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Dongguan Xingqiang Circuit Board Technology Co., Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier
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China 4 Layer Black Oil HDI PCB Circuit Board HASL Surface Process Customized
China 4 Layer Black Oil HDI PCB Circuit Board HASL Surface Process Customized

  1. China 4 Layer Black Oil HDI PCB Circuit Board HASL Surface Process Customized

4 Layer Black Oil HDI PCB Circuit Board HASL Surface Process Customized

  1. MOQ: Sample,1 pc(5 square meters)
  2. Price: NA
  3. Get Latest Price
Payment Terms ,T/T,Western Union
Supply Ability 3000㎡
Delivery Time 14-15 work days
Min. Solder Mask Clearance 0.1mm
Pcba Standard IPC-A-610E
Aspect Ratio 20:1
Board Thinkness 1.2mm
Minimum Line Space 3mil (0.075mm)
Surface Finishing HASL/OSP/ENIG
Materila FR4
Product HDI Print Circuit Board
Oil color Black
Measurement Customized
Brand Name xingqiang
Model Number Varies by goods condition
Certification ROHS, CE
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms ,T/T,Western Union Supply Ability 3000㎡
Delivery Time 14-15 work days Min. Solder Mask Clearance 0.1mm
Pcba Standard IPC-A-610E Aspect Ratio 20:1
Board Thinkness 1.2mm Minimum Line Space 3mil (0.075mm)
Surface Finishing HASL/OSP/ENIG Materila FR4
Product HDI Print Circuit Board Oil color Black
Measurement Customized Brand Name xingqiang
Model Number Varies by goods condition Certification ROHS, CE
Place of Origin China
High Light 4 Layer HDI Multilayer PCBBlack Oil HDI Multilayer PCB BoardHASL Surface HDI Multilayer PCB

4-layer board Black oil HDI  PCB


   4-layer board Black oil HDI  PCB is a PCB that achieves higher circuit density by using thinner lines, smaller apertures and denser wiring design. This PCB technology can achieve more circuit connections in a limited space by adopting more advanced manufacturing processes and design technologies, and is widely used in mobile phones, tablets, computers, equipment, automobiles, electronics and other medical fields.



Product Features:

  • Microvias (Micro-Through-Holes): These are very small vias (typically $leq 150 mu m$ in diameter) used to connect different layers. They are usually laser-drilled.

  • Blind and Buried Vias: HDI boards utilize vias that do not pass through the entire board (blind vias) or connect only internal layers (buried vias), freeing up surface space for component placement and routing.

  • Finer Lines and Spaces: The trace width and spacing are much smaller than traditional PCBs (often $< 100 mu m$).

  • High Component Density: The use of microvias and finer traces allows for more components to be placed closer together on the board.

  • Via-in-Pad Technology: This involves placing a microvia directly in the copper pad of a component, which further conserves routing space and improves signal performance.


Core Manufacturing Challenges

  1. Ultra-fine Line and Space Fabrication :HDI boards require line widths and spaces (L/S) as small as 25μm/25μm or even finer. Controlling undercutting, line discontinuity, and copper uniformity during etching is extremely difficult, as minor process variations can lead to open or short circuits.
  2. High-Precision Drilling for Microvias: Microvias (typically ≤150μm in diameter) demand advanced laser drilling or mechanical micro-drilling techniques. Issues like drill breakage, uneven hole walls, and thermal damage to the substrate (especially for laser drilling) are major hurdles, directly affecting interconnection quality.
  3. Layer-to-Layer Alignment Accuracy : Multiple stacked layers (often ≥8 layers) require precise alignment, with registration tolerances as tight as ±10μm. Any misalignment between layers can cause microvia misconnection, reducing yield and board reliability.
  4. Reliability Control of Stacked/Buried Vias: Stacked or buried microvias need consistent plating thickness (usually ≥20μm) to ensure conductivity and mechanical strength. Voids, poor adhesion, or uneven plating within vias can lead to premature failure under thermal cycling or vibration.
  5. Surface Finish and Solderability: Fine-pitch components (e.g., 01005 chips or CSPs) on HDI boards require uniform surface finishes (e.g., ENIG, Immersion Silver). Controlling finish thickness, avoiding oxidation, and ensuring solder joint reliability are critical, as small defects can cause soldering failures.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company

  • Year Established:

    1995

  • Total Annual:

    84,094,800-84,094,800

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of...

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  • Dongguan Xingqiang Circuit Board Technology Co., Ltd.
  • Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
  • https://www.multilayer-pcbs.com/

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