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China Chips Star Semiconductor Co., Ltd.

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China 3DTLC NAND Embedded Multimedia Card Emmc 64GB EMMC 5.1 Flash Memory Chips
China 3DTLC NAND Embedded Multimedia Card Emmc 64GB EMMC 5.1 Flash Memory Chips

  1. China 3DTLC NAND Embedded Multimedia Card Emmc 64GB EMMC 5.1 Flash Memory Chips

3DTLC NAND Embedded Multimedia Card Emmc 64GB EMMC 5.1 Flash Memory Chips

  1. MOQ: 50
  2. Price:
  3. Get Latest Price
Delivery Time 7~15days
Capacity 8gb/16gb/32gb/64gb/128gb/256gb
Read speed Up to 330MB/s
Agreement HS400
Write speed Up to 240MB/s
Operating temperature -25℃~+85℃
Choice of Flash MLC/3DTLC/QLC NAND
Product Name eMMC5.1
Usage for automotive, industrial, and medical applications.
Brand Name PG
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Delivery Time 7~15days Capacity 8gb/16gb/32gb/64gb/128gb/256gb
Read speed Up to 330MB/s Agreement HS400
Write speed Up to 240MB/s Operating temperature -25℃~+85℃
Choice of Flash MLC/3DTLC/QLC NAND Product Name eMMC5.1
Usage for automotive, industrial, and medical applications. Brand Name PG
Place of Origin China
High Light EMMC 5.1 Flash Memory Chips3DTLC NAND Embedded Multimedia CardEmbedded Multimedia Card Emmc 64GB
 64GB EMMC 5.1 Nand Flash Memory Chips Integrated Circuits
  

   

  High density BGA packaged single-chip storage products integrate flash controllers, FLASH chips, and other components into one, with a storage capacity of up to 1TB, high capacity and performance density Widely used in miniaturization scenarios such as handheld terminals and embedded motherboards.

                                       

 
                                   
                                   
                              
 
 
 
CA EMMC5.1 Specification
Model G2564GTLCA G25128TLCA G25256TLCA G25512TLCA
NAND Flash 3DTLC NAND 3DTLC NAND 3DTLC NAND 3DTLC NAND
Capacity 64GB 128GB 256GB 512GB
CE 1 2 4 4
Read Speed up to 330MB/s up to 330MB/s up to 330MB/s up to 330MB/s
Write Speed up to 240MB/s up to 240MB/s up to 240MB/s up to 240MB/s
Operating Temperature
-25℃~85℃
-25℃~85℃
-25℃~85℃
-25℃~85℃
EP ≥3000 ≥3000 ≥3000 ≥3000
Packaging Specification BGA 153 BGA 153 BGA 153 BGA 153
Size 11.5mmx13mmx1.0mm 11.5mmx13mmx1.0mm 11.5mmx13mmx1.2mm 11.5mmx13mmx1.2mm

 

 

WHY CHOOSE US?
1. Strong research and development strength
2. Our factory has advanced packaging and testing technology
3. Complete storage product production line
4. Operating our own brand PG focuses on the storage semiconductor field
5. Possess multiple copyright patents
6. High cost-effectiveness, and competitiveness
7. Focus on IC field for more than serval years

 
 
 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Seller

  • Year Established:

    2019

  • Total Annual:

    5000000-8000000

  • Employee Number:

    80~100

  • Ecer Certification:

    Verified Supplier

China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...

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Get in touch with us

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  • China Chips Star Semiconductor Co., Ltd.
  • Room 401-404, Unit 1, Building B, Building 8, Huaqiang Creative Industrial Park, Biyan Community, Guangming Street, Guangming Dist.
  • https://www.memories-cards.com/

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