Shenzhen Jingchengjie Technology Co., Ltd.
| Packaging Details | Anti-static + bubble wrap + cardboard box |
| Material Type | FR-4.Aluminum.Copper .Ceramic .Flexible Boards.Rigid-Flex Board |
| Delivery Time | 2H-7DAY |
| Layer Count | 1-32 |
| Payment Terms | Western Union,T/T |
| Outer Copper Weight | 1oz-4oz |
| Min. Drill Hole | 0.15mm |
| Supply Ability | 1000000PCS |
| Surface Finish | HASL/Lead free HASL/ENIG/OSP |
| Model Number | QHPCBA26521 |
| Brand Name | QHPCBA |
| Place of Origin | china |
| Certification | IATF 16949，ISO 9001，ISO 13485，UL，IPC Class 3，RoHS，REACH |
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Product Specification
| Packaging Details | Anti-static + bubble wrap + cardboard box | Material Type | FR-4.Aluminum.Copper .Ceramic .Flexible Boards.Rigid-Flex Board |
| Delivery Time | 2H-7DAY | Layer Count | 1-32 |
| Payment Terms | Western Union,T/T | Outer Copper Weight | 1oz-4oz |
| Min. Drill Hole | 0.15mm | Supply Ability | 1000000PCS |
| Surface Finish | HASL/Lead free HASL/ENIG/OSP | Model Number | QHPCBA26521 |
| Brand Name | QHPCBA | Place of Origin | china |
| Certification | IATF 16949，ISO 9001，ISO 13485，UL，IPC Class 3，RoHS，REACH | ||
| High Light | 1oz prototype board pcb ，4oz prototype board pcb ，0.15mm prototype circuit board | ||
0.15mm HDI High Frequency Mixed Pressure Prototype Board PCB 1oz-4oz
We specialize in high-precision HDI high-frequency mixed-pressure PCBs. Adopting mixed lamination technology of high-frequency dielectric material and standard FR4 material, combined with HDI microvia stacked structure, the board balances high-frequency signal transmission performance and high-density wiring advantages. It solves the pa-in points of high cost of pure high-frequency boards and poor high-frequency performance of ordinary PCBs. It supports quick prototyping and small-batch mass production for communication and high-speed electronic equipment.
5G communication modules, RF radio frequency equipment, microwave radar, UAV control systems, high-speed servers, industrial high-frequency sensing equipment, smart home communication mainboards.
Support 1-2-1, 2-3-2 stacked HDI structure, multi-layer mixed pressure, impedance control, ENIG, silver immersion, HASL and other surface finishes, compliant with IPC Class 2/3 standards.
Company Details
Business Type:
Manufacturer,Trading Company
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification：
Verified Supplier
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