Ecer asks for your consent to use your personal data to:
Personalised advertising and content, advertising and content measurement, audience research and services development
Store and/or access information on a device
Your personal data will be processed and information from your device (cookies, unique identifiers, and other device data) may be stored by, accessed by and shared with 135 TCF vendor(s) and 65 ad partner(s), or used specifically by this site or app.
Some vendors may process your personal data on the basis of legitimate interest, which you can object to by do not consent. Contact our platform customer service, you can also withdraw your consent.
High-Density Interconnect (HDI) PCBs utilize advanced printed circuit board (PCB) manufacturing technology to achieve higher wiring density, smaller size, and enhanced functional integration. By utilizing microvias, blind vias, buried vias, and more sophisticated circuit designs, HDI significantly improves circuit connectivity per unit area and is widely used in modern electronic devices with extremely high space, performance, and reliability requirements.
HDI PCB Features:
High-density interconnection
Micro via
Blind and buried hole design
Multi-level design
Fine lines and fine pitch
Excellent electrical performance
Highly integrated
Manufacturing process:
Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
Multilayer wiring: HDI PCBs typically employ a multilayer design, connecting different circuit layers through blind and buried vias. Interconnection each layer is achieved through microvias, blind vias, or buried vias, which enhances the density and integration of the circuit board.
Blind and buried via design: Blind vias are holes that connect only the outer and inner layers, while buried vias are holes that connect the inner layers. The use of these holes can further reduce the volume of the circuit board and increase the wiring density.
Surface treatment and assembly: The surface treatment of HDI PCBs requires higher precision and reliability. Common surface treatments include HASL, OSP ,ENIG(Organic Metal Surface Treatment), etc. In addition, the assembly process of HDI PCBs usually requires fine welding technology to ensure the close connection between and the circuit board.
High-precision process: In the manufacturing process of HDI PCB, high-precision etching technology is required to ensure the correct manufacturing of fine lines precision holes. At the same time, it is necessary to precisely control variables such as current density, temperature, and pressure to ensure the consistency and high performance.
Factory showcase
PCB Quality Testing
Certificates and Honors
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Trading Company
Year Established:
1995
Total Annual:
84,094,800-84,094,800
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
As a professional supplier of customized boards, we work closely with our clients, le... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
As a professional supplier of customized boards, we work closely with our clients, le...
