FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM ODM

MOQ： 5 square meters
Price： NA
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Payment Terms	,T/T,Western Union
Supply Ability	3000㎡
Delivery Time	12-15 work days
Min. Solder Mask Clearance	0.1mm
Pcba Standard	IPC-A-610E
Aspect Ratio	20:1
Board Thinkness	1.2mm
Minimum Line Space	3mil (0.075mm)
Surface Finishing	HASL/OSP/ENIG
Material	FR4
Product	Print Circuit Board
Brand Name	xingqiang
Model Number	Varies by goods condition
Certification	ROHS, CE
Place of Origin	China

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Product Details
Company Details

Product Specification


Payment Terms	,T/T,Western Union	Supply Ability	3000㎡
Delivery Time	12-15 work days	Min. Solder Mask Clearance	0.1mm
Pcba Standard	IPC-A-610E	Aspect Ratio	20:1
Board Thinkness	1.2mm	Minimum Line Space	3mil (0.075mm)
Surface Finishing	HASL/OSP/ENIG	Material	FR4
Product	Print Circuit Board	Brand Name	xingqiang
Model Number	Varies by goods condition	Certification	ROHS, CE
Place of Origin	China
High Light	OSP Surface Multilayer Printed Circuit Board ，FR4 Material 4 Layer PCB Board

FR4 OSP 4-layer board PCB

Advantages of Multilayer PCB:

Increase circuit board density
Reduce size
Better signal integrity
Adapt to high-frequency applications
better thermal management
Higher reliability

product Description:

FR4 OSP 4-layer board PCB Multilayer PCB is a printed circuit board composed of three or more layers of circuits. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.

product Features:

Multi-layer design
Inner layer and outer layer
through hole
Copper layer
Dielectric layer (dielectric material)

Manufacturing process:

Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).

Company Details

Bronze Gleitlager

Bronze Sleeve Bushings

and

Graphite Plugged Bushings

from Quality China Factory



Business Type:

Manufacturer,Trading Company 


Year Established:

1995 


Total Annual:

84,094,800-84,094,800


Employee Number:

500~800 


Ecer Certification：

Verified Supplier 

Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs. The company has two production bases in Dongguan andJiangxi, covering an area of...

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Reach Us
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
Zhupingsha Industrial Zone, Wangniudun Town, Dongguan City, Guangdong Province
https://www.multilayer-pcbs.com/

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