Shenzhen Hiner Technology Co.,LTD
| Place Of Origin | Shenzhen, China |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Size | 2-inch And 4-inch |
| Warpage | ＜0.2mm |
| Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Temperature | 80°C~180°C |
| Optional | Lid/Cover And Clip/Clamp |
| Stackable | Yes |
| Injection Mold | Lead Time 20~25 Days |
| Brand Name | Hiner-pack |
| Model Number | HN24038 |
| Certification | ISO 9001 ROHS SGS |
View Detail Information
Explore similar products
2-inch Injection Mold Bare Die Tray With High Temperature Resistance For Clean
Square Regular Antistatic IC Chip Transfer Tray Environmental Friendly
Chip Scale Packages IC Die Carriers For Precise Die Placement And Stackable
Precision Machining Bare Die Trays For Transport And Customized Service By
Product Specification
| Place Of Origin | Shenzhen, China | Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days | Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day | Size | 2-inch And 4-inch |
| Warpage | ＜0.2mm | Surface Resistance | 1.0x10E4~1.0x10E11Ω |
| Temperature | 80°C~180°C | Optional | Lid/Cover And Clip/Clamp |
| Stackable | Yes | Injection Mold | Lead Time 20~25 Days |
| Brand Name | Hiner-pack | Model Number | HN24038 |
| Certification | ISO 9001 ROHS SGS | ||
| High Light | Stackable Cleanroom-Safe Tray ，Automated Operations Cleanroom-Safe Tray ，Chip Storage Cleanroom-Safe Tray | ||
Cleanroom-Safe Tray For Chip Storage And Automated Operations
This high-precision waffle pack chip tray (Bare Die Tray) is designed in the industry-standard 2x2 inch format, ideal for safely storing and transporting fragile semiconductor die and chip-scale packages (CSP).
Each tray is molded with a uniform pocket matrix tailored to support 2.5D components with minimal surface features. Made of electrically conductive plastic, the tray provides essential electrostatic protection while maintaining rigidity and dimensional stability.
Adaptable to automated production, this waffle pack is an essential component in microelectronic packaging, testing, and inspection workflows.
1. Compact 2x2 inch footprint suitable for small die and CSP formats;
2. Precision-molded conductive polymer ensures ESD protection and part stability;
3. Customizable pocket shapes and depths to accommodate irregular geometries;
4. Compatible with standard clip systems, stackable design with top tray cover options;
5. Durable construction resists warping and maintains alignment under handling stress;
6. Heat-resistant versions are available for thermal testing or baking environments.
| HN24038 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 11*8=88PCS | 4.40*3.00*0.35mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
Optimized for bare die, chip-scale packages, and small photonic or optical elements , this waffle tray is designed for back-end processes such as inspection, die sorting, packaging, and prototype assembly. Its precision alignment and repeatability make it particularly suitable for R&D labs, engineering lines, and pilot production setups that are moving towards automation.
The waffle tray is ideal for loading operations that require accurate alignment and repeatability . This makes it a great choice for a variety of tasks, from inspection to die sorting, packaging, and prototype assembly. Its versatility and reliability make it a crucial tool in various settings, such as R&D labs, engineering lines, and pilot production facilities.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
Get in touch with us
Leave a Message, we will call you back quickly!