High Thermal Conductivity Aluminum PCB with 2.0-3.0 W/m*K Dielectric and 6 oz

Product Specification

Product Description

In high-power electronics, the dielectric layer of an aluminum PCB is the main bottleneck for heat flow. Our high thermal conductivity single-layer aluminum PCB uses a premium filled epoxy dielectric with 2.0–3.0 W/m·K thermal conductivity — roughly 2–3× that of standard MCPCB insulation — while maintaining a dielectric breakdown voltage of 3 kV or more and reliable isolation between the copper circuit and the aluminum base.

The result is a measurable drop in thermal resistance (typically 0.2–0.4 °C·in²/W versus 0.8–1.0 for standard grades), which translates directly into lower LED junction temperatures, slower lumen depreciation, higher allowable drive current, and longer product lifetime. For power electronics, it means MOSFETs and rectifiers run cooler, switching losses shrink, and thermal cycling stress on solder joints is reduced.

Boards are available with up to 6 oz (210 µm) copper for high-current busbars, with optional thermal vias filled with silver-epoxy or copper coins for maximum heat extraction, and with ENIG or immersion-silver finishes suited to high-temperature operation. All production is governed by ISO 9001, ISO 13485, and IATF 16949 systems, with RoHS compliance and UL certification.

Key Features

• 2.0–3.0 W/m·K dielectric: premium ceramic-filled insulation cuts total board thermal resistance by up to 50–70% versus standard MCPCB, moving heat into the aluminum base far faster.
• Up to 6 oz (210 µm) copper: heavy copper layers handle high continuous current and spread heat laterally away from hot spots.
• High dielectric strength: ≥3 kV breakdown voltage — safe isolation even for high-voltage power circuits.
• Optional thermal enhancement: silver-filled thermal vias, copper coins, and thick aluminum bases (2.0–3.0 mm) for extreme power density.
• Lower junction temperature, longer life: every 10 °C reduction roughly doubles LED lifetime and dramatically slows light decay in COB and high-power SMD arrays.
• Higher power density: pack more watts into the same board area — often allowing a smaller, lighter, cheaper product than standard MCPCB designs.
• Automotive-grade reliability: produced under IATF 16949, capable of withstanding –40 °C to +150 °C thermal cycling.
• Reflow-stable construction: rigid aluminum core prevents warping through lead-free reflow and thermally demanding assembly processes.

Manufacturing Capabilities

Applications

Why Choose Us

• 20+ years of PCB & PCBA manufacturing — Huayihai Technology Co., Ltd., established 2005, delivers from rapid prototypes to mass production.
• Certified for demanding industries — ISO 9001, ISO 13485, IATF 16949, RoHS, and UL Certification, with full traceability and documentation for automotive and medical customers.
• Thermal engineering, not just fabrication — send us your power budget; our engineers will model junction temperature, recommend dielectric class, copper weight, via strategy, and board area before you commit to tooling.
• Complete supply chain — component sourcing, SMT/through-hole assembly, burn-in and functional testing: a finished, tested module shipped to your line.
• Strict process control — automated lamination and exposure lines, 100% electrical testing, plus peel-strength and breakdown-voltage verification for high-reliability orders.
• Global trade experience — T/T, L/C, D/P, D/A, and Western Union payment; FOB/CIF/DDU/DDP shipping; vacuum-sealed, ESD-protected export packaging.

FAQ

A: Choose 2.0–3.0 W/m·K when your LED power density exceeds roughly 0.5 W/cm², when junction temperature is the limiting factor in your design, or for automotive and power-module products that must survive severe thermal cycling. For standard lighting products, our standard single-layer aluminum PCB (1.0–2.0 W/m·K) is more cost-effective.

A: Depending on dielectric class, copper weight, and layout, junction temperature typically drops 10–25 °C compared with standard MCPCB. Send us your LED package, power, and layout for an engineering estimate.

A: Yes. The high-conductivity dielectric still provides ≥3 kV AC breakdown — higher than the standard grade — and meets isolation requirements for most power and lighting applications.

A: Yes. Thermal vias can be filled with silver-epoxy, and copper coins can be inlaid under critical devices for near-ultimate heat extraction. These require DFM review — our engineers will confirm feasibility with your files.

A: Yes. Our IATF 16949 system supports PPAP documentation (dimensional reports, material certs, capability studies) on request.

A: As a rule of thumb, 2 oz handles ~10 A, 3 oz ~15 A, and 4–6 oz 20 A+ per 10 mm trace width (depending on allowable temperature rise). We will verify current-carrying capacity during DFM review.

A: The premium dielectric costs more than the standard grade, but often saves total cost by shrinking the board or removing a heat sink. Lead times match standard aluminum PCBs: 5–7 working days for prototypes, 10–15 for production.

A: Email your Gerber files, stackup (or target specs), and annual/batch quantity. A quotation and DFM review are typically returned within 24 hours.