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Dongguan Xingqiang Circuit Board Technology Co., Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier
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China 8 Layer Blue Oil High Frequency Circuit Board for Smart Phone Customization
China 8 Layer Blue Oil High Frequency Circuit Board for Smart Phone Customization

  1. China 8 Layer Blue Oil High Frequency Circuit Board for Smart Phone Customization

8 Layer Blue Oil High Frequency Circuit Board for Smart Phone Customization

  1. MOQ: Sample,1 pc(5 square meters)
  2. Price: Based on Gerber Files
  3. Get Latest Price
Payment Terms ,T/T,Western Union
Supply Ability 100000㎡/Month
Delivery Time NA
Product Name High Frequency PCB
Blind/Buried Vias Yes
Min. Line Width/Spacing 3mil
Layer Count 1-30 layers
Surface Finished Immersion Gold
Materials Rogers/Isola/PTFE
Usage Smart Devices
Impedance Control +/-10% or +/-5%
Quotation requirements Gerber files,BOM
Silk Screen White,Black,Blue,Red,Yellow,Green
Brand Name xingqiang
Model Number As Per Customer's Model
Certification ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms ,T/T,Western Union Supply Ability 100000㎡/Month
Delivery Time NA Product Name High Frequency PCB
Blind/Buried Vias Yes Min. Line Width/Spacing 3mil
Layer Count 1-30 layers Surface Finished Immersion Gold
Materials Rogers/Isola/PTFE Usage Smart Devices
Impedance Control +/-10% or +/-5% Quotation requirements Gerber files,BOM
Silk Screen White,Black,Blue,Red,Yellow,Green Brand Name xingqiang
Model Number As Per Customer's Model Certification ISO 9001 / RoHS /UL / IATF 16949 (automotive)
Place of Origin China
High Light Immersion Gold High Frequency Circuit Board6 Layer High Frequency Circuit BoardIndustrial Control PCB 6 Layer

XingQiang Custom PCB for Smartphone Core Modules:

 This custom PCB features blue solder mask and immersion gold finish, tailored for smartphone core modules and mobile devices. It ensures stable high-speed signal transmission and efficient power distribution, with excellent conductivity, oxidation resistance and reliable solderability. Custom-engineered to strict electronic standards, it optimizes signal integrity, EMI mitigation and compact layout for mobile device applications.



Product Features:

Multilayer Architecture: Precision multi-layer design for high-density wiring, minimal crosstalk, optimized space utilization and complex circuit integration.

Blue Solder Mask: Robust insulation & mechanical protection, resistant to moisture, dust and chemicals in harsh industrial environments.

Immersion Gold Finishing: Superior conductivity, oxidation resistance and solderability for long-term connection stability and low maintenance.

Industrial-Grade Reliability: High-performance glass fiber epoxy substrate, stable operation in extreme temps (-40°C~125°C), high humidity and chemical exposure.

Enhanced Signal Integrity: Optimized layout for power management and signal integrity, built-in EMI mitigation for accurate control signal & data transmission.



Core Manufacturing Challenges
1. High difficulty in fine line and space processing: Line width/space is often less than 0.1mm, requiring high-precision etching processes, which are prone to uneven line width, short circuits, or open circuits.
2. Complex multi-layer interconnection process: With more layers (usually 8 or more) and the need for microvia, blind via, and buried via technologies, the requirement for drilling alignment is extremely high, making hole position deviation or poor metallization likely.
3. Difficult impedance control: The high-density wiring and multi-layer structure result in complex signal transmission paths, requiring precise impedance matching to avoid signal reflection and interference.
4. Strict material selection and compatibility requirements: Special substrates with low loss and high temperature resistance must be used, and the thermal expansion coefficients of different materials need to match to prevent interlayer separation.
5. Difficult quality inspection and defect control: Tiny line defects, hole wall defects, etc., are hard to detect through conventional testing, imposing high requirements on testing equipment and process control.


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Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company

  • Year Established:

    1995

  • Total Annual:

    84,094,800-84,094,800

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. As a professional supplier of customized boards, we work closely with our clients, le...

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  • Dongguan Xingqiang Circuit Board Technology Co., Ltd.
  • Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
  • https://www.multilayer-pcbs.com/

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