Automated Epoxy Dispenser for Automotive Electronics — Supports Up to 500,000

Product Specification

Product Overview

This automated epoxy dispenser is designed for reliable, repeatable application of adhesives and epoxies in automotive electronics. It supports high‑viscosity materials (up to 500,000 cps), offers precise volume control for dots and beads, and integrates with robots and conveyors for inline production. The system reduces rework by delivering consistent deposits, simplifies maintenance with quick‑change heads, and supports dispensing program storage for repeat jobs.

Problem 

Automotive assembly fails when epoxy deposits vary in volume or placement, causing weak bonds, poor sealing, or electrical failure.

Cause 

Thick epoxies require strong metering and stable feed; pumps or valves not matched to viscosity cause pulsation, nozzle clogging. Variations in temperature, pressure or drive timing lead to inconsistent deposits and extra cleaning downtime.

Solution 

This dispenser uses positive displacement metering, heated or unheated feed options and robust wetted parts to keep flow steady with very viscous materials. Drive and timing are adjustable to deliver precise per‑shot volume or continuous beads. Quick purge, easy nozzle access and spare part kits minimize downtime during long runs.

Technical Specifications

Application

• Cell and module bonding in automotive electronics (inverters, ECUs, sensors).
• FPC and connector potting where high viscosity gap filling is needed.
• Gap filling and structural bonding for power electronics and motor controllers.
• Pilot and production lines requiring high viscosity handling and repeatable deposits.

How It Works 

The chosen metering head (auger, eccentric screw or timed valve) meters material by positive displacement or timed pulses. For high viscosity, an auger or screw drive moves material steadily to the nozzle; heated options lower viscosity if allowed by the epoxy. Motor speed and pulse timing set deposit volume; a stable feed source (pressure pot or bulk feed) keeps supply steady. The control stores recipes with drive, pulse and motion settings for repeatability.

How To Choose

1. Provide your epoxy viscosity at working temperature and target deposit size (µL or nL) so we can recommend head type.
2. State required throughput (shots per min or mL/min) and part pitch to size motion and head frequency.
3. Choose heated supply if material needs temperature to reach workable viscosity.
4. Confirm mounting and interface needs (robot flange, conveyor, PLC signals).
5. Request a bench test with your material to validate nozzle life, metering accuracy and purge schedule.

FAQ

Q1: Can the system handle abrasive or filled epoxies?
A1: Yes. Specify ceramic or coated wetted parts and plan spare nozzle/screw parts. We recommend a bench wear test for abrasive fillers.

Q2: Do you support heated dispensing for high viscosity materials?
A2: Yes. Heated head and heated supply options are available; provide the epoxy temperature limits so we can configure heating safely.

Q3: What is the smallest deposit achievable?
A3: Minimum deposit depends on head: micro‑jet heads can reach nL drops, while auger/screw heads handle µL to mL. Tell us target volume and we will recommend the head.

Q4: How is the system integrated into a production line?
A4: The unit provides PLC/robot I/O, a compact flange for robot mounting and recipe transfer functions for synchronized line operation.

Q5: Do you provide sample testing and integration support?
A5: Yes. Send epoxy samples and part drawings; we run bench tests, record logs and recommend nozzle, head and settings for production.