Ecer asks for your consent to use your personal data to:
Personalised advertising and content, advertising and content measurement, audience research and services development
Store and/or access information on a device
Your personal data will be processed and information from your device (cookies, unique identifiers, and other device data) may be stored by, accessed by and shared with 135 TCF vendor(s) and 65 ad partner(s), or used specifically by this site or app.
Some vendors may process your personal data on the basis of legitimate interest, which you can object to by do not consent. Contact our platform customer service, you can also withdraw your consent.
High temperature resistance and chemical resistance
product Description:
The flex-rigid board combines the structural stability of rigid substrates with the bending flexibility of flexible materials, suiting 3D assembly in tight spaces. It boasts excellent insulation and temperature resistance, withstands repeated mechanical stress, and ensures stable circuitry. Widely used in smart devices, automotive electronics, etc., it aids lightweight and highly reliable device designs.
product Features:
Combines rigid stability and flexible bending for tight spaces
stress; stable circuitry
Enables lightweight, high-reliability devices
Design flexibility
Manufacturing process:
Design and Material Selection: During the design phase, rigid and flexible segments are defined. Appropriate base materials (e.g., FR4, polyimide) and processes are selected to ensure seamless integration of rigid and flexible sections.
PCB Lamination: Rigid-flex PCB fabrication involves lamination of rigid and flexible components, typically via precision hot pressing and bonding to integrate multi-material circuit layers into a unified structure.
Etching and Hole Machining: The laminated substrate undergoes photolithography and etching to form target circuit patterns, with hole machining performed for component mounting and interlayer interconnection.
Surface Finishing: Surface treatment processes (e.g., gold plating, tin plating, OSP) are applied to protect circuit surfaces, ensuring superior solderability and oxidation resistance.
Assembly and Testing: Post-fabrication, the board undergoes component mounting or through-hole soldering, followed by electrical testing to verify proper circuit functionality and compliance with design specifications.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Trading Company
Year Established:
1995
Total Annual:
84,094,800-84,094,800
Employee Number:
500~800
Ecer Certification:
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of...