Shenzhen Jingchengjie Technology Co., Ltd.
| Supply Ability | 1000000PCS |
| Application | AI Edge Computing, Medical Imaging, Industrial Tablet |
| Delivery Time | 6day |
| Material | High-TG FR-4 (Halogen Free) |
| Layer Count | 8-12 Layers HDI (Blind/Buried Vias) |
| BGA Pitch / BGA | Min 0.35mm Pitch |
| Payment Terms | Western Union,T/T |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Packaging Details | Vacuum packaging+Cardboard box |
| Min Trace/Space | 2.5mil |
| Place of Origin | china |
| Model Number | QHPCBA26511 |
| Certification | ISO 9001 |
| Brand Name | QHPCBA |
View Detail Information
Explore similar products
Quick Turn PCB Prototype Fast PCBA Assembly High Frequency RF PCB Board
2.5mm FR4 Fast Turnaround One Stop PCBA Prototype And PCB Assembly Service
Professional PCB Assembly Manufacturer PCB Component Sourcing
Fast SMT Stencil PCBA SMT Assembly No Middlemen No Delays
Product Specification
| Supply Ability | 1000000PCS | Application | AI Edge Computing, Medical Imaging, Industrial Tablet |
| Delivery Time | 6day | Material | High-TG FR-4 (Halogen Free) |
| Layer Count | 8-12 Layers HDI (Blind/Buried Vias) | BGA Pitch / BGA | Min 0.35mm Pitch |
| Payment Terms | Western Union,T/T | Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Packaging Details | Vacuum packaging+Cardboard box | Min Trace/Space | 2.5mil |
| Place of Origin | china | Model Number | QHPCBA26511 |
| Certification | ISO 9001 | Brand Name | QHPCBA |
| High Light | High Density embedded control board ，embedded control board ，HDI smt board assembly | ||
High-Density HDI Multi-Layer Embedded Control Board - Gold Finish
Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement.
Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor.
Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high-speed display interfaces.
| Feature | QHPCBA (Factory‑Direct) | Generic Platforms |
|---|---|---|
| Response Time | Direct Engineering Review | 12‑24h Customer Support Ticket |
| Production Speed | 8 Hours (SMT) | 3‑7 Days (Standard) |
| Middleman Markup | 0% (Factory Pricing) | Platform Commission Fees |
| DFM Feedback | Active & Collaborative | Automated "Reject" |
| Facility Access | Visit Our Shenzhen Factory | Virtual/Office Address |
Our factory specializes in the rapid prototyping of complex HDI boards, ensuring structural integrity and signal fidelity.
Ultra-Precision Stencil (2-Hour): Custom laser-cut stencils with nano-coating options for perfect BGA solder release.
Rapid PCB Fabrication (24-48H): Specialized supply chain for multi-layer HDI prototyping.
Expert SMT Assembly (8-Hour): Equipped with high-speed Yamaha/Pana-sonic mounters capable of 01005 component placement and X-Ray BGA inspection.
X-Ray Inspection: 100% inspection for BGA & QFN internal soldering.
AOI Testing: Full automated optical inspection for all SMT components.
Impedance Control: Strict tolerance matching for high-speed differential pairs.
Company Details
Business Type:
Manufacturer,Trading Company
Total Annual:
>1000000
Employee Number:
>100
Ecer Certification：
Verified Supplier
.gtr-container-qhp123 { font-family: Verdana, Helvetica, "Times New Roman", Arial, sans-serif; color: #333; line-height: 1.6; padding: 16px; max-width: 100%; box-sizing: border-box; font-size: 14px; } .gtr-container-qhp123 p { mar... .gtr-container-qhp123 { font-family: Verdana, Helvetica, "Times New Roman", Arial, sans-serif; color: #333; line-height: 1.6; padding: 16px; max-width: 100%; box-sizing: border-box; font-size: 14px; } .gtr-container-qhp123 p { mar...
Get in touch with us
Leave a Message, we will call you back quickly!