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Changzhou Mingseal Robot Technology Co., Ltd.

  • China,Changzhou ,Jiangsu
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China Dual Track BGA Glue Dispensing Machine Chip Underfill Visual Dispensing Machine
China Dual Track BGA Glue Dispensing Machine Chip Underfill Visual Dispensing Machine

  1. China Dual Track BGA Glue Dispensing Machine Chip Underfill Visual Dispensing Machine
  2. China Dual Track BGA Glue Dispensing Machine Chip Underfill Visual Dispensing Machine

Dual Track BGA Glue Dispensing Machine Chip Underfill Visual Dispensing Machine

  1. MOQ: 1
  2. Price: $28000-$150000 / pcs
  3. Get Latest Price
Payment Terms L/C,D/A,D/P,T/T,Western Union
Supply Ability 30-40 sets per month
Delivery Time 5-60 Days
Packaging Details Wooden Case
Dimensions 770×1200×1450mm
Voltage 110V/220V
Warranty 1 Year
Brand Name Mingseal
Model Number FS600A
Certification ISO CE
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms L/C,D/A,D/P,T/T,Western Union Supply Ability 30-40 sets per month
Delivery Time 5-60 Days Packaging Details Wooden Case
Dimensions 770×1200×1450mm Voltage 110V/220V
Warranty 1 Year Brand Name Mingseal
Model Number FS600A Certification ISO CE
Place of Origin China
High Light Dual Track glue dispensing machineBGA glue dispensing machine220V Visual Dispensing Machine

Inline Dual-Track Visual Dispensing Machine for Chip Underfill

 

The FS600 Series Inline Visual Dispensing Machine is an advanced high-efficiency dispensing solution engineered for chip underfill and electronic component assembly. Tailored to meet the rigorous precision and productivity demands of modern semiconductor packaging lines, this system integrates dual-track dual-station operation, enabling continuous inline dispensing on both boats simultaneously. Compared with single-track designs, this parallel production significantly boosts UPH and reduces idle time between workpieces.

Equipped with industry-leading features such as bottom heating, re-circulating dispensing, inline weight measurement, and an optional vacuum adsorption platform, the FS600 ensures excellent adhesive flow, stable dot size, and consistent bonding quality—even for tiny gap underfill and delicate components.

 

 

Core Advantages

  • Dual-Track, Dual-Station Inline Design: Enables true parallel dispensing for high-volume SMT & chip underfill lines.
  • Process Flexibility with Multiple Add-Ons: Optional bottom heating module ensures better adhesive wetting and flow for tight underfill gaps. 
  • Smart Visual Alignment: Positioning is auto-corrected in real time.
  • High-Speed, Stable Production for Multiple Components: Ideal for microchips, BGA, CSP underfill, SMD bonding, and fine-pitch component reinforcement in SMT assembly lines.

 

Typical Applications

 

✔ Chip Underfill (BGA, CSP, Flip-Chip)
✔ SMD & Passive Component Bonding
✔ Micro-electronic module reinforcement
✔ PCB corner bonding & edge sealing
✔ Inline glue dot weight measurement and process monitoring
✔ Delicate substrate handling with vacuum adsorption

 

 

Technical Specifications

 
 

FS600A Online Visual Dispensing Machine

Dimensions (W×D×H)

(W/O loading&unloading)

770×1200×1450mm

Dispensing Range (W×D)

(W/O loading&unloading)

400×520mm

Repeatability (3 sigma)

X/Y±0.01mm Z±0.015mm

Positioning Accuracy (3 sigma)

X/Y±0.015mm Z±0.025mm

Max. Speed

X/Y 1300mm/s Z 500mm/s

Max. Acceleration

X/Y 1.3g Z 0.5g

Max. Convey Speed

300mm/s

Max. Carrier Load

3kg

Max. Carrier Plate Thickness

10mm

Min. Edge Clearance

3mm

Max. Material Length

280mm

Max. Material Width

180mm

Max. Material Height

180mm

 
 
 

FAQ

 

Q1: What’s the advantage of dual-track, dual-station design?
A: Both boats can dispense independently at the same time, maximizing productivity and allowing different batches or recipes to run without downtime.

 

Q2: How does bottom heating improve underfill results?
A: Bottom heating keeps the board warm, lowering adhesive viscosity so the underfill can flow more easily into narrow chip gaps, reducing voids and improving bonding.

 

Q3: Why is inline weighing important?
A: Inline weighing continuously measures the actual glue output and automatically adjusts dispensing volume to stay within tight tolerances—helping you achieve zero-defect standards.

 

Q4: What if my boards are thin and easy to shift?
A: The vacuum adsorption module firmly holds the substrate flat and stable during high-speed dispensing, preventing micro-movement that could misalign the glue path.

 

 

About Mingseal

 

Mingseal is an industry leader specializing in precision dispensing solutions for semiconductor packaging, SMT assembly, MEMS, and advanced electronics manufacturing. With a full portfolio ranging from compact desktop systems to high-speed inline lines, we help factories worldwide achieve stable production, tight process control, and smart factory integration. Contact us to learn how our FS600 Series can drive your production to the next level.

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2008

  • Total Annual:

    10000000-50000000

  • Employee Number:

    500~600

  • Ecer Certification:

    Verified Supplier

Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog... Established in 2008, Changzhou Mingseal Robot Technology Co., Ltd. (hereinafter referred to as “Mingseal Technology”) is a technology-driven high-end equipment manufacturing enterprise committed to providing connection and assembly equipment, key core components, and customized technolog...

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  • Changzhou Mingseal Robot Technology Co., Ltd.
  • Mingseal intelligent Manufacturing Center Building, No. 18-98 Middle changwu Road, wujin District, Changzhou,Jiangsu, China
  • https://www.mingsealdispenser.com/

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