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{"title":"8 Layer Black Oil Sinking Gold Thick Copper Plate PCB , FR4 Material customized","imgUrl":"https:\/\/img.chinax.com\/nimg\/1c\/29\/79a36d60498ddd8516444bf8876a-200x200-1\/8_layer_black_oil_sinking_gold_thick_copper_plate_pcb_2c_fr4_material_customized.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
{"title":"FR4 OSP Surface Multilayer Printed Circuit Board 4 Layer PCB Board OEM\/ODM","imgUrl":"https:\/\/img.chinax.com\/nimg\/0e\/2c\/eb019e908ecf13f39eb4e569e102-200x200-1\/fr4_osp_surface_multilayer_printed_circuit_board_4_layer_pcb_board_oem_2fodm_service.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
{"title":"6 Layer FR4 Solder Masked PCB Board Through Hole Design OEM Service","imgUrl":"https:\/\/img.chinax.com\/nimg\/47\/e2\/98c9ca586e131f7fa578fb4c7b62-200x200-1\/6_layer_fr4_solder_masked_pcb_board_through_hole_design_oem_service.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
{"title":"4 Layer Solderable PCB Board HASL\/OSP\/ENIG Treatment Customized services","imgUrl":"https:\/\/img.chinax.com\/nimg\/71\/1c\/91438806417f8f360a29644100d5-200x200-1\/4_layer_solderable_pcb_board_hasl_2fosp_2fenig_treatment_customized_services.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
{"title":"2OZ Copper Thick Green Solder Multi Layer PCB Board 1.6mm Higher reliability","imgUrl":"https:\/\/img.chinax.com\/nimg\/a9\/7a\/37d88eec4b9744dc3e7dc370415f-200x200-1\/2oz_copper_thick_green_solder_multi_layer_pcb_board_1_6mm_higher_reliability.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
{"title":"4 Layer Solder Mask Multilayer PCB Board FR4 1.6mm for electronic equipment","imgUrl":"https:\/\/img.chinax.com\/nimg\/c1\/b0\/81f007b7a17f823657a85dfa5c38-200x200-1\/4_layer_solder_mask_multilayer_pcb_board_fr4_1_6mm_for_electronic_equipment.jpg","attrs":{"Brand Name":"xingqiang","Model Number":"Varies by goods condition","Certification":"ROHS, CE","Place of Origin":"China"}}
Multi-layer Printed Circuit Board (PCB) refers to a printed circuit board formed by laminating three or more conductive graphic layers (copper layers) onto a substrate insulation layer through lamination technology. It serves as the core carrier for modern high-performance, high-density electronic devices.
Main Advantages
Feature
Single/Double-Layer
Multi-Layer
Circuit Density
Low (surface routing only)
High (3D routing, saves ≥60% area)
Signal Integrity
Prone to interference
Dedicated ground/power layers shield noise
EMC Performance
Poor
Excellent (reduced radiation/susceptibility)
Power Management
Limited current capacity
Independent power layers reduce voltage drop/heat
Applications
Simple devices (remotes)
High-speed systems (phones/servers)
Core Applications
High-Speed Digital Devices
Smartphones/PC motherboards (6–12 layers): Impedance matching and shielding for CPU/RAM signals.
Design Complexity: Requires EDA tools (e.g., Cadence/Allegro) for SI/PI simulation.
Process Limits: 5G/AI chips drive layer counts to 30+, line width/spacing ≤40μm.
Material Innovation: PTFE (polytetrafluoroethylene) for high-frequency apps (Df Multi-layer PCBs are the foundation of electronics miniaturization and high performance—breaking physical limits via 3D circuit stacking while enabling efficient signal, power, and ground management through precision interconnects. From smartphones to supercomputers, their evolving layer counts and processes continually extend Moore’s Law, acting as the "invisible skeleton" of modern electronics.
Manufacturing process:
Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Trading Company
Year Established:
1995
Total Annual:
84,094,800-84,094,800
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of...
