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Shenzhen Jingchengjie Technology Co., Ltd.

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz
China High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz

  1. China High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz
  2. China High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz

High Frequency HDI PCB Prototype 1-32 Layer Manufacturing Service with 1oz-4oz

  1. MOQ: 1
  2. Price: $10
  3. Get Latest Price
Packaging Details Anti-static + bubble wrap + cardboard box
Material Type FR-4.Aluminum.Copper .Ceramic .Flexible Boards.Rigid-Flex Board
Delivery Time 2H-7DAY
Material FR-4
Type High Frequency RF
Payment Terms Western Union,T/T
Layer Count 1-32 Layers
Outer Copper Weight 1oz-4oz
Min. Drill Hole 0.15mm
Surface Finish HASL/Lead free HASL/ENIG/OSP
Supply Ability 1000000PCS
Technology HDI with Micro-Vias
Certification UL
Brand Name QHPCBA
Place of Origin Shenzhen, China
Model Number QH-1157

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  1. Product Details
  2. Company Details

Product Specification

Packaging Details Anti-static + bubble wrap + cardboard box Material Type FR-4.Aluminum.Copper .Ceramic .Flexible Boards.Rigid-Flex Board
Delivery Time 2H-7DAY Material FR-4
Type High Frequency RF Payment Terms Western Union,T/T
Layer Count 1-32 Layers Outer Copper Weight 1oz-4oz
Min. Drill Hole 0.15mm Surface Finish HASL/Lead free HASL/ENIG/OSP
Supply Ability 1000000PCS Technology HDI with Micro-Vias
Certification UL Brand Name QHPCBA
Place of Origin Shenzhen, China Model Number QH-1157
High Light HDI High Frequency PCB1-32 Layer Prototype1oz-4oz Copper Weight

0.15mm HDI High Frequency Mixed Pressure Prototype Board PCB 1oz-4oz

Product Overview

We specialize in high-precision HDI high-frequency mixed-pressure PCBs. Adopting mixed lamination technology of high-frequency dielectric material and standard FR4 material, combined with HDI microvia stacked structure, the board balances high-frequency signal transmission performance and high-density wiring advantages. It solves the pa-in points of high cost of pure high-frequency boards and poor high-frequency performance of ordinary PCBs. It supports quick prototyping and small-batch mass production for communication and high-speed electronic equipment.

Core Advantages
  • Mixed lamination structure with low dielectric constant and low loss, stable high-frequency signal transmission and strong anti-interference ability
  • HDI microvia technology with staggered blind and buried vias, high wiring density and high board utilization
  • Accurate impedance control to meet signal integrity requirements of high-speed and high-frequency equipment
  • Higher cost performance than full high-frequency boards, greatly reducing R&D and mass production costs
  • 24–48 hours quick sample service in Shenzhen factory, supporting multi-layer precision mixed lamination
Applications

5G communication modules, RF radio frequency equipment, microwave radar, UAV control systems, high-speed servers, industrial high-frequency sensing equipment, smart home communication mainboards.

Process Capability

Support 1-2-1, 2-3-2 stacked HDI structure, multi-layer mixed pressure, impedance control, ENIG, silver immersion, HASL and other surface finishes, compliant with IPC Class 2/3 standards.


Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Trading Company

  • Total Annual:

    >1000000

  • Employee Number:

    >100

  • Ecer Certification:

    Verified Supplier

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Get in touch with us

  • Reach Us
  • Shenzhen Jingchengjie Technology Co., Ltd.
  • Jingchengjie, 2nd Floor, No. 46 Rifu Road, Fuyong Street, Bao'an District, Shenzhen, Guangdong Province
  • https://www.onestop-pcba.com/

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