Shenzhen Hiner Technology Co.,LTD
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Incoterms | EXW, FOB, CIF, DDU, DDP |
| Application | Semiconductor Industry |
| Injection Mold | Lead Time 20~25 Days |
| Customizable | Yes |
| ESD Protection | Yes |
| Design | Standard And Non-standard |
| Warpage | ＜0.3mm |
| Stackable | Yes |
| Brand Name | Hiner-pack |
| Model Number | HN24059 |
| Certification | ISO 9001 ROHS SGS |
| Place of Origin | SHENZHEN CN |
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Product Specification
| Packaging Details | It Depends On The QTY Of Order And Size Of Product | Delivery Time | 5~8 Working Days |
| Payment Terms | T/T | Supply Ability | 4000PCS~5000PCS/per Day |
| Incoterms | EXW, FOB, CIF, DDU, DDP | Application | Semiconductor Industry |
| Injection Mold | Lead Time 20~25 Days | Customizable | Yes |
| ESD Protection | Yes | Design | Standard And Non-standard |
| Warpage | ＜0.3mm | Stackable | Yes |
| Brand Name | Hiner-pack | Model Number | HN24059 |
| Certification | ISO 9001 ROHS SGS | Place of Origin | SHENZHEN CN |
| High Light | Customizable Bare Die Trays ，Good Wear Resistance Bare Die Trays ，Semiconductor Industry Bare Die Trays | ||
The Chip Tray & Waffle Pack series from Hiner-pack offers a secure and convenient solution for packaging and transporting Chip, Die, COG, Optoelectronic devices, and other microelectronic components. These products come in various sizes and materials, with options including 2 inches, 3 inches, and 4 inches in size. The materials used include Antistatic/Conductive ABS and PC, and can be customized to meet specific customer requirements.
We provide a diverse range of sizes and styles for Chip Tray & Waffle Pack molds. These molds have strict requirements for product size and flatness. Hiner-pack utilizes Moldflow analysis in the design of product molds, which enables precise control over product size accuracy and flatness. This meticulous control is achieved by considering material characteristics, mold structure, and injection molding conditions to meet the quality standards expected by customers.
Our products comply with ESD and RoHS environmental standards to ensure long-lasting antistatic properties.
Can cooperate with automation systems to enhance product yield and increase production efficiency significantly.
With stable size and high precision, our products are resistant to crushing during transportation, maintaining their integrity.
After the products are formed, they undergo dust-free cleaning packaging, making them suitable for class 10-1000 cleanroom environments.
We are capable of designing products in various styles and sizes to meet the unique requirements of our customers.
| HN24059 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| PC | Black | 11*18=198PCS | 3.2*6.2*0.9mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable;Reusable;Rcofriendly;Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
We specialize in designing and manufacturing custom trays to meet the stringent quality requirements of the microelectronic and other industries. Our custom trays are crafted from scratch and can be delivered in as little as three weeks. These trays are essential in various industries to protect, automate, store, and transport a wide range of products.
Our custom packaging trays are not limited to just the semiconductor sector. They can be utilized wherever there is a need to manage an inventory of small items, including medical parts, gems, springs, screws, watch components, and more. These device trays are crafted to seamlessly work with manual or automated tool handling, ensuring reliable performance and superior protection for the devices while also reducing shipping and storage expenses.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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