Shenzhen Hiner Technology Co.,LTD
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Application | Semiconductor Industry |
| Molding Method | Injection Moulding |
| Color | Black |
| Stackable | Yes |
| Anti-Static | Yes |
| Material | PC |
| ESD Protection | Yes |
| Brand Name | Hiner-pack |
| Model Number | HN24097 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | SHENZHEN CN |
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Product Specification
| Packaging Details | It Depends On The QTY Of Order And Size Of Product | Delivery Time | 5~8 Working Days |
| Payment Terms | T/T | Supply Ability | 4000PCS~5000PCS/per Day |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Application | Semiconductor Industry |
| Molding Method | Injection Moulding | Color | Black |
| Stackable | Yes | Anti-Static | Yes |
| Material | PC | ESD Protection | Yes |
| Brand Name | Hiner-pack | Model Number | HN24097 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | SHENZHEN CN |
| High Light | Waffle Pack Bare Die Tray ，Microelectronic Industry Bare Die Tray ，Stackable Bare Die Tray | ||
The Bare Die Tray series from Hiner-pack provides a safe and convenient solution for the packaging and transportation of Chip, Die, COG, Optoelectronic devices, and other microelectronic components. Available in various sizes and materials, the product specifications include 2-inch, 3-inch, and 4-inch options. The materials offered are Antistatic/Conductive ABS and PC, and customizations are available to meet special customer requirements.
At Hiner-pack, we offer a diverse range of sizes and styles for Bare Die Tray molds that have high demands for product size and flatness. Our approach involves utilizing imported Moldflow analysis in the product mold design stage to ensure precise control over product size accuracy and flatness. This meticulous process aligns with the control of material properties, mold structure, and injection molding conditions to effectively fulfill customer quality standards.
Permanent Antistatic: Our products comply with ESD and RoHS environmental standards, ensuring a long-lasting antistatic effect.
Automation Cooperation: In conjunction with automated production enables us to enhance product yield and production efficiency.
Stable Size and High Precision: With stable dimensions and high precision, our products can be transported without risk of being crushed or damaged.
Dust-Free Packaging: After the product formation process, we provide dust-free cleaning and packaging, making them suitable for cleanrooms ranging from class 10 to 1000.
Customized Design: We offer design styles and sizes tailored to meet the specific requirements of our customers.
| HN24097 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| PC | Black | 5*20=100PCS | 13*1.35*0.1mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable;Reusable;Rcofriendly;Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
We offer the ability to create custom trays from scratch and deliver them to meet the high quality standards of microelectronic and various other industries in as little as two weeks. These trays play a crucial role in safeguarding, automating, storing, and shipping a diverse range of products across multiple sectors.
The utility of our custom packaging trays is not limited to the semiconductor sector alone. These trays find application in any setting that requires the management of small items, such as medical components, precious gems, springs, screws, watch parts, and more. Specifically engineered device trays are designed to seamlessly integrate with manual or automated tool handling systems, ensuring dependable performance and top-notch protection for devices while also reducing shipping and storage expenses.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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