5L Volume 316 Stainless Steel Adjustable Power Plasma Surface Treatment

Plasma cleaning is an advanced surface treatment process that removes impurities and contaminants using energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species. The system utilizes gases such as argon, oxygen, and mixtures including air and hydrogen/nitrogen. Plasma generation is achieved through high-frequency voltages (typically kHz to >MHz) to ionize low-pressure gas, with atmospheric pressure plasma systems also available.

This small vacuum plasma cleaning machine employs inductive coupling technology and delivers exceptional performance for insulating microwave tubes and components. It is specifically designed for handling sensitive products requiring high cleanliness standards and is suitable for processing plastic, biochemical materials, PDMS, glass, metal semiconductors, ceramics, composite materials, polymers, and various other materials. The system provides superior surface cleaning, sterilization, wettability enhancement, surface property modification, and improved binding force.

• Before coating: Removes organic residues after centrifugal and ultrasonic cleaning, enhancing subsequent coating technology performance
• After coating: Cleans overflow plating for superior finish quality

• Ideal for small-scale production and scientific research applications
• Compact design with easy operation and maintenance
• Advanced German core plasma technology
• Corrosion-resistant imported 316 stainless steel construction
• Precision flow control with imported needle valve system
• Dual-process reactant gas channels for versatile applications
• Customization available to meet specific requirements

The plasma cleaning system consists of five main components:

• Reaction Chamber: Comprising vacuum chamber and electrodes, providing the plasma reaction space where items are processed
• Vacuum System: Includes vacuum gauge, vacuum pump, and piping to remove air and maintain optimal vacuum levels
• Discharge System: Supplies signal and energy to excite reaction gas ionization, forming required plasma
• Electronic Control System: Controls equipment operation according to optimal process parameters and maintains stability
• Intake Flow Control System: Composed of flow meters and solenoid valves for precise gas flow control and vacuum maintenance

1. Open vacuum chamber door, place items to be processed inside, and close door securely
2. Turn on main power switch and configure parameters via touch screen interface
3. Equipment automatically runs according to set parameters (vacuum → air intake → discharge → empty)
4. Buzzer signals completion; open chamber door and remove processed items

Plasma represents the fourth state of matter, alongside solid, liquid, and gas. This technology utilizes high-energy plasma particles to create physical and chemical reactions on material surfaces, enabling surface activation, etching, decontamination, and modification of surface properties including friction coefficient, adhesion, and hydrophilicity.

Introduces new functional groups including hydrocarbyl, amidogen, and carboxyl, significantly enhancing material surface activity and bonding capabilities.

Removes volatile gaseous substances generated by creating plasma with selected gases and surface materials. This reactive plasma process offers high etching rates and uniformity, with plasma parameters critically influencing etching effectiveness.

• Environmentally friendly alternative to traditional wet cleaning (VOC-free)
• Low operational costs using gas as reaction medium
• Broad application range across diverse materials and substrates
• Simultaneously improves surface properties and adhesion while removing contaminants

Contact angle measurement determines surface wettability: θ<90° indicates hydrophilic surface (smaller angles indicate better wettability), while θ>90° indicates hydrophobic surface.

Dyne value measurement assesses material surface bonding capability, with higher values indicating superior bonding performance for printing, coating, laminating, and welding applications.

Enhances surface bonding properties for improved adhesion and performance.

Removes oxide residue from electronic components, improving bond quality and enhancing connection reliability.

Effectively removes organic contaminants from glass surfaces for superior clarity and performance.

Comprehensive removal of oils and contaminants from metal surfaces for improved finishing and coating adhesion.

Cleaning and modification of graphene and other powder materials for enhanced material properties.

Surface activation for PDMS materials to improve bonding characteristics and material performance.

• Documentation: Complete technical documentation including operation, commissioning, and maintenance manuals with circuit diagrams, gas circuit diagrams, and pipeline diagrams
• Installation Support: Comprehensive site preparation details and installation guidance
• Training: Remote training covering normal operation, repair and maintenance, problem analysis, and emergency procedures
• Technical Support: Ongoing technical assistance, operational training, and warranty documentation with contact information