| Payment Terms | L/C, T/T |
| Supply Ability | 100K a month |
| Delivery Time | 2 to 5 days |
| Capacity | 8GB to 256GB |
| Orign | China |
| Read speed | Up to 330MB/s |
| Write speed | Up to 240MB/s |
| Operating temperature | -40℃~+85℃ / -45℃~+105℃ |
| Choice of Flash | MLC / 3D TLC / QLC NAND |
| Interface | eMMC5.1 |
| Agreement | HS400 |
| Warranty | 1 years |
| Color | Black |
| Brand Name | PG |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | L/C, T/T | Supply Ability | 100K a month |
| Delivery Time | 2 to 5 days | Capacity | 8GB to 256GB |
| Orign | China | Read speed | Up to 330MB/s |
| Write speed | Up to 240MB/s | Operating temperature | -40℃~+85℃ / -45℃~+105℃ |
| Choice of Flash | MLC / 3D TLC / QLC NAND | Interface | eMMC5.1 |
| Agreement | HS400 | Warranty | 1 years |
| Color | Black | Brand Name | PG |
| Place of Origin | China | ||
| High Light | 64GB EMMC5.1 ,128GB EMMC5.1 ,BGA153 eMMC Memory Chip | ||
Designed to operate under harsh conditions, with robust construction that ensures long-lasting performance, reducing the risk of data loss.
Capable of functioning in extreme temperatures (typically -40°C to +85°C), making it suitable for outdoor and industrial applications.
Many industrial-grade eMMC solutions include features that safeguard against data corruption during sudden power loss, ensuring reliable data preservation.
Integrated into a small form factor, allowing for efficient use of space in embedded systems and devices.
Designed to be energy-efficient, making it ideal for battery-powered devices and applications where power conservation is critical.
Compatible with a variety of embedded systems, facilitating straightforward integration into existing designs.
Often meets or exceeds relevant industry certifications, ensuring suitability for regulated applications in sectors like automotive, medical, and telecommunications.
While industrial-grade eMMC may come at a higher initial cost than consumer-grade options, its durability and reliability can lead to lower total cost of ownership in high-volume, long-term applications.
| Model | G2564GTLIA | G25128TLIA | G25256TLIA | G25512TLIA |
| NAND flash | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND | 3DTLC NAND |
| Capacity | 64GB | 128GB | 256GB | 512GB |
| CE | 1 | 2 | 4 | 4 |
| Read speed | up to 330MB/s | up to 330MB/s | up to 330MB/s | up to 330MB/s |
| Write speed | up to 240MB/s | up to 240MB/s | up to 240MB/s | up to 240MB/s |
| Operating temperature | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ | -40℃~85℃/-45℃~105℃ |
| EP | ≥3000 | ≥3000 | ≥3000 | ≥3000 |
| Packaging specification | BGA 153 | BGA 153 | BGA 153 | BGA 153 |
| Size | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.0mm | 11.5mmx13mmx1.2mm | 11.5mmx13mmx1.2mm |
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2019
Total Annual:
5000000-8000000
Employee Number:
80~100
Ecer Certification:
Verified Supplier
China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico... China Chips Star Semiconductor Co ., Ltd. was established in 2019, headquartered in Shenzhen, with branches in Hong Kong (for internationalization) and Nanjing (for operators). It is a comprehensive enterprise integrating the research and development, packaging, testing, sales, and service of semico...
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