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KANG DA ELECTRONICS CO.

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Systems On Chip SoC

Manufacturer of a wide range of products which include MP163CGS-33,MP163AGSE-33,10AS066H4F34I3SG,etc

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MP163CGS-33

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Category Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches
Control Features EN, Soft Start
Product Status Active
Voltage - Start Up 5.3 V
Mounting Type Surface Mount
Frequency - Switching 28kHz
Package Tube
Series -
Supplier Device Package 8-SOIC-7B
Output Isolation Non-Isolated
Mfr Monolithic Power Systems Inc.
Power (Watts) 4 W
Fault Protection Current Limiting, Over Load, Short Circuit
Voltage - Breakdown 700V
Voltage - Supply (Vcc/Vdd) 5.4V ~ 6V
Package / Case 8-SOIC (0.154", 3.90mm Width), 7 Leads
Duty Cycle -
Operating Temperature -40°C ~ 125°C (TJ)
Internal Switch(s) Yes
Base Product Number MP163
Topology Boost, Buck, Buck-Boost, Flyback
Description 700V, NON-ISOLATED, OFFLINE REGU
Model Number MP163CGS-33

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MP163AGSE-33

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Category Integrated Circuits (ICs) Power Management (PMIC) AC DC Converters, Offline Switches
Control Features EN, Soft Start
Product Status Active
Voltage - Start Up 5.3 V
Mounting Type Surface Mount
Frequency - Switching 28kHz
Package Tube
Series -
Supplier Device Package 16-SOIC
Output Isolation Non-Isolated
Mfr Monolithic Power Systems Inc.
Power (Watts) 4 W
Fault Protection Current Limiting, Over Load, Short Circuit
Voltage - Breakdown 700V
Voltage - Supply (Vcc/Vdd) 5.4V ~ 6V
Package / Case 16-SOIC (0.154", 3.90mm Width)
Duty Cycle -
Operating Temperature -40°C ~ 125°C (TJ)
Internal Switch(s) Yes
Base Product Number MP163
Topology Boost, Buck, Buck-Boost, Flyback
Description 700V, NON-ISOLATED, OFFLINE REGU
Model Number MP163AGSE-33

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10AS066H4F34I3SG

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Package / Case : 1152-BBGA, FCBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 660K Logic Elements
Speed : 1.5GHz
Supplier Device Package : 1152-FBGA, FC (35x35)
Flash Size : -
RAM Size : 256kB
Connectivity : EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : -40°C ~ 100°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Product status : Active
Peripherals : DMA, POR, WDT
Series : Arria 10 SX
Manufacturer : Intel
Description IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number 10AS066H4F34I3SG

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71M6533-IGT/F

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Product Category : Systems on a Chip - SoC
Mounting Style : SMD/SMT
ADC Resolution : 22 bit
Package / Case : LQFP-100
Maximum Operating Temperature : + 85 C
Data Bus Width : 8 bit
Core : 80515
Data RAM Size : 4 kB
Operating Supply Voltage : 3.3 V
Program Memory Size : 128 kB
Maximum Clock Frequency : 10 MHz
Manufacturer : Maxim Integrated
Description Metering Systems on a Chip - SoC Precision Energy Meter IC
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number 71M6533-IGT/F

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M2S010TS-1VFG400

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Package / Case : 400-LFBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 10K Logic Modules
Speed : 166MHz
Supplier Device Package : 400-VFBGA (17x17)
Flash Size : 256kB
RAM Size : 64kB
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature : 0°C ~ 85°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Product status : Active
Peripherals : DDR, PCIe, SERDES
Series : SmartFusion®2
Manufacturer : Microchip Technology
Description IC SOC CORTEX-M3 166MHZ 400VFBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number M2S010TS-1VFG400

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Package / Case : 484-BGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 90K Logic Modules
Speed : 166MHz
Supplier Device Package : 484-FPBGA (23x23)
Flash Size : 512KB
RAM Size : 64kB
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature : -55°C ~ 125°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Product status : Active
Peripherals : DDR, PCIe, SERDES
Series : SmartFusion®2
Manufacturer : Microchip Technology
Description IC SOC CORTEX-M3 166MHZ 484FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number M2S090T-1FGG484M

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M2S010TS-1FGG484

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Package / Case : 484-BGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 10K Logic Modules
Speed : 166MHz
Supplier Device Package : 484-FPBGA (23x23)
Flash Size : 256kB
RAM Size : 64kB
Connectivity : CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature : 0°C ~ 85°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : ARM® Cortex®-M3
Product status : Active
Peripherals : DDR, PCIe, SERDES
Series : SmartFusion®2
Manufacturer : Microchip Technology
Description IC SOC CORTEX-M3 166MHZ 484FBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number M2S010TS-1FGG484

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Package / Case : 672-FBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : FPGA - 85K Logic Elements
Speed : 925MHz
Supplier Device Package : 672-UBGA (23x23)
Flash Size : -
RAM Size : 64kB
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : 0°C ~ 85°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Product status : Active
Peripherals : DMA, POR, WDT
Series : Cyclone® V SX
Manufacturer : Intel
Description IC SOC CORTEX-A9 925MHZ 672UBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number 5CSXFC5C6U23C6N

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Package / Case : 900-BBGA, FCBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Speed : 533MHz, 600MHz, 1.3GHz
Supplier Device Package : 900-FCBGA (31x31)
Flash Size : -
RAM Size : 256kB
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : 0°C ~ 100°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Product status : Active
Peripherals : DMA, WDT
Series : Zynq® UltraScale+™ MPSoC EV
Manufacturer : Xilinx Inc
Description IC SOC CORTEX-A53 900FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number XCZU4EV-2FBVB900E

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XCZU7EV-1FFVF1517E

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Package / Case : 1517-BBGA, FCBGA
Product Category : Systems on a Chip - SoC
Primary Attributes : Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Speed : 500MHz, 600MHz, 1.2GHz
Supplier Device Package : 1517-FCBGA (40x40)
Flash Size : -
RAM Size : 256kB
Connectivity : CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature : 0°C ~ 100°C (TJ)
Package : Tray
Architecture : MCU, FPGA
Core Processor : Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Product status : Active
Peripherals : DMA, WDT
Series : Zynq® UltraScale+™ MPSoC EV
Manufacturer : Xilinx Inc
Description IC SOC CORTEX-A53 1517FCBGA
Stock In Stock
Shipping Method LCL, AIR, FCL, Express
Payment Terms L/C, D/A, D/P, T/T, Western Union, MoneyGram
Model Number XCZU7EV-1FFVF1517E

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  • KANG DA ELECTRONICS CO.
  • FLT A 2/F Wang Wah MANS, 59 Texaco Road, Tai Wo Hau, Tsuen Wan, NT, HongKong.
  • https://www.kangdahk.com/

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