Product Specification

• Alloy Grade: 6J13 

• Dimensional Specification: 0.0125mm (12.5μm) thickness × 100mm width (tolerance: thickness ±0.0005mm, width ±0.15mm)

• International Alignment: Performance comparable to DIN 17471 CuMn12Ni2 ultra-thin foils, with adjusted Ni-Mn ratio to prevent brittle fracture during ultra-thin rolling

• Compliant Standards: GB/T 1234-2019 (resistance alloy strips/foils) + GB/T 2059-2021 (copper alloy foils) + IEC 60404-8-2 (precision resistance components for sensors)

• Manufacturer: Huona New Material, certified to ISO 9001 and RoHS, with specialized ultra-thin foil production lines (minimum rolling thickness 0.005mm)

• Extreme Thickness Advantage: 0.0125mm thickness (12.5μm) is 75% thinner than conventional 0.05mm manganin strips, enabling component volume reduction by 60%—critical for ultra-slim electronic devices (e.g., foldable phone sensors) and micro-pressure transducers (where space between sensing layers is ≤20μm).

• Dimensional Uniformity: Thickness variation across the entire foil width (100mm) is ≤0.0003mm, ensuring resistance consistency ±0.03% for micro-resistors—avoiding signal drift in pressure sensors caused by uneven thickness.

• Stable TCR for Measurement Accuracy: TCR as low as ±8 ppm/℃ (-40℃ to 140℃), perfectly matching the operating temperature range of industrial pressure sensors (-20℃ to 120℃). Resistance drift <0.006% after 2000 hours of continuous operation at 80℃—ensuring pressure measurement error ≤0.1% FS (full scale).

• Flexibility for Curved Sensors: Elongation ≥28% (annealed state) enables bending to a minimum radius of 0.1mm (8× thickness) without cracking—ideal for curved pressure sensor diaphragms (e.g., automotive tire pressure sensors) and flexible electronic components.

• Ultra-Fine Etchability: Uniform microstructure (grain size ≤15μm) and bright annealed surface (Ra ≤0.1μm) support micro-chemical etching with line width as narrow as 0.01mm—meeting the production of high-density resistor arrays in integrated circuits and strain gauge grids in precision pressure sensors.

• Clean Surface for Thin-Film Bonding: Oil-free, oxide-free surface (verified via XPS analysis) ensures strong adhesion with polyimide (PI) and epoxy substrates (peel strength ≥0.8 N/mm)—critical for sensor foil-substrate bonding without delamination.

• Pressure Sensors: Strain gauge grids for MEMS pressure transducers (0.0125mm thickness fits diaphragm layers, low TCR ensures measurement accuracy ±0.1% FS) and industrial pressure sensors (flexibility adapts to curved diaphragms in pipeline pressure monitoring).

• Ultra-Miniature Electronic Elements: Thin-film resistors for foldable smartphones (ultra-thin thickness reduces device thickness by 0.3mm) and high-density resistor arrays for IoT micro-controllers (100mm width supports batch production of 100+ resistor grids per foil sheet).

• Precision Measuring Instruments: Resistance elements for portable digital pressure gauges (stable TCR minimizes temperature-induced errors) and micro-current shunts for low-power electronic sensors (0.0125mm thickness enables current sensing down to 0.1A with ±0.05% accuracy).

• Automotive Electronics: Strain gauge foils for tire pressure monitoring systems (TPMS) (flexibility fits curved tire inner surfaces) and micro-resistors for in-car sensor modules (ultra-miniature size adapts to compact electronic compartments).

• Sensor Etching Kit: Provides free etching parameter templates (etchant concentration, temperature, time) for 0.0125mm foil—optimized for 0.01-0.03mm line-width strain gauge grids, reducing customer process debugging time by 60%.

• Substrate Bonding Guidance: Offers tailored recommendations for adhesive selection (epoxy/PI) and bonding parameters (temperature, pressure) to ensure peel strength ≥0.8 N/mm—avoiding delamination issues in sensor use.

• Small-Batch Customization: Accepts MOQ of 20m for this fixed 规格,supporting R&D teams in pressure sensor prototype development and small-batch production of high-precision electronic elements.