Shenzhen Rocfly Blue Electronic Co., Ltd.
| Engineering Services | Schematic design, PCB layout, DFM/DFA review |
| Firmware Development | BLE and Wi-Fi stacks, provisioning, cloud and OTA support |
| Customization | Tailored RF front-end and firmware co-development |
| Payment Terms | T/T,L/C,PayPal |
| Packaging Details | Anti-static ESD bag, foam-lined export carton with desiccant; assembled units secured in custom tray |
| Service Scope | Turnkey Bluetooth and Wi-Fi Module PCBA ODM |
| Cost Optimization | BOM re-pinning and design cost-out |
| Supply Ability | 50000 Pieces per Month |
| Box-Build | Enclosure integration into finished product |
| Board Layers | 1-16 layers, FR4 |
| Testing | ICT, FCT, RF test, throughput, AOI, X-Ray |
| Min Order | 1 piece prototype |
| Prototype and Mass Production | NPI samples to volume ramp |
| Wireless Standards | Bluetooth 5.x (BLE) / Wi-Fi 6 ready |
| Sourcing | Full BOM component sourcing and alternate cross-reference |
| Delivery Time | 5-7 working days for prototypes, 15-30 days for mass production |
| Assembly Types | SMT and DIP (through-hole) |
| Place of Origin | Guangdong, China |
| Model Number | BTWIFI-PCBA-01 |
| Brand Name | OEM/ODM |
| Certification | ISO 9001:2015, IPC-A-610, RoHS, CE, FCC, Bluetooth SIG |
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Product Specification
| Engineering Services | Schematic design, PCB layout, DFM/DFA review | Firmware Development | BLE and Wi-Fi stacks, provisioning, cloud and OTA support |
| Customization | Tailored RF front-end and firmware co-development | Payment Terms | T/T,L/C,PayPal |
| Packaging Details | Anti-static ESD bag, foam-lined export carton with desiccant; assembled units secured in custom tray | Service Scope | Turnkey Bluetooth and Wi-Fi Module PCBA ODM |
| Cost Optimization | BOM re-pinning and design cost-out | Supply Ability | 50000 Pieces per Month |
| Box-Build | Enclosure integration into finished product | Board Layers | 1-16 layers, FR4 |
| Testing | ICT, FCT, RF test, throughput, AOI, X-Ray | Min Order | 1 piece prototype |
| Prototype and Mass Production | NPI samples to volume ramp | Wireless Standards | Bluetooth 5.x (BLE) / Wi-Fi 6 ready |
| Sourcing | Full BOM component sourcing and alternate cross-reference | Delivery Time | 5-7 working days for prototypes, 15-30 days for mass production |
| Assembly Types | SMT and DIP (through-hole) | Place of Origin | Guangdong, China |
| Model Number | BTWIFI-PCBA-01 | Brand Name | OEM/ODM |
| Certification | ISO 9001:2015, IPC-A-610, RoHS, CE, FCC, Bluetooth SIG | ||
| High Light | Custom Bluetooth Wi-Fi Module PCBA ，RF Firmware Stack Development ，Component Cost Optimization Plan | ||
Wireless module boards engineered around your connected product, with turnkey ODM development that speeds up your launch and lowers your total cost. We design, build and optimize — from schematic to a boxed, certifiable finished device.
| Schematic Design | Wireless circuit capture, SoC/module and RF front-end selection matched to your range and data needs. |
| PCB Layout | Controlled-impedance RF routing, antenna clearance and EMC-conscious layout for reliable wireless performance. |
| Component Sourcing | BOM scrubbing, authorized-channel sourcing and wireless-chip availability planning. |
| DFM / DFA Review | Manufacturability and assembly feedback before tooling to prevent costly re-spins. |
| SMT and DIP Assembly | High-speed SMT plus through-hole DIP, wave/selective soldering and AOI inspection. |
| Firmware Development | BLE and Wi-Fi protocol stacks, pairing/provisioning logic, cloud connectivity and OTA firmware. |
| Functional Testing | ICT, FCT and RF test fixtures (throughput, range, sensitivity) with custom test-jig programming. |
| Box-Build Assembly | Enclosure integration, harness and connector mating, sealing and finished-goods packing. |
| Prototype and Mass Production | Rapid NPI samples, pilot build and scalable volume ramp on a single process. |
Our engineers custom-develop the wireless module and its firmware for your product, so the radio and antenna fit your form factor and connectivity roadmap.
We do more than populate boards — we lower your total cost and shorten your time to market.
| BOM cost optimization | Cross-reference the BOM to equivalent parts that cut unit cost without sacrificing RF performance. |
| Design cost-out | Simplify layer count, consolidate passives and remove redundant parts early in the design. |
| Consolidated sourcing | One supplier, one BOM, fewer purchase orders and less overhead. |
| Faster NPI | Rapid prototyping and DFM feedback compress the design-build-test loop. |
| Supply chain resilience | Qualified second sources reduce stock-out and price-spike risk. |
A bare PCBA is only a component. This service carries the board all the way into a finished wireless product that ships ready to sell.
Send us your spec, schematic or 3D model
We will return a DFM summary, a BOM cost-reduction proposal and a prototype-to-production plan.
Company Details
Business Type:
Manufacturer
Year Established:
2010
Ecer Certification：
Verified Supplier
Your China Product Development & Manufacturing Partner We help global companies turn ideas into market-ready products by combining engineering expertise, manufacturing capabilities, and China's complete industrial supply chain ecosystem. With over 15 years of experience in international trade, e... Your China Product Development & Manufacturing Partner We help global companies turn ideas into market-ready products by combining engineering expertise, manufacturing capabilities, and China's complete industrial supply chain ecosystem. With over 15 years of experience in international trade, e...
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