Payment Terms | T/T |
Supply Ability | 100000 A WEEK |
Delivery Time | A WEEK |
Packaging Details | Case |
Housing Material | Kovar alloy or 304 stainless steel |
Number of Pins | 3 pins (customizable to 4, 6,8 etc.) |
Plating Options | Nickel, Gold (0.5–2μm thickness) |
Glass Insulator | Borosilicate or high-insulation custom glass |
Hermeticity | ≤1×10⁻⁸ atm·cc/sec (He leak test) |
Dimensional Customization | Available upon customer drawings |
Brand Name | HUONA |
Model Number | top |
Certification | ISO9001 |
Place of Origin | CHINA |
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Product Specification
Payment Terms | T/T | Supply Ability | 100000 A WEEK |
Delivery Time | A WEEK | Packaging Details | Case |
Housing Material | Kovar alloy or 304 stainless steel | Number of Pins | 3 pins (customizable to 4, 6,8 etc.) |
Plating Options | Nickel, Gold (0.5–2μm thickness) | Glass Insulator | Borosilicate or high-insulation custom glass |
Hermeticity | ≤1×10⁻⁸ atm·cc/sec (He leak test) | Dimensional Customization | Available upon customer drawings |
Brand Name | HUONA | Model Number | top |
Certification | ISO9001 | Place of Origin | CHINA |
High Light | TO63-03A hermetic sealing package ,power device TO header ,hermetic TO63 power package |
Product Name: TO63-03A Hermetic Sealing Package
Model Number: TO63-03A
Package Type: TO-style metal can (Transistor Outline)
Sealing Technology: Glass-to-Metal Sealing (GTMS)
Materials:
Housing: Kovar alloy (Fe-Ni-Co) or stainless steel
Pins: Kovar, Dumet, or custom conductive materials
Insulation Medium: Borosilicate or high-insulation glass
Excellent hermeticity with leak rate ≤1×10⁻⁸ atm·cc/sec (helium leak test), suitable for aerospace, defense, and high-reliability applications
Wide temperature range from -55°C to +300°C for use in extreme environments
Strong mechanical structure with high resistance to vibration and shock
Effective thermal path through the TO-style metal base, ideal for power components and heat-sensitive devices
Full customization available: pin configuration, plating thickness, housing size, materials, etc.
Item | Specification / Range |
---|---|
Housing Material | Kovar alloy or 304 stainless steel |
Number of Pins | 3 pins (customizable to 4, 6,8 etc.) |
Plating Options | Nickel, Gold (0.5–2μm thickness) |
Glass Insulator | Borosilicate or high-insulation custom glass |
Hermeticity | ≤1×10⁻⁸ atm·cc/sec (He leak test) |
Operating Temp. | -55°C to +300°C |
Surface Finish | Nickel plated, gold plated, or blackened |
Dimensional Customization | Available upon customer drawings |
Packaging | Vacuum sealed, anti-static bag, foam tray |
Laser diode and VCSEL packaging
Infrared sensor and detector modules
Power electronics: IGBT, MOSFET, and high-current transistors
RF and microwave device packaging
Medical sensor modules requiring hermetic enclosures
Aerospace, defense, and industrial electronics
2D/3D drawings in PDF or STEP format
Helium leak and material composition reports
RoHS and REACH compliance certificates
OEM/ODM customization available from prototype to volume
Technical consulting for packaging layout, sealing process, and thermal design
Company Details
Business Type:
Manufacturer,Exporter
Year Established:
2008
Total Annual:
8000000-100000000
Employee Number:
100~120
Ecer Certification:
Verified Supplier
Huona (Shanghai) New Material Co., Ltd. Was established in 2008, currently have three divisions: Magnesium Division, Thermal Spray Division and Functional Material Division.Magnesium Division produces magnesium metal products. Various models of high-quality magnesium alloy plate, magnesium rods, hig... Huona (Shanghai) New Material Co., Ltd. Was established in 2008, currently have three divisions: Magnesium Division, Thermal Spray Division and Functional Material Division.Magnesium Division produces magnesium metal products. Various models of high-quality magnesium alloy plate, magnesium rods, hig...
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