Laser Direct Imaging PCB with PAD Alignment Method (Diameter 0.5~3.0mm) and

Product Description:

Laser Direct Imaging PCB, also known as Laser Direct Imaging Printed Board, is a PCB technology that uses laser direct imaging technology to ensure the accuracy and consistency of PCB production. It is suitable for Solder Mask and Outer process. The laser direct imaging technology features a Mixing Wave Total Power of 512W and can be used to make PCB, HDI and FPC. The solder bridge and solder opening of PCBs produced by this technology can reach 50/75μm under the process Condition. The alignment accuracy is ±12um.

Features:

• Laser Direct Imaging Printed Circuit Board (PCB): File Format, Effective exposure area (620x720mm/24"x28.5"), Application (PCB, HDI, FPC), Solder Mask Color (Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment), Alignment accuracy (±12um)

Technical Parameters:

Applications:

GIS DPX820SM Laser Direct Imaging Circuit Board is a high-quality, reliable and versatile solution for producing printed circuit boards (PCBs) and high-density interconnects (HDIs). The Laser Direct Imaging Printed Circuit Board is manufactured in Suzhou, China, with a board thickness ranging from 0.5 to 3.5mm. The Laser Direct Imaging PCB is capable of 30s@600x500mm (24"×20") solder mask ink and an effective exposure area of 620x720mm (24"x28.5"). Line width tolerance is ±10% for producing PCBs, HDIs and FPCs (Flexible Printed Circuits).

The GIS DPX820SM Laser Direct Imaging Circuit Board is a cost-effective solution for achieving high-precision imaging results. It is designed to produce highly accurate images with a resolution of up to 600x500 dpi. The Laser Direct Imaging Printed Circuit Board is suitable for applications such as RFID, medical, automotive, aerospace, consumer electronics and other industries.

The GIS DPX820SM Laser Direct Imaging Circuit Board is a powerful and reliable solution for producing PCBs, HDIs and FPCs. It is designed to provide fast, accurate and reliable imaging results with a board thickness ranging from 0.5 to 3.5mm. The Laser Direct Imaging PCB is capable of 30s@600x500mm (24"×20") solder mask ink and an effective exposure area of 620x720mm (24"x28.5"). Line width tolerance is ±10%, making it suitable for producing PCBs, HDIs and FPCs with outstanding accuracy and repeatability.

The GIS DPX820SM Laser Direct Imaging Circuit Board is a reliable and versatile solution for producing PCBs, HDIs and FPCs. The Laser Direct Imaging Printed Circuit Board is manufactured in Suzhou, China, with a board thickness ranging from 0.5 to 3.5mm. The Laser Direct Imaging PCB is capable of 30s@600x500mm (24"×20") solder mask ink and an effective exposure area of 620x720mm (24"x28.5"). Line width tolerance is ±10%, providing high-precision imaging results for PCBs, HDIs and FPCs. The GIS DPX820SM Laser Direct Imaging Circuit Board is suitable for applications such as RFID, medical, automotive, aerospace, consumer electronics and other industries.

Customization:

Our Laser Direct Imaging PCB product, GIS DPX820SM, is a versatile circuit board produced in Suzhou, China. It has a wide range of scale modes, from white, black, yellow, etc. It uses the Mixing Wave Total Power 512W with a board thickness ranging from 0.5~3.5mm and an effective exposure area of 620x720mm(24"x28.5")and PAD(diameter: 0.5~3.0mm) for alignment.

Packing and Shipping:

For the Laser Direct Imaging PCB product, packaging and shipping should include the following steps:

• The product should be wrapped in a protective material, such as bubble wrap, to prevent any damage during shipping.
• The product should then be placed in a box or other suitable container for shipping.
• The box should be securely sealed with tape.
• The box should be labeled with the correct address information.
• The box should then be shipped via a reliable shipping method, such as FedEx or UPS.

FAQ: