400A To 600A Compatible Liquid Cooling Plate Charging Stack Thermal System

Advanced fully liquid-cooled charging stack system compatible with liquid-cooled guns rated from 400A to 600A, designed for ultra-fast charging terminals. Comprehensive cooling solution comprising liquid-cooled radiators, circulating pumps, make-up pumps, water tanks, sensors, fans, and integrated control systems.

• Liquid-cooled gun compatibility: 400A to 600A
• Heat source power: 1.8KW
• Coolant options: Ethylene glycol solution or silicone oil
• Operating temperature range: -35°C to 55°C
• Input voltage: 24V DC; Input current: ≤10A; Flow rate: 0 to 5L/min
• Communication interface: 485 (Modbus RTU protocol)
• Noise level: ≤60dB
• Ambient conditions: -30°C to 55°C; Humidity: 5% to 90%; Altitude: ≤2000m
• Unit dimensions: 350mm (W) × 180mm (L) × 550mm (H)

Custom internal flow channel design optimized through comprehensive simulation analysis. Our engineering process includes iterative parameter adjustments to achieve optimal thermal and hydraulic performance targets.

Our vacuum brazing process joins aluminum plates using filler metal with lower melting points than the base material, creating extremely strong joints without residual corrosive flux. This high-end technology provides uniform heating, precise temperature control, eliminates post-cleaning requirements, and minimizes part distortion.

High-power liquid cooling systems require heat sinks capable of rapid heat absorption. Leveraging the high specific heat capacity of liquids, our systems transfer large amounts of heat through liquid flow, capable of dissipating heat ranging from several hundred watts to over one kilowatt.

• Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact.
• Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance.
• Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing.
• Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area.

GB200 liquid cooling module, H20 liquid cooling module, optical module liquid cooling module, and other copper cold plates. Compatible with phosphor copper, silver-based, nickel-based and gold-based solders.

LTS siphon radiator, die-cast electronic control liquid cooling box, power supply stamped liquid cooling plate, motor electronic control liquid cooling plate, 6G-3DRVC radiator, and other brazed liquid cooling radiators.

Liquid cooling manifold, DIMM liquid cooling module, and other stainless steel liquid cooling manifolds.

• Lasers and medical equipment
• EV power battery pack cooling
• Power electronics and motor drive devices
• Microwave 5G transmission systems
• Renewable energy systems
• IGBT and Power Semi-Conductor Systems
• Data centers and industrial power applications
• Defense systems and avionics
• Fuel cells and traction systems

We maintain rigorous quality standards with comprehensive testing equipment including:

• 1 Coordinate Measuring Machine
• 1 projector instrument
• 2 water high pressure testing machines
• 4 thermal resistance testing machines
• 2 liquid leakage testing machines

• Prompt response to all inquiries
• Competitive pricing with guaranteed quality
• Efficient production scheduling
• Optimal transportation solutions
• Comprehensive technical support