| Place Of Origin | China |
| Packaging Details | Packed As Per Customer |
| Payment Terms | ,T/T,Western Union |
| Supply Ability | 100000㎡/Month |
| Delivery Time | NA |
| Productname | High Density Interconnect PCB |
| Layers | 1-30 |
| Min.hole Size | 0.1mm |
| Material | High Tg FR-4 |
| Board Thinkness | 0.2-5.0mm |
| Minimum Trace Width | 3 Mils (0.075 Mm) |
| Minimum Line Space | 3mil (0.075mm) |
| Surface Finishing | OSP/ENIG/ENEPIG |
| Quotation Requirement | Gerber Files or BOM List |
| Solder Mask | Green,Red,Blue,White,Black,Yellow |
| Brand Name | Xingqiang |
| Model Number | As Per Customer's Model |
| Certification | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
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Product Specification
| Place Of Origin | China | Packaging Details | Packed As Per Customer |
| Payment Terms | ,T/T,Western Union | Supply Ability | 100000㎡/Month |
| Delivery Time | NA | Productname | High Density Interconnect PCB |
| Layers | 1-30 | Min.hole Size | 0.1mm |
| Material | High Tg FR-4 | Board Thinkness | 0.2-5.0mm |
| Minimum Trace Width | 3 Mils (0.075 Mm) | Minimum Line Space | 3mil (0.075mm) |
| Surface Finishing | OSP/ENIG/ENEPIG | Quotation Requirement | Gerber Files or BOM List |
| Solder Mask | Green,Red,Blue,White,Black,Yellow | Brand Name | Xingqiang |
| Model Number | As Per Customer's Model | Certification | ISO 9001 / RoHS /UL / IATF 16949 (automotive) |
| High Light | HDI PCB for signal integrity ,Low EMI printed circuit board ,High density interconnect PCB with warranty | ||
An HDI PCB (High-Density Interconnector Printed Circuit Board) is a circuit board with a significantly higher wiring density per unit area compared to conventional PCBs. It achieves this density by utilizing microvias (tiny, often laser-drilled holes), blind and buried vias, and finer lines and spaces. HDI technology is fundamental for miniaturizing modern electronic devices, such as smartphones, tablets, and high-end medical equipment, enabling complex circuitry and enhanced electrical performance within a smaller, lighter form factor.
| Advantage | Core Benefit | Enabling Technology |
|---|---|---|
| Miniaturization | Reduces board size and product weight | Finer Lines/Spaces and smaller pads |
| Electrical Performance | Improves signal quality for high-speed operation | Short Microvias (Blind/Buried Vias) |
| Design Flexibility | Allows for dense component placement and complex routing | Sequential Build-up (SBU) process |
| Reliability | Higher durability under thermal stress | Shallow Microvias reduce mechanical stress |
Company Details
Business Type:
Manufacturer
Year Established:
1995
Total Annual:
80000000-84000000
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le...
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