Ecer asks for your consent to use your personal data to:
Personalised advertising and content, advertising and content measurement, audience research and services development
Store and/or access information on a device
Your personal data will be processed and information from your device (cookies, unique identifiers, and other device data) may be stored by, accessed by and shared with 135 TCF vendor(s) and 65 ad partner(s), or used specifically by this site or app.
Some vendors may process your personal data on the basis of legitimate interest, which you can object to by do not consent. Contact our platform customer service, you can also withdraw your consent.
{"title":"Vacuum Brazed Liquid Cold Plate Heat Exchanger Anodizing for Optical Module","imgUrl":"https:\/\/img.chinax.com\/nimg\/be\/52\/5d5bbc08ff52b166a611eab495c2-200x200-1\/vacuum_brazed_liquid_cold_plate_heat_exchanger_anodizing_for_optical_module_cooling.jpg","attrs":{"Packaging Details":"Bulk","Place of Origin":"Dongguan\uff0cGuangdong,China","Supply Ability":"5000,000,000PCS Per Month","Certification":"UL.VDE,SGS,REACH,CQC,CSA.ISO.ROHS,CUL"}}
{"title":"Automotive Dual Inlet Dual Outlet Liquid Cooling Plate for Optical Module","imgUrl":"https:\/\/img.chinax.com\/nimg\/21\/a5\/e2672401617a053a0b5d8c2ca68e-200x200-1\/automotive_dual_inlet_dual_outlet_liquid_cooling_plate_for_optical_module_cooling.jpg","attrs":{"Texture Of Material":"6061","Surface Finish":"Mill finish or anodization","Bearing":"Alloy Bearing","Noise Level":"25.6 dB(A)"}}
{"title":"High Density Stacked Al Cu Fin Heat Sink Heat Pipe for Server Optical Cooling","imgUrl":"https:\/\/img.chinax.com\/nimg\/1e\/22\/132f706ccc856f5e721ed36a0696-200x200-1\/high_density_stacked_al_cu_fin_heat_sink_heat_pipe_for_server_optical_cooling.jpg","attrs":{"Supply Ability":"50000000pcs per Month","Model Number":"CPU Cooler","Certification":"SMC","Minimum Order Quantity":"100pcs"}}
{"title":"Aluminum Buckle Fin Heat Sink Stacked Active CPU Cooler for Server Optical","imgUrl":"https:\/\/img.chinax.com\/nimg\/81\/e8\/1cec574e8874eaa5583fe4aef31c-200x200-1\/aluminum_buckle_fin_heat_sink_stacked_active_cpu_cooler_for_server_optical.jpg","attrs":{"Product weight":"2.5 kg","Feature":"Good cooling capability and No leakage default","Brand Name":"Uchi","bearing":"Alloy Bearing"}}
{"title":"Micro Channel Liquid Cooling Plate MLCP High Heat Flux Electronic Devices","imgUrl":"https:\/\/img.chinax.com\/nimg\/13\/fc\/315abfc389eb93cd85e366655a3b-200x200-1\/micro_channel_liquid_cooling_plate_mlcp_high_heat_flux_electronic_devices_cooling.jpg","attrs":{"Dimensions":"Customizable (e.g., 100mm x 100mm x 10mm)","Thickness":"7mm","Keyword":"CNC Macining Parts","Brand Name":"Uchi"}}
Vacuum brazed liquid cold plate is a high-performance liquid cooling component manufactured via vacuum brazing technology, mainly used for high-efficiency heat dissipation in high-power-density equipment. By circulating coolant through sealed internal channels to directly remove heat from heat sources, it has become a mainstream solution in high-end thermal management thanks to its core advantages: oxidation-free, high tightness, low deformation, and excellent corrosion resistance.
Core Manufacturing Principle & Process
Vacuum brazing is a welding process performed in a vacuum environment (10⁻³~10⁻⁵ mbar):
Assembly: Precisely stack the base plate with machined flow channels, brazing foil (Al‑Si, Cu‑P, etc.), and cover plate.
