OEM High Density Printed Circuit Board PCB HASL/ENIG/OSP Surface Treatment

MOQ： Sample,1 pc(5 square meters)
Price： NA
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Place Of Origin	China
Payment Terms	T/T,Western Union
Supply Ability	3000㎡
Delivery Time	15-16 work days
Board Thickness	0.2-5mm
Min. Hole Size	0.1mm
Layer Count	1-30
Min. Line Width/Spacing	0.075mm/0.075mm
Thickness	1.2mm/1.6mm/1.0mm/0.8mm
Surface Finish	HASL, ENIG, OSP
Material	FR4
Quotation request	Gerber Files,BOM List
Brand Name	High Density PCB
Model Number	Varies by goods condition
Certification	ROHS, CE

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Product Details
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Product Specification


Place Of Origin	China	Payment Terms	T/T,Western Union
Supply Ability	3000㎡	Delivery Time	15-16 work days
Board Thickness	0.2-5mm	Min. Hole Size	0.1mm
Layer Count	1-30	Min. Line Width/Spacing	0.075mm/0.075mm
Thickness	1.2mm/1.6mm/1.0mm/0.8mm	Surface Finish	HASL, ENIG, OSP
Material	FR4	Quotation request	Gerber Files,BOM List
Brand Name	High Density PCB	Model Number	Varies by goods condition
Certification	ROHS, CE
High Light	1.2mm High Density Printed Circuit Board ，12 Layers High Density Circuit Board ，ENIG Surface High Density Circuit Board

Product Description:

HD PCB (High Density PCB) is an advanced type of printed circuit board designed for high component density, miniaturization, and high-performance electronic devices.Compared to traditional PCBs, it features ultra-fine copper traces (line widths/spacings usually ≤ 0.1mm, even down to 0.03mm), tiny microvias (diameter ≤ 0.15mm, in blind/buried/stacked designs), and more layers (often 8–40+ layers). It also uses specialized materials (e.g., high-heat-resistant high-Tg FR-4, flexible polyimide) and strict manufacturing precision to support dense component mounting (e.g., fine-pitch chips).Widely used in smartphones, wearables, EVs, medical implants, and 5G equipment, it enables smaller device sizes, stable high-speed signal transmission, and reliable operation in harsh environments.

Advantages :

1. Enables device miniaturization: Ultra-fine traces, microvias, and multi-layer designs let more components fit in small spaces, supporting slim/portable devices (e.g., smartwatches, thin smartphones).
2. Boosts signal performance: Low-loss materials and short microvia paths reduce signal interference and weakening, critical for high-speed/high-frequency devices (e.g., 5G modems, LiDAR).
3. Enhances reliability: Fewer connectors (replacing multiple traditional PCBs) and harsh-environment-resistant substrates (e.g., high-Tg FR-4) lower failure risks, suitable for autos/aerospace.
4. Frees up design flexibility: Supports flexible structures (foldable phones) and stacked components (e.g., memory on CPU), easing integration of complex functions.
5. Cuts long-term costs: Though upfront manufacturing is pricier, smaller device size, fewer assembly steps, and less maintenance reduce overall expenses.

How is the manufacturing process of HDPCB?
1.Substrate & Pre-treatment: Traditional PCBs use low-cost standard FR-4 (low Tg); HDPCBs adopt high-performance materials (high-Tg FR-4, polyimide, PTFE) with pre-treatment (e.g., plasma cleaning) for better adhesion and environmental resistance.
2. Trace Patterning: Traditional PCBs use standard photolithography for ≥0.15mm traces; HDPCBs rely on high-resolution laser direct imaging (LDI) to make ≤0.03mm fine traces, with thinner copper layers (0.5–1 oz) and precise micro-etching.
3. Via Drilling: Traditional PCBs use mechanical drilling for ≥0.2mm through-holes; HDPCBs use laser drilling to create ≤0.15mm microvias (blind/buried/stacked), saving space.
4. Layer Lamination: Traditional PCBs laminate 2–4 layers with loose alignment (≥0.05mm); HDPCBs bond 8–40+ layers via high-precision alignment (≤0.01mm) and controlled heat/pressure to avoid warping.
5. Component Mounting: Traditional PCBs use through-hole mounting or standard SMT (≥0.8mm pitch); HDPCBs use fine-pitch SMT (≤0.5mm pitch) with high-accuracy placement machines, plus nitrogen reflow to prevent solder defects.
6. QC: Traditional PCBs use basic AOI; HDPCBs add 3D AOI, X-ray inspection (for microvias), and signal integrity testing to detect tiny defects.

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

Graphite Plugged Bushings

from Quality China Factory



Business Type:

Manufacturer,Trading Company 


Year Established:

1995 


Total Annual:

84,094,800-84,094,800


Employee Number:

500~800 


Ecer Certification：

Verified Supplier 

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le...

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Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
https://www.multilayer-pcbs.com/

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