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High temperature resistant OSP black oil double panel PCB
Product Description
High temperature resistant OSP black oil double panel PCB is a double-sided printed circuit board integrating high temperature resistant performance, OSP (Organic Solderability Preservative) surface treatment, and a black solder mask. It adopts a double-sided wiring design: the substrate is made of high temperature resistant materials (such as high Tg FR-4), and the surface is coated with black ink as the solder mask, which provides insulation, protects the circuit, and offers good light-shielding properties. Both sides of the board undergo OSP treatment on exposed copper surfaces, forming a thin organic protective film through chemical reactions to prevent copper oxidation while maintaining solderability. This PCB is suitable for circuits operating in high temperature environments (typically above 130℃) and adapts to the welding needs of conventional and precision components.
Core Characteristics
High temperature resistance + OSP treatment + black oil solder mask combination: The high temperature resistant substrate ensures stable performance under high heat; the ultra-thin (0.1-0.3μm) OSP film guarantees oxidation resistance and solderability; the black ink provides stable insulation, excellent light-shielding, and a professional appearance.
Double-sided structure: Supports bidirectional signal transmission, meeting the layout requirements of electronic devices working in high temperature environments and small to medium-scale circuit design needs.
Strong compatibility: The OSP process, high temperature resistant substrate, and black solder mask ink work well together, integrating smoothly into conventional production processes.
Main Advantages
Excellent high temperature stability: The high temperature resistant substrate and heat-resistant black ink allow the PCB to maintain structural and performance integrity in high temperature operating environments, suitable for fields like automotive electronics and industrial control.
Reliable solderability: The OSP film is easily removed during soldering, enabling good solder wetting on copper surfaces, reducing cold solder joint risks, and ensuring stable connections even for fine-pitch components, even after exposure to high temperatures.
Superior light-shielding and protection: The black solder mask provides effective light-shielding, preventing light interference in sensitive circuits; it also isolates circuits from external environments, enhancing corrosion and abrasion resistance.
Cost-effectiveness: Combining the low-cost OSP process with economical black ink and high temperature resistant materials (compared to some advanced high temperature substrates), the PCB has relatively controllable production costs.
Environmental friendliness: The OSP process uses non-toxic organic compounds, and the black ink is generally environmentally friendly, complying with environmental regulations and reducing hazardous waste.
Dimensional precision: The thin OSP layer and black ink do not significantly affect the board’s thickness or flatness, making it suitable for high-density circuit designs in high temperature applications requiring precise dimensions.
Company Details
Bronze Gleitlager
,
Bronze Sleeve Bushings
and
Graphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer,Trading Company
Year Established:
1995
Total Annual:
84,094,800-84,094,800
Employee Number:
500~800
Ecer Certification：
Verified Supplier
Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of... Dongguan Xingqiang Circuit Board Co., Ltd. was established in 1995 and is a professional circuit boardfactory that manufactures single-sided and double-sided PCBs, multi-layer PCBs, and Rigid Flex PCBs.
The company has two production bases in Dongguan andJiangxi, covering an area of...
