Shenzhen Jingchengjie Technology Co., Ltd.
| Payment Terms | Western Union,T/T |
| Packaging Details | Vacuum packaging+Cardboard box |
| Turnaround | 8 Hours |
| BGA Pitch / BGA | Min 0.35mm Pitch |
| Supply Ability | 1000000PCS |
| Application | AI Edge Computing, Medical Imaging, Industrial Tablet |
| Inspection | 100% AOI + X-Ray |
| Technology | HDI with Micro-Vias |
| Component Size | 0201 (0.6mm x 0.3mm) |
| Material | High-TG FR-4 (Halogen Free) |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Min Trace/Space | 2.5mil |
| Layer Count | 8-12 Layers HDI (Blind/Buried Vias) |
| Delivery Time | 6day |
| Place of Origin | Shenzhen, China |
| Model Number | QH-5071 |
| Brand Name | QHPCBA |
| Certification | UL |
View Detail Information
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Product Specification
| Payment Terms | Western Union,T/T | Packaging Details | Vacuum packaging+Cardboard box |
| Turnaround | 8 Hours | BGA Pitch / BGA | Min 0.35mm Pitch |
| Supply Ability | 1000000PCS | Application | AI Edge Computing, Medical Imaging, Industrial Tablet |
| Inspection | 100% AOI + X-Ray | Technology | HDI with Micro-Vias |
| Component Size | 0201 (0.6mm x 0.3mm) | Material | High-TG FR-4 (Halogen Free) |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) | Min Trace/Space | 2.5mil |
| Layer Count | 8-12 Layers HDI (Blind/Buried Vias) | Delivery Time | 6day |
| Place of Origin | Shenzhen, China | Model Number | QH-5071 |
| Brand Name | QHPCBA | Certification | UL |
| High Light | HDI ENIG Gold PCB ，Embedded Control Assembly ，Quick Manufacturing Turnkey | ||
High-Density HDI Multi-Layer Embedded Control Board - Gold Finish
Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement.
Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor.
Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high-speed display interfaces.
| Feature | QHPCBA (Factory‑Direct) | Generic Platforms |
|---|---|---|
| Response Time | Direct Engineering Review | 12‑24h Customer Support Ticket |
| Production Speed | 8 Hours (SMT) | 3‑7 Days (Standard) |
| Middleman Markup | 0% (Factory Pricing) | Platform Commission Fees |
| DFM Feedback | Active & Collaborative | Automated "Reject" |
| Facility Access | Visit Our Shenzhen Factory | Virtual/Office Address |
Our factory specializes in the rapid prototyping of complex HDI boards, ensuring structural integrity and signal fidelity.
Ultra-Precision Stencil (2-Hour): Custom laser-cut stencils with nano-coating options for perfect BGA solder release.
Rapid PCB Fabrication (24-48H): Specialized supply chain for multi-layer HDI prototyping.
Expert SMT Assembly (8-Hour): Equipped with high-speed Yamaha/Pana-sonic mounters capable of 01005 component placement and X-Ray BGA inspection.
X-Ray Inspection: 100% inspection for BGA & QFN internal soldering.
AOI Testing: Full automated optical inspection for all SMT components.
Impedance Control: Strict tolerance matching for high-speed differential pairs.
Company Details
Business Type:
Manufacturer,Trading Company
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification：
Verified Supplier
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