Packaging Details | 70~100pcs/carton(According to the customer demand) |
Delivery Time | Mold:About 25 Days / Product:7~10 Days |
Payment Terms | 100% Prepayment |
Supply Ability | 2000PCS/Day |
Compatibility | JEDEC Standard |
Anti-Static | Yes |
Custom | Support |
Pocket Size | 22.5*22.18*2.98mm |
Use | Transport,Storage,Packing |
Color | Usual Black |
Material | MPPO.PPE.ABS.PEI.IDP |
Hs Code | 39239000 |
Brand Name | Hiner-pack |
Model Number | HN23116 |
Place of Origin | SHENZHEN CN |
Certification | ISO 9001 ROHS SGS |
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Product Specification
Packaging Details | 70~100pcs/carton(According to the customer demand) | Delivery Time | Mold:About 25 Days / Product:7~10 Days |
Payment Terms | 100% Prepayment | Supply Ability | 2000PCS/Day |
Compatibility | JEDEC Standard | Anti-Static | Yes |
Custom | Support | Pocket Size | 22.5*22.18*2.98mm |
Use | Transport,Storage,Packing | Color | Usual Black |
Material | MPPO.PPE.ABS.PEI.IDP | Hs Code | 39239000 |
Brand Name | Hiner-pack | Model Number | HN23116 |
Place of Origin | SHENZHEN CN | Certification | ISO 9001 ROHS SGS |
High Light | Custom Black JEDEC Trays ,IC Packaging JEDEC Trays ,PPE JEDEC Trays |
The JEDEC trays have been specifically designed and manufactured to fit seamlessly with standard handling and testing equipment. They are readily compatible with pick-and-place machines which greatly streamlines the manufacturing process.
The JEDEC trays have been designed for multiple uses, making them an excellent cost-effective and environmentally friendly solution for semiconductor packaging. Their reusability minimizes waste and lowers operational costs.
While there are standard designs available for JEDEC trays, some manufacturers offer additional customization to accommodate specific device shapes or sizes. This provides flexibility in the manufacturing process and ensures that the trays can be tailored to meet individual requirements.
HN PN. | Description | External Size/mm | Pocket Size/mm | Matrix QTY |
HN23116 | NEW-R2-2573-COD | 322.6x135.9x7.62 | 22.5*22.18*2.98 | 4X11=44PCS |
TYPE | Brand | Flatness | Resistance | Service |
BGA IC | Hiner-pack | MAX 0.76mm | 1.0x10e4-1.0x10e11Ω | Accept OEM,ODM |
The JEDEC TRAY structure and shape conforms with international standards, which not only satisfies the requirements for carrying electronic components and various packaging ICs, but also aligns with the needs for automatic feeding system by customers, matching automation equipment for loading with ease and delivering efficient work efficiency.
At Hiner-pack, our customized JEDEC TRAY is designed to 100% meet your IC's specifics, providing tailored protection solutions based on its chip packaging. Our website showcases our range of JEDEC TRAY designs for multiple packaging type, including but not limited to BGA, FBGA, LGAQFN, QFP, PGA, TQFP, LQFP, SoC, and others. We can deliver effective design solutions and effective wafer-level package protection for your products.
JEDEC trays are a crucial element in the semiconductor industry due to their ability to guarantee secure and efficient handling of fragile electronic parts. The trays have extensive applications which include:
JEDEC trays are useful in safeguarding the delicate components during shipping and storage. They are also essential in ensuring that the electronic parts are well-positioned during component testing and semiconductor manufacturing and assembly process.
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification:
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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