to customer needs) Peculiarity Permanent antistatic
Temperature 180°C for 2 hours Experience 14 years
Incoterms EXW,FOB,CIF,DDU,DDP Clean Class General and ultrasonic cleaning
Ic Type BGA,QFP,QFN,LGA,PGA Brand Name Hiner-pack
Model Number HN23066 Certification ISO 9001 ROHS SGS
Place of Origin Made In China
High Light 3X7 JEDEC IC Tray21PCS JEDEC matrix traysHigh Temperature JEDEC IC Tray

Reflow Testing Available JEDEC IC Tray Standard With BGA11.3*13.3mm High Temperature Tray

Optimize handling for QFN, BGA, and custom modules with JEDEC trays built precisely to your product specs.

Application:

1. Electronics Manufacturing: Widely used in semiconductor manufacturing, assembly, and testing.


2. R&D: Storing and testing new products in laboratories and R&D environments.


3. Logistics: Used in supply chain management to securely transport electronic components. 


Features & Advantages:

1. Durability: The injection molded material has good durability and impact resistance to provide full protection during transportation.


2. Multi-purpose: Suitable for the storage of a wide range of electronic components, such as integrated circuits (ICs), sensors, modules, etc.


3. Lightweight design: Lightweight design facilitates handling and storage, improving logistics efficiency.


4. Improve reliability: Prevent static electricity from damaging chips and components, and ensure product quality. 


5. Reduces loss: Effectively protects components and reduces damage and waste during transportation and storage.


6. Simplify operation: Standardized pallet design facilitates quick identification and handling in production lines and warehouses. 


7. Strong compatibility: Suitable for various package types, reducing inventory diversity and simplifying management.

Technical Parameters:

Brand Hiner-pack Outline Line Size 322.6*135.9*12.19mm
Model HN23066 Cavity Size 11.3*13.3*1.17mm
Package Type IC Component Matrix QTY 3*7=21PCS
Material PE/MPPO Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS


Materials commonly used for JEDEC trays include MPPO, PEI (polyetherimide), PES (polyether sulfone), and PPE. 

Below are the characteristics of these materials and their advantages:


1. MPPO 
- Characteristics: 

Excellent thermal stability and mechanical strength. Suitable for high-temperature environments.

- Advantages: 

High temperature resistance: suitable for use in high temperature conditions to prevent deformation.
Excellent electrical insulation: protects electronic components and reduces electrostatic damage.
Chemical stability: maintains stability in a wide range of chemical environments.


2. PEI (Polyetherimide)
- Characteristics: 

Very high thermal stability and excellent mechanical properties. Can be used at temperatures up to 200°C.

- Advantages: 

High heat resistance: suitable for high-temperature processing and storage environments.
Excellent electrical insulation properties: effectively protects sensitive electronic components.
Excellent chemical resistance: able to resist a wide range of chemicals.


3. PES (Polyether Sulfide)
- Characteristics:

Combines the advantages of PEI, but with better toughness and thermal fluidity during injection molding. Suitable for a wide range of industrial applications.

- Advantages:

Good heat resistance: maintains physical properties in high-temperature environments.
Chemical resistance: good resistance to a wide range of chemicals.
Excellent mechanical properties: provides additional protection during transportation and storage.
 

4. PPE 
- Characteristics:

Good thermal stability and excellent electrical insulation properties.
Higher rigidity and strength.

- Advantages:

Excellent electrical insulation: effectively prevents static damage and protects electronic components.
High temperature resistance: suitable for use in high temperature environments to prevent deformation.
Chemical resistance: able to resist a wide range of chemicals, suitable for different application scenarios.

JEDEC tray HN23066-1

JEDEC tray parameters HN23066


Customer FAQ:

Question 1: How long does it take to open the mold?

 • Sample mold: 20-25 days.
 • Soft mold: 12-15 days.
 • Hard mold: 15-20 days.
 • Hard mold (>200T) 25-28 days.
 • Two-color production mold: 25-28 days.

 • It depends on the requirement and complexity.


Question 2: What services can we provide?

1.OEM/ODM service.
2. Professional mold design and production service.
3. Provide plastic parts assembly service.
4. Provide plastic parts packaging service.
5. Provide after-sales service.


Question 3: How many kinds of plastic injection products do you produce?

Mainly for consumer electronics, medical facilities, auto parts, digital electronics, computer accessories, semiconductors, labor protection, and other products.

Welcome to the enquiry.

JEDEC tray HN23066-2

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other

  • Year Established:

    2013

  • Total Annual:

    5,000,000.00-10,000,000.00

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...

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Get in touch with us

  • Reach Us
  • Shenzhen Hiner Technology Co.,LTD
  • Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN
  • https://www.jedecictrays.com/

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