Shenzhen Hiner Technology Co., Ltd.
| Place Of Origin | Shenzhen, China |
| Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days |
| Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day |
| Size | 2-inch (4-inch Optional) |
| Heat Resistant | Yes |
| Custom Logo | Available |
| Lid And Clip | Optional |
| Material | ABS, PC, PPE, MPPO, PEI, HIPS...etc. |
| Clean Class | General And Ultrasonic Cleaning |
| Injection Mold | Lead Time 20~25 Days |
| Brand Name | Hiner-pack |
| Model Number | HN24036 |
| Certification | ISO 9001 ROHS SGS |
View Detail Information
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Product Specification
| Place Of Origin | Shenzhen, China | Packaging Details | It Depends On The QTY Of Order And Size Of Product |
| Delivery Time | 5~8 Working Days | Payment Terms | T/T |
| Supply Ability | 4000PCS~5000PCS/per Day | Size | 2-inch (4-inch Optional) |
| Heat Resistant | Yes | Custom Logo | Available |
| Lid And Clip | Optional | Material | ABS, PC, PPE, MPPO, PEI, HIPS...etc. |
| Clean Class | General And Ultrasonic Cleaning | Injection Mold | Lead Time 20~25 Days |
| Brand Name | Hiner-pack | Model Number | HN24036 |
| Certification | ISO 9001 ROHS SGS | ||
| High Light | ABS Bare Die Tray ，Clip Bare Die Tray ，Optional Lid Bare Die Tray | ||
Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip
The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack provides a safe and convenient solution for packaging and transporting various microelectronic components such as Chip, Die, COG, and Optoelectronic devices. These products come in multiple sizes and materials, with options including 2-inch and 4-inch product specifications. Materials used include Antistatic/Conductive ABS and PC, offering flexibility for different needs. Additionally, customization is available to meet the specific requirements of customers.
Molded of ESD-safe, non-sloughing, carbon-powder-free, clean polymers
This product is manufactured using ESD-safe, non-sloughing, carbon-powder-free, clean polymers. These materials are carefully selected to ensure safety against electrostatic discharge (ESD) while also being environmentally friendly and free of carbon powder residue.
Carbon-fiber reinforced for strength and permanent ESD protection
In addition to its primary materials, this product is reinforced with carbon fiber for enhanced strength and long-lasting ESD protection. The carbon fiber reinforcement ensures durability and reliability in various applications where ESD protection is a critical requirement.
Up to 180°C bake temperature available
This product can withstand bake temperatures of up to 180°C, making it suitable for use in high-temperature environments. The ability to endure such heat levels demonstrates the product's resilience and adaptability for diverse manufacturing processes.
Industry-standard formats, customized for your needs
Available in industry-standard formats, this product can also be customized to meet specific requirements. Whether you need a standard size or a tailored design, the product offers flexibility to accommodate your unique needs and preferences.
| HN24036 Technical Data Ref. | ||||
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| ABS | Black | 19*12=228PCS | 2.70*1.30*1.40mm | |
| Size | Length * Width * Height (according to customer's requirement) | |||
| Feature | Durable; Reusable; Rcofriendly; Biodegradable | |||
| Sample | A. The free samples: Choosen from existing products. | |||
| B. Customized samples as per your design/demand | ||||
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper | |||
| Artowrk Format | PDF,2D,3D | |||
The variability is in the pocket size, geometry and count.
Waffle pack trays are usually specified by a few characteristics:
Custom waffle pack trays require additional specification:
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller,Other
Year Established:
2013
Total Annual:
5,000,000.00-10,000,000.00
Employee Number:
80~100
Ecer Certification：
Verified Supplier
Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p... Hiner-pack was founded in 2013, it is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services. Hiner-p...
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