Jiangsu GIS Laser Technologies Inc.,
| Line width tolerance | ±10% |
| Board thickness | 0.5~3.5mm |
| Application | PCB、HDI、FPC |
| Applicable process | Solder Mask, Outer |
| Scale mode | White, Black, Yellow, Etc. |
| Laser power | Mixing Wave Total Power 512W |
| Solder bridge/solder opening | 50/75μm（process Condition） |
| Solder Mask Color | Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment |
| Brand Name | GIS |
| Model Number | DPX820SM |
| Place of Origin | Suzhou, China |
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Product Specification
| Line width tolerance | ±10% | Board thickness | 0.5~3.5mm |
| Application | PCB、HDI、FPC | Applicable process | Solder Mask, Outer |
| Scale mode | White, Black, Yellow, Etc. | Laser power | Mixing Wave Total Power 512W |
| Solder bridge/solder opening | 50/75μm（process Condition） | Solder Mask Color | Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment |
| Brand Name | GIS | Model Number | DPX820SM |
| Place of Origin | Suzhou, China | ||
| High Light | Interval Scale LDI PCB ，FPC Printing Laser Direct Imaging ，Partition Alignment LDI PCB | ||
Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging Print Board, Laser Direct Imaging PCB) is a kind of PCB with high-precision processing technology. It is characterized by its effective exposure area of 620x720mm(24"x28.5"), file format support for various formats, solder bridge/solder opening of 50/75μm(process Condition), line width tolerance of ±10%, and board thickness of 0.5~3.5mm. It has excellent performance in terms of accuracy, reliability and cost-effectiveness.
| Parameter | Value |
|---|---|
| Line width tolerance | ±10% |
| Board thickness | 0.5~3.5mm |
| Solder mask ink | 30s@600x500mm (24"×20") |
| Solder Mask Color | Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment |
| Laser power | Mixing Wave Total Power 512W |
| Alignment method | PAD (diameter: 0.5~3.0mm) |
| Application | PCB, HDI, FPC |
| Solder bridge/solder opening | 50/75μm (process Condition) |
| Effective exposure area | 620x720mm (24"x28.5") |
| File format | File Format |
The GIS DPX820SM Laser Direct Imaging PCB is designed to be used in a wide range of applications. It is an ideal choice for high-precision PCB, HDI and FPC printing. This product has a high-precision PAD alignment method (diameter: 0.5~3.0mm) which ensures quick and accurate alignment. The adjustable solder mask color includes fixed scale, auto scale, interval scale and partition alignment. In addition, its board thickness is 0.5~3.5mm, allowing it to be used in various projects. This Laser Direct Imaging PCB offers superior performance with its high-precision printing capabilities and reliable quality.
GIS DPX820SM Laser Direct Imaging Printed Circuit Board is a precision laser direct imaging PCB with alignment accuracy of ±12um. It is applicable for Solder Mask and Outer Process. The solder bridge/solder opening of this PCB is 50/75μm (process condition). The effective exposure area of this board is 620x720mm (24"x28.5"), making it suitable for PCB, HDI and FPC. This Laser Direct Imaging Printed Board is made in Suzhou, China.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Other
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification：
Verified Supplier
Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov... Jiangsu GIS Laser Technologies Inc. (hereafter referred to as GIS Laser) is a subsidiary of GIS Tech Inc. which is a multinational company providing advanced intelligent solutions into the industries of New Energy, Semiconductor Packaging, Lithium Battery, PCB and Printing, with its incredible innov...
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