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High Density Cooling System Aluminum Zipper Fin Heatsink | OEM Server Laptop CPU Cooler
Product Overview
We are a professional thermal solution factory offering OEM/ODM custom high-density aluminum zipper fin heatsinks, specially designed for compact cooling demands of server and laptop CPUs. This zipper fin cooling system adopts precision staked zipper fin technology, which enables ultra-high fin density with ultra-thin fins and narrow fin pitch, maximizing heat exchange area within limited space. Paired with heat pipes for efficient heat spreading, it delivers excellent cooling performance for high-power processors in slim chassis. Both active (with fan) and passive cooling configurations are available, fully customizable to your project requirements.
Key Advantages
✅ Ultra-high density zipper fin structure
Zipper fin technology achieves much higher fin density than conventional extruded, stamped or skived fins. Ultra-thin fins (down to 0.15mm) and narrow pitch maximize heat exchange area in compact space, ideal for high heat flux CPU in slim laptop and 1U/2U servers.
✅ Lightweight aluminum material
High thermal conductivity aluminum alloy, much lighter than copper, perfectly meets the weight-sensitive demand of laptop and rackmount server devices, without compromising cooling performance.
✅ Full flexible customization
Fully customizable fin thickness, fin pitch, fin height, overall dimension, heat pipe layout, fan configuration and mounting brackets. Compatible with various Intel/AMD CPU sockets and specific chassis space constraints. Surface treatment options include black anodizing, clear anodizing to enhance anti-oxidation and radiation cooling.
✅ Minimal interface thermal resistance
Precision interference fit and brazing bonding process between fins, heat pipes and base plate ensures tight contact and low thermal resistance, enabling rapid heat transfer from CPU to the entire fin stack.
✅ In-house one-stop manufacturing service
Own full production line covering fin stamping, zipper fin stacking, heat pipe processing, bonding and surface treatment. Our engineering team provides free CFD thermal simulation, DFM review, rapid prototyping (7-10 days) and mass production support for your OEM projects.
✅ Industrial-grade reliability
Strict dimension inspection, thermal performance testing and aging test. RoHS compliant, stable for 7×24 hours continuous operation in harsh environment.
Process: Zipper fin stacking, heat pipe expansion bonding, vacuum brazing
Fin thickness: 0.15mm–0.5mm (customizable)
Fin pitch: 1.0mm–3.0mm (ultra-high density optional)
Dimension: Fully custom, fit for slim laptop and 1U/2U server space
Cooling type: Active (with PWM fan) / Passive optional
Surface: Black anodizing, clear anodizing, passivation optional
Tolerance: ±0.03mm
Sample lead time: 7–10 working days
Application Scenarios
High-density server CPU cooling, slim laptop processor cooling, mini PC, edge computing devices, industrial embedded systems, 1U/2U rackmount equipment, all-in-one PCs.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
10000000-20000000
Employee Number:
50~100
Ecer Certification:
Verified Supplier
Dongguan Uchi Electronics Co., Ltd. is a professional manufacturer specializing in the R&D, production and sales of water cooling plates and liquid cooling plates, focusing on the thermal dissipation industry.
With sophisticated production technology, precision processing equipmen...
Dongguan Uchi Electronics Co., Ltd. is a professional manufacturer specializing in the R&D, production and sales of water cooling plates and liquid cooling plates, focusing on the thermal dissipation industry.
With sophisticated production technology, precision processing equipmen...