KANG DA ELECTRONICS CO.
Products
Manufacturer of a wide range of products which include LYT4222E,VIPER17HN,M2S150T-FCVG484I,etc
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| Description | Power Integrations IC OFFLINE SWITCH MULT TOP 7ESIP Integrated Chips |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Category | Integrated Circuits (ICs)Power Management (PMIC)AC DC Converters, Offline Switches |
| Control Features | - |
| Product Status | Obsolete |
| Duty Cycle | 99.9% |
| Mounting Type | Through Hole |
| Frequency - Switching | 140kHz |
| Package | Tube |
| Series | LYTSwitch™-4 |
| Supplier Device Package | eSIP-7C |
| Output Isolation | Isolated |
| Mfr | Power Integrations |
| Power (Watts) | 15 W |
| Fault Protection | - |
| Voltage - Breakdown | 725V |
| Voltage - Supply (Vcc/Vdd) | - |
| Package / Case | 7-SSIP, 6 Leads, Exposed Pad, Formed Leads |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Internal Switch(s) | Yes |
| Base Product Number | LYT4222 |
| Topology | Flyback, Step-Down (Buck), Step-Up (Boost) |
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| Category | Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches |
| Control Features | - |
| Product Status | Active |
| Voltage - Start Up | 14 V |
| Mounting Type | Through Hole |
| Frequency - Switching | 115kHz |
| Package | Tube |
| Series | VIPer™ plus |
| Supplier Device Package | 8-DIP |
| Output Isolation | Isolated |
| Mfr | STMicroelectronics |
| Power (Watts) | 10 W |
| Fault Protection | Current Limiting, Over Temperature, Over Voltage |
| Voltage - Breakdown | 800V |
| Voltage - Supply (Vcc/Vdd) | 8.5V ~ 23.5V |
| Package / Case | 8-DIP (0.300", 7.62mm), 7 Leads |
| Duty Cycle | 70% |
| Operating Temperature | -40°C ~ 150°C (TJ) |
| Internal Switch(s) | Yes |
| Base Product Number | VIPER17 |
| Topology | Flyback |
| Description | IC OFFLINE SWITCH FLYBACK 8DIP |
| Stock | In Stock |
| Shipping Method | LCL, AIR, FCL, Express |
| Payment Terms | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | M2S150 |
| Product Status | Active |
| Peripherals | DDR, PCIe, SERDES |
| Primary Attributes | FPGA - 150K Logic Modules |
| Series | SmartFusion®2 |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 484-FBGA (19x19) |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 484-BFBGA |
| Number of I/O | 273 |
| RAM Size | 64KB |
| Speed | 166MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| Description | IC SOC CORTEX-M3 166MHZ 484FBGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Series | Versal™ Prime |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 1760-BFBGA, FCBGA |
| Number of I/O | 402 |
| RAM Size | - |
| Speed | 400MHz, 1GHz |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| Description | IC VERSALPRIME ACAP FPGA 1760BGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 25K Logic Elements |
| Series | Cyclone® V SE |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 672-UBGA (23x23) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 672-FBGA |
| Number of I/O | MCU - 181, FPGA - 145 |
| RAM Size | 64KB |
| Speed | 925MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 925MHZ 672UBGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | M2S150 |
| Product Status | Active |
| Peripherals | DDR, PCIe, SERDES |
| Primary Attributes | FPGA - 150K Logic Modules |
| Series | SmartFusion®2 |
| Package | Tray |
| Mfr | Microchip Technology |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Connectivity | CANbus, Ethernet, I²C, SPI, UART/USART, USB |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1152-BBGA, FCBGA |
| Number of I/O | 574 |
| RAM Size | 64KB |
| Speed | 166MHz |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| Description | IC SOC CORTEX-M3 166MHZ 1152BGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z030 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 676-FCBGA (27x27) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 676-BBGA, FCBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 800MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 800MHZ 676FCBGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Product Status | Active |
| Peripherals | DDR, DMA, PCIe |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
| Series | Versal™ Prime |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1596-BGA (37.5x37.5) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MPU, FPGA |
| Package / Case | 1596-BFBGA |
| Number of I/O | 532 |
| RAM Size | - |
| Speed | 800MHz, 1.65GHz |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Flash Size | - |
| Description | IC VERSALPRIME ACAP FPGA 1596BGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | 5CSEBA4 |
| Product Status | Active |
| Peripherals | DMA, POR, WDT |
| Primary Attributes | FPGA - 40K Logic Elements |
| Series | Cyclone® V SE |
| Package | Tray |
| Mfr | Intel |
| Supplier Device Package | 484-UBGA (19x19) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 484-FBGA |
| Number of I/O | MCU - 151, FPGA - 66 |
| RAM Size | 64KB |
| Speed | 800MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 800MHZ 484UBGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XCZU19 |
| Product Status | Active |
| Peripherals | DMA, WDT |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 1760-BBGA, FCBGA |
| Number of I/O | 512 |
| RAM Size | 256KB |
| Speed | 500MHz, 600MHz, 1.2GHz |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size | - |
| Description | IC SOC CORTEX-A53 1760FCBGA |
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