LT CIRCUIT CO.,LTD.
Products
Manufacturer of a wide range of products which include Advanced HDI Any Layer PCBs for Devices Min. Annular Ring 3mil Thickness 0.2mm-6,Customizable HDI Any Layer PCBs with FR-4 Material Minimum Hole Size 0.1mm,100% Electrical Tes...
MOQ:
Price:
| Min. Annular Ring | 3mil |
| Layer Count | Any Layer |
| Material | FR-4 |
| Solder Mask Color | Green, Red, Blue, Black, Yellow, White |
| Silkscreen Color | White, Black, Yellow |
| Min. Finished Hole Size | 0.1mm |
| Lead Time | 2-5 Days |
| Minimum Hole Size | 0.1mm |
MOQ:
Price:
| Layer Count | Any Layer |
| Testing | Flying Probe Test, E-test |
| Min. Annular Ring | 3mil |
| Impedance Control | Yes |
| Solder Mask Color | Green, Red, Blue, Black, Yellow, White |
| Thickness | 0.2mm-6.0mm |
| Copper Weight | 0.5oz-6oz |
| Silkscreen Color | White, Black, Yellow |
MOQ:
Price:
| Impedance Control | +/-10% |
| Misalignment Of Layers | +/- 0.06 |
| Surface Finishing | Gold Plating,HASL Lead Free |
| Key Words | High Density Interconnector |
| Pth Wall | 25um |
| Process | Immersion Gold/sliver |
| Bga | 10MIL |
| Board Layer | 4L |
MOQ:
Price:
| Impedance Control | +/-10% |
| Bga | 10MIL |
| Pth Wall | 25um |
| Blind Vias | Yes |
| Aspect Ratio | 10:1 |
| Process | Immersion Gold/sliver |
| Testing | 100%E-Testing,X-RAY |
| Board Layer | 4L |
MOQ:
Price:
| Test | 100% Electrical Test Prior Shipment |
| Bga | 10MIL |
| Process | Immersion Gold/sliver |
| Testing | 100%E-Testing,X-RAY |
| Impedance Control | +/-10% |
| Min. Bga Pitch | 0.3mm |
| Surface Finishing | Gold Plating,HASL Lead Free |
| Spacing | P1.5 |
MOQ:
Price:
| Blind Vias | Yes |
| Key Words | High Density Interconnector |
| Impedance Control | +/-10% |
| Misalignment Of Layers | +/- 0.06 |
| Spacing | P1.5 |
| Testing | 100%E-Testing,X-RAY |
| Process | Immersion Gold/sliver |
| Bga | 10MIL |
MOQ:
Price:
| Min. Bga Pitch | 0.3mm |
| Impedance Control | +/-10% |
| Pth Wall | 25um |
| Misalignment Of Layers | +/- 0.06 |
| Blind Vias | Yes |
| Process | Immersion Gold/sliver |
| Surface Finishing | Gold Plating,HASL Lead Free |
| Board Layer | 4L |
MOQ:
Price:
| Min Trace | 3/3Mil |
| Pcb Thickness | 1.6mm |
| Min Via | 0.1mm |
| Pcb Type | 8 Layer Multilayer PCB Board |
| Key Words | High Density Interconnector |
| Glass Epoxy | RO4350B Tg280℃, Er<3.48, Rogers Corp |
| Blind And Buried Vias | Available |
| Board Layer | 10L |
MOQ:
Price:
| Blind And Buried Vias | Available |
| Thickness | 0.4-3.2mm |
| Inner Layer Spacing | 0.15mm |
| Min Via | 0.1mm |
| Silk | White |
| Smallest Hole Size | 0.1mm |
| Base Material | S1000-2M |
| Glass Epoxy | RO4350B Tg280℃, Er<3.48, Rogers Corp |
MOQ:
Price:
| Thickness | 0.4-3.2mm |
| Blind And Buried Vias | Available |
| Silk | White |
| Min Via | 0.1mm |
| Surface | Immersion |
| Pcb Thickness | 1.6mm |
| Pcb Type | 8 Layer Multilayer PCB Board |
| Key Words | High Density Interconnector |
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