| Delivery Time | 7~15days |
| Capacity | 8gb/16gb/32gb/64gb/128gb/256gb |
| Read speed | Up to 330MB/s |
| Agreement | HS400 |
| Write speed | Up to 240MB/s |
| Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND |
| Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. |
| Brand Name | PG |
| Place of Origin | China |
View Detail Information
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Product Specification
| Delivery Time | 7~15days | Capacity | 8gb/16gb/32gb/64gb/128gb/256gb |
| Read speed | Up to 330MB/s | Agreement | HS400 |
| Write speed | Up to 240MB/s | Operating temperature | -25℃~+85℃ |
| Choice of Flash | MLC/3DTLC/QLC NAND | Product Name | eMMC5.1 |
| Usage | for automotive, industrial, and medical applications. | Brand Name | PG |
| Place of Origin | China | ||
| High Light | EMMC 5.1 Flash Memory Chips ,3DTLC NAND Embedded Multimedia Card ,Embedded Multimedia Card Emmc 64GB | ||
High density BGA packaged single-chip storage products integrate flash controllers, FLASH chips, and other components into one, with a storage capacity of up to 1TB, high capacity and performance density Widely used in miniaturization scenarios such as handheld terminals and embedded motherboards.
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| Model | G2564GTLCA | G25128TLCA | G25256TLCA | G25512TLCA |
| NAND Flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read Speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write Speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating Temperature | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ | -25℃~85℃ |
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging Specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Total Annual:
5000000-8000000
Employee Number:
80~100
Ecer Certification:
Verified Supplier
China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...
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