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{"title":"FR4 Material HDI Multilayer PCB High Density Interconnect PCB Board 600X100mm","imgUrl":"https:\/\/img.chinax.com\/nimg\/5e\/13\/0ced51e806c21d57f7c92820fb66-200x200-1\/fr4_material_hdi_multilayer_pcb_high_density_interconnect_pcb_board_600x100mm.jpg","attrs":{"Brand Name":"High Density PCB","Place Of Origin":"China","Model Number":"Varies by goods condition","Certification":"ROHS, CE"}}
{"title":"12 Layers Sinking Gold High Density PCB HD Design for Electrionic Devices","imgUrl":"https:\/\/img.chinax.com\/nimg\/4a\/e4\/207e392556988bb16f4ae2a2e21d-200x200-1\/12_layers_sinking_gold_high_density_pcb_hd_design_for_electrionic_devices.jpg","attrs":{"Brand Name":"High Density PCB","Place Of Origin":"China","Model Number":"Varies by goods condition","Certification":"ROHS, CE"}}
{"title":"HD 12 Layer PCB Board High Density Circuit Board 1.2mm Thickness Customized Size","imgUrl":"https:\/\/img.chinax.com\/nimg\/83\/45\/da71accb5ecb3ae0a7eddf9e5788-200x200-1\/hd_12_layer_pcb_board_high_density_circuit_board_1_2mm_thickness_customized_size.jpg","attrs":{"Brand Name":"High Density PCB","Place Of Origin":"China","Model Number":"Varies by goods condition","Certification":"ROHS, CE"}}
{"title":"OEM 1.2mm High Density Printed Circuit Board PCB 12 Layers HASL ENIG OSP Surface","imgUrl":"https:\/\/img.chinax.com\/nimg\/26\/a8\/82f514ec8e74ab8f4f7725abfe83-200x200-1\/oem_1_2mm_high_density_printed_circuit_board_pcb_12_layers_hasl_enig_osp_surface.jpg","attrs":{"Brand Name":"High Density PCB","Place Of Origin":"China","Model Number":"Varies by goods condition","Certification":"ROHS, CE"}}
{"title":"Multi Layer Structure High Density PCB Board 8 Layer HD PCB For Precise","imgUrl":"https:\/\/img.chinax.com\/nimg\/90\/98\/fad05bdd98c6172515bb664ae4fa-200x200-1\/multi_layer_structure_high_density_pcb_board_8_layer_hd_pcb_for_precise_communication.jpg","attrs":{"Brand Name":"High Density PCB","Place Of Origin":"China","Model Number":"Varies by goods condition","Certification":"ROHS, CE"}}
High-density PCB refers to a printed circuit board with higher circuit density, smaller aperture and thinner lines. Compared with traditional PCBs, high-density PCB designs enable more circuit connections in the same space, adapting to the needs of miniaturized, high-performance electronic products. High-density PCB can achieve higher integration and higher functional density by using technologies such as micro-holes, fine lines, and multi-layer structures.
Advantages of Miniaturization design PCB:
Miniaturization design
Improve the circuit integration
Better electrical performance
Improve signal integrity
Reduce costs
Product Features:
High circuit density
Fine line design
Micro via and blind via technology
Multi-level design
Higher electrical performance
Compact size
Manufacturing process:
Microvia technology: One of the key technologies of HDI PCB is microvia technology, which uses laser or mechanical drilling to create tiny holes (gener less than 0.2mm) on the circuit board, and these microvias are used to achieve connections between layers.
Blind and buried via design: Blind vias are holes that connect the outer and inner layers, while buried vias are holes that connect the layers. The use of these holes can help achieve a more compact layout and higher circuit density.
High-precision etching: Due to the very small line spacing required by high-density PCBs, high-precision etching processes are needed to manufacture lines. The etching process needs to be very precise to ensure the stability and electrical performance of the fine lines.
Interlayer connection: High-density PCBs usually use blind vias or buried vias for interlayer connection, and the integrity of signal transmission, antiference ability, and thermal management need to be considered during connection.
Surface treatment: The surface of high-density PCBs is usually treated with special surface treatment processes such as gold plating, silver plating, OSP ( metal surface treatment), etc., to ensure good solderability and anti-oxidation.
Precision assembly: The assembly process of high-density PCBs requires extremely high precision, and usually automated equipment is needed for precision welding and assembly to ensure that can be correctly soldered onto the circuit board.
Personalized customized services
Need material substitution or PTFE lamination?
We support Rogers, Taconic, F4B, and custom high-Dk materials.
Send us your Gerber files, stack-up requirements, and impedance specs – we’ll manufacture with precision.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Trading Company
Year Established:
1995
Total Annual:
84,094,800-84,094,800
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of...