Vacuum Heating: Place the assembly into a vacuum furnace, evacuate the air, then heat to the melting point of brazing filler metal (approx. 577℃-600℃), which is lower than the melting point of the base metal (aluminum/copper).
Capillary Filling: The molten brazing filler fills all gaps between the base plate, cover plate, and internal fins via capillary action.
Metallurgical Bonding: Atomic diffusion occurs between liquid brazing filler and base metal; upon cooling, it forms high-strength, high-thermal-conductivity, fully sealed integrated joints.
Cooling & Forming: Slow cooling under vacuum minimizes thermal stress and ensures zero workpiece deformation.
Core Material Options
Aluminum Alloy (6061/6063): Most widely used — high thermal conductivity, lightweight, low cost, and easy to machine.
Copper (C1100/T2): Best thermal performance, ideal for ultra-high heat flux applications such as AI chips and IGBTs.
Stainless Steel / Titanium Alloy: Used for special harsh environments requiring high corrosion and temperature resistance (aerospace, chemical industry).
Strong Sealing & Pressure Resistance: Monolithic structure with zero leakage; typical pressure rating 1-10 MPa.
Extremely Low Thermal Resistance & High Efficiency: Near‑zero welding thermal resistance; combined with microchannels/fins, thermal resistance can reach as low as 0.02℃*cm²/W.
Precise Structure & Minimal Deformation: Uniform overall heating ensures high flatness, suitable for precision electronic components.
High Design Flexibility: Supports complex channels, multi-path layouts, microchannels (0.5 mm), embedded fins, etc.
Long Service Life & High Reliability: Corrosion‑free and loosening‑free; industrial service life exceeds 10 years.
Typical Internal Flow Channel Structures
Single-Layer Grooved Channel: Base plate with machined grooves + cover plate; simple structure for low‑to‑medium power.
Offset / Louvered Folded Fins: Embedded corrugated or serrated fins greatly increase heat exchange area and fluid turbulence; preferred for AI and high-performance computing.
Skived Fin: Fins integrally cut from the base plate, eliminating contact thermal resistance for extremely high thermal conductivity.
Microchannel Structure: 50-150 μm scale channels, heat flux > 350 W/cm², ideal for SiC/GaN power modules.
Main Application Fields
AI & Data Centers: Liquid cooling plates for GPUs (NVIDIA H100/H200, A100, etc.) and server cold plates.
New Energy Vehicles: Power battery pack cold plates, motor control units (MCU), OBC, and IGBT cooling.
Energy Storage & Power Electronics: PCS, SVG, photovoltaic inverters, high-voltage inverters.
Aerospace & Defense: High-reliability cooling for radar, laser equipment, and satellite payloads.
Medical & Lasers: Precision temperature control for CT, MRI, and high-power lasers.
Vacuum Brazing vs. Other Processes
Properties
Vacuum Brazing
Friction Stir Welding (FSW)
TIG Welding
Adhesive / Mechanical Seal
Seal Performance
Excellent (zero leakage)
Good
Fair (prone to leakage)
Poor (aging issues)
Internal Structure
Complex channels / fins
Simple channels
Simple channels
Simple channels
Thermal Resistance
Extremely low
Low
High
Extremely high
Temp./Pressure Res.
High
Medium
Low
Low
Surface Quality
Bright, no oxidation
Average
Weld marks visible
Poor
Cost
Medium‑high
Medium
Low
Low
Summary
Vacuum brazed liquid cold plate represents the gold standard for high-performance thermal management, perfectly balancing thermal conductivity, structural strength, sealing reliability, and design flexibility.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
10000000-20000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
Dongguan Uchi Electronics Co., Ltd. is a professional manufacturer specializing in the R&D, production and sales of water cooling plates and liquid cooling plates, focusing on the thermal dissipation industry.
With sophisticated production technology, precision processing equipmen...
Dongguan Uchi Electronics Co., Ltd. is a professional manufacturer specializing in the R&D, production and sales of water cooling plates and liquid cooling plates, focusing on the thermal dissipation industry.
With sophisticated production technology, precision processing equipmen...
