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Dongguan Xingqiang Circuit Board Technology Co., Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier
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China OSP Treatment Double Sided PCB Green Soldermask FR4 Material Versatile
China OSP Treatment Double Sided PCB Green Soldermask FR4 Material Versatile

  1. China OSP Treatment Double Sided PCB Green Soldermask FR4 Material Versatile

OSP Treatment Double Sided PCB Green Soldermask FR4 Material Versatile

  1. MOQ: Sample,1 pc(5 square meters)
  2. Price: NA
  3. Get Latest Price
Payment Terms ,T/T,Western Union
Supply Ability 3000
Delivery Time 7-10 work days
Silkscreen White
Peelable 0.3-0.5mm
Pcb Base Material FR4 TG150
Cu Weight 1OZ
Minconductiveannularring 0.2mm
Tg Value 140
Min. Trace Width 0.1mm
Surface Finish OSP
Mask yellow+green
Minimum Line 0.075mm
Brand Name xingqiang
Model Number Varies by goods condition
Certification ROHS, CE
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Payment Terms ,T/T,Western Union Supply Ability 3000
Delivery Time 7-10 work days Silkscreen White
Peelable 0.3-0.5mm Pcb Base Material FR4 TG150
Cu Weight 1OZ Minconductiveannularring 0.2mm
Tg Value 140 Min. Trace Width 0.1mm
Surface Finish OSP Mask yellow+green
Minimum Line 0.075mm Brand Name xingqiang
Model Number Varies by goods condition Certification ROHS, CE
Place of Origin China
High Light Green Soldermask Double Sided PCBOSP Treatment Multilayer Printed Circuit Board

OSP Green Soldermask HASL Material SMT Multilayer PCB Board refers to a multilayer printed circuit board (Multilayer PCB) designed for Surface Mount Technology (SMT) assembly, featuring a specific combination of surface treatment, solder mask, and base materials. Its core manufacturing process involves: first, laminating multiple layers of substrate (with pre-etched internal circuits) to form a multilayer structure; then, applying green solder mask ink on the outer layers to insulate and protect non-welding areas; subsequently, treating the exposed copper pads with OSP (Organic Solderability Preservative) to prevent oxidation; and finally, using HASL (Hot Air Solder Leveling) on key solder points (if hybrid treatment is adopted) to enhance solderability. This board integrates the advantages of OSP and HASL treatments, making it suitable for complex electronic systems requiring high reliability and efficient assembly.

Appearance Characteristics

Uniform green solder mask: The outer surface is covered with a consistent green solder mask, a standard color in the electronics industry, ensuring high visibility for visual inspection during SMT assembly and reducing errors in component placement.

Clear layer structure: The multilayer design (typically 4 layers or more) allows for compact routing, with the green mask providing a clear contrast against the exposed copper pads (protected by OSP) and HASL-treated solder points, facilitating circuit identification and maintenance.


Performance Characteristics

Dual solderability enhancement: OSP forms a thin organic film on copper pads to maintain long-term solderability and resist oxidation, while HASL (applied selectively or globally) creates a solderable tin-lead or lead-free alloy layer on critical areas, ensuring strong bonding during high-temperature SMT soldering.

High insulation and mechanical strength: The green solder mask offers excellent insulation (high volume resistivity) to prevent short circuits between adjacent traces, while the multilayer lamination (using high-performance substrates like FR-4) provides robust mechanical strength, resisting warpage under thermal stress during assembly and operation.

Signal integrity optimization: The multilayer structure allows for dedicated power and ground planes, reducing electromagnetic interference (EMI) and crosstalk. Combined with OSP’s minimal impact on impedance (due to its thin layer), the board ensures stable signal transmission in high-frequency applications (up to several GHz).



Application Adaptability

Complex electronic systems: Ideal for consumer electronics (smart TVs, routers), industrial control systems (PLCs, sensors), and automotive electronics (infotainment systems, ADAS modules), where multilayer routing, high assembly efficiency, and reliable soldering are critical.

High-density SMT assembly: Its compatibility with fine-pitch components and automated processes makes it suitable for compact devices requiring high integration, such as medical monitors and communication base stations.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company

  • Year Established:

    1995

  • Total Annual:

    84,094,800-84,094,800

  • Employee Number:

    500~800

  • Ecer Certification:

    Verified Supplier

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of...

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  • Dongguan Xingqiang Circuit Board Technology Co., Ltd.
  • Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
  • https://www.multilayer-pcbs.com/

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