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{"title":"S19-JPRO Computer Case Water Cooling Plate Manifold Aluminum Radiator Solution","imgUrl":"https:\/\/img.chinax.com\/nimg\/b1\/86\/e9bf5a901300a6818666b5a5a7a2-200x200-1\/s19_jpro_computer_case_water_cooling_plate_manifold_aluminum_radiator_solution.jpg","attrs":{"Material":"Aluminum + copper","Temper":"Polishing","fan life":"50000 Hrs","Water tap":"Outer diameter 9.5mm"}}
{"title":"Copper Aluminum Heat Sink Cold Plate Cooling System Water Thermal Solution","imgUrl":"https:\/\/img.chinax.com\/nimg\/de\/90\/de0a6d3068cd669388345f8ba5bc-200x200-1\/copper_aluminum_heat_sink_cold_plate_cooling_system_water_thermal_solution.jpg","attrs":{"Minimum Order Quantity":"100pcs","Supply Ability":"50000000pcs per Month","Bonding technology":"FSW, pressure pipe","Price":"Negotiable"}}
Folded Fin Heat Sink Copper Cold Plate Superior Thermal Conductivity Solution
Copper Folded Fin Heat Sink for Various Shapes
You can rest assured to buy Copper Folded Fin Heat Sink for Various Shapes from our factory and we will offer you the best after-sale service and timely delivery.
Product Parameters
Material: Copper
Size: 15 × 2.8 × 0.3 CM
Weight: 0.09 kg
Technology: Stamping fin
Feature: Flexible and adjustable
Surface treatment: Passivation
Heat cooling power: 45W
Product Advantages
High density fins heat sink stacked fin heat sink combination heatsink design makes it possible to fabricate large sized densely packed fabfin structures for high power heat sink requirements. Unlimited possibilities as to length, width, height, fin thickness and fin spacing. Swaged process allows a multitude of aluminum fins to be mechanically attached to dual aluminum baseplates at the same time without using any adhesive.
The concept of increasing fin efficiency by sharing fins between two baseplates originated in the one piece hollow extrusion. The standard available line of shapes extends almost every 0.25" in height from 1.00" to 8.00" high at fin spacing of about 0.10", and high aspect ratios could reach 50:1.
Therefore, high density stacked bonded extrusion heatsink will be a smart choice.
Technical Overview
A Copper Folded Fin Heat Sink leverages copper's superior thermal conductivity (≈401 W/m*K vs aluminum's 205 W/m*K) and the folded-fin process's high surface-area density, while being fully customizable into diverse shapes for constrained high-heat applications.
Manufacturing Process & Materials
Material Specifications: Typically pure copper (C11000/C10200, oxygen-free copper for ultra-high conductivity); fin thickness 0.1-0.4 mm, folded into corrugated/zig-zag arrays, then bonded to a copper base via brazing (vacuum/atmospheric), solder reflow, or high-performance thermal epoxy. Base thickness can be independently optimized (3-20 mm common).
Fin & Shape Customization: Fins can be flat-crest, rounded-crest, wavy, lanced-offset, or herringbone; bases can be CNC-machined into complex geometries (holes, cutouts, curves, steps) post-bonding.
Surface Treatments: Nickel plating (corrosion resistance, solderability), black oxide, passivation; avoid anodizing (copper anodization is unstable vs aluminum).
Core Advantages vs Aluminum Folded Fin
Higher Thermal Conductivity & Heat Spreading: Faster heat transfer from source to fin tips, critical for high-heat-flux (≥100 W/cm²) scenarios.
Better Performance at Low Airflow: More effective passive cooling, though forced air still drastically improves efficiency.
Drawback: ~3x heavier than aluminum, higher material and processing costs.
Design & Optimization Tips
Thermal Load & Airflow: Calculate required thermal resistance (Rθja, Rθjc) and match to CFM/LFM; dense folded fins need ≥100 CFM forced air to avoid airflow stagnation.
Fin Pitch & Height: For forced air, 1.0-2.0 mm pitch balances surface area and pressure drop; taller fins (up to 60 mm) improve convection but add weight.
Bonding Quality: Vacuum brazing > solder > epoxy for thermal contact; poor bonds create hotspots—verify with thermal imaging or Rθ measurement.
Weight Budget: Copper's density (8.96 g/cm³) requires careful mass control in aerospace/portable devices; consider copper-fin+aluminum-base hybrid designs.
Applications
Predominantly in high-power electronics: automotive EV inverters, server CPUs/GPUs, 5G base station power amplifiers, industrial IGBT modules, laser diodes, and medical equipment where reliability and thermal performance take priority over cost/weight.
Sourcing & Cost Considerations
MOQ is often 100-500 units for custom shapes; tooling costs rise with complexity (curved/annular > rectangular).
Lead time: 4-8 weeks for design, prototyping, and production runs.
Cost drivers: material price, fin density, bonding method, plating, and custom machining steps.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
10000000-20000000
Employee Number:
50~100
Ecer Certification：
Verified Supplier
Dongguan Uchi Electronics Co., Ltd. is a professional manufacturer specializing in the R&D, production and sales of water cooling plates and liquid cooling plates, focusing on the thermal dissipation industry.
With sophisticated production technology, precision processing equipmen...
Dongguan Uchi Electronics Co., Ltd. is a professional manufacturer specializing in the R&D, production and sales of water cooling plates and liquid cooling plates, focusing on the thermal dissipation industry.
With sophisticated production technology, precision processing equipmen...
