Dongguan Xingqiang Circuit Board Technology Co., Ltd.
| Place Of Origin | China |
| Packaging Details | Packed As Per Customer |
| Payment Terms | ,T/T,Western Union |
| Supply Ability | 100000㎡/Month |
| Delivery Time | NA |
| Product Name | High Density Interconnect PCB |
| Minimum Line Space | 3mil (0.075mm) |
| Substrate | High Tg FR-4 |
| PCB Layers | 2/4/6/8/10L |
| PCBA Customization | Suppport |
| Surface Finishing | OSP/ENIG/ENEPIG |
| PCB Standard | IPC-A-610 E Class II |
| SMT | SMD, BGA, DIP, Etc. |
| Quotation Info | Gerber or BOM List |
| Board Thinkness | 1.2/1.6/1.0/0.8mm or Customized |
| Brand Name | Xingqiang |
| Model Number | As Per Customer's Model |
| Certification | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
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Product Specification
| Place Of Origin | China | Packaging Details | Packed As Per Customer |
| Payment Terms | ,T/T,Western Union | Supply Ability | 100000㎡/Month |
| Delivery Time | NA | Product Name | High Density Interconnect PCB |
| Minimum Line Space | 3mil (0.075mm) | Substrate | High Tg FR-4 |
| PCB Layers | 2/4/6/8/10L | PCBA Customization | Suppport |
| Surface Finishing | OSP/ENIG/ENEPIG | PCB Standard | IPC-A-610 E Class II |
| SMT | SMD, BGA, DIP, Etc. | Quotation Info | Gerber or BOM List |
| Board Thinkness | 1.2/1.6/1.0/0.8mm or Customized | Brand Name | Xingqiang |
| Model Number | As Per Customer's Model | Certification | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| High Light | HDI PCB with miniaturized layouts ，High Density Interconnect PCB for electrical connections ，HDI printed circuit board with compact design | ||
This product incorporates Microvias, Blind Vias, and Buried Vias, ensuring efficient and precise interconnections within the multilayer structure. These via types play a crucial role in enhancing the overall functionality and reliability of the board by minimizing signal loss and crosstalk, which are critical factors in high-speed and high-frequency circuits.
The High Density Interconnect PCB is manufactured using high-quality FR4 material, renowned for its excellent mechanical strength, thermal stability, and electrical insulation properties. FR4 is a widely accepted standard in the printed circuit board industry, making this High Density Interconnection Board not only durable but also cost-effective. The choice of material ensures that the board can withstand harsh environmental conditions while maintaining optimal performance, making it suitable for applications in telecommunications, aerospace, medical devices, and consumer electronics.
| Feature Category | Key Characteristics (HDI PCB) |
|---|---|
| Design & Structure | Microvias, high layer count integration, dense component placement, thin substrate |
| Performance | Low signal loss, high-speed transmission support, excellent thermal conductivity, stable impedance |
| Manufacturing Process | Laser drilling, sequential lamination, precise registration control, advanced plating tech |
| Application Advantages | Miniaturization enablement, weight reduction, enhanced reliability for compact electronics |
| Technical Specifications | Fine line width/spacing (≤3mil/3mil), microvia diameter (≤0.15mm), high aspect ratio capability |
Company Details
Business Type:
Manufacturer
Year Established:
1995
Total Annual:
80000000-84000000
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le...
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