Shenzhen blueshine technology Co.,ltd
| Bottom Case | Used to secure and protect modules. Common materials are die-cast aluminum or injection-molded plastic. Die-cast aluminum is often used in high-end products due to its high strength and good heat dissipation. |
| PCB (Printed Circuit Board) Material | This is the core component that carries all the parts. It is typically a high-performance multilayer board of FR-4 grade, offering excellent electrical performance and heat dissipation. |
| Delivery Time | 10-15Days |
| Function | Employing full flip-chip COB common cathode technology, it achieves pixel-level precise light control, delivering pure blacks and ultra-high contrast for a stunningly immersive visual experience. The surface light source design ensures a uniform and soft i |
| shape | Standard Rectangle |
| Payment Terms | T/T |
| Weight | Cabinet Weight: 4.7 kg (per cabinet) Module Weight: 1.2 kg (per module) |
| control system | NovaStar / Linsn / Colorlight Synchronous Control System (Sending Card + Receiving Card) |
| Mask | It covers the very front of the module, serving to protect and align the optics. Traditionally, it's made of PC (polycarbonate) and fiber. However, to achieve better display results, many high-end COB products have adopted a maskless design, with the surfa |
| Dimensions | 150×168.75mm |
| Encapsulation materials | This is the core of COB technology. LED chips are directly encapsulated on the PCB, and the surface is typically covered with highly transparent, aging-resistant materials such as epoxy resin or silicone to provide protection and optimize light output. Som |
| Supply Ability | 10000above |
| color | White and black colors are customizable |
| pattern | 1R1G1B SMD |
| Application | Home theaters, high-end conference rooms, control rooms, studios, exhibitions, high-end commercial displays, virtual filming, etc. |
| Feature | Seamless splicing – no visible gaps, creating a truly unified display surface. • Excellent heat dissipation – efficient thermal management for stable performance. • Superior flatness – ensures consistent image quality across the entire screen. • Low temper |
| Product name | Micro-type fully flip-chip common cathode COB display panel |
| Packaging Details | LED modules are packaged in cardboard boxes, rental displays are packaged in flight cases, and regular products are packaged in wooden crates. |
| service | 2-3 years warranty + free spare parts + lifetime remote support + RMA repair + on-site service available |
| Model Number | IS-P1.2（Indoor Small Pitch P1.2） |
| Certification | CE, CCC, FCC, ETC, CB, EMC, RoHs |
| Place of Origin | China |
| Brand Name | No brand |
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Product Specification
| Bottom Case | Used to secure and protect modules. Common materials are die-cast aluminum or injection-molded plastic. Die-cast aluminum is often used in high-end products due to its high strength and good heat dissipation. | PCB (Printed Circuit Board) Material | This is the core component that carries all the parts. It is typically a high-performance multilayer board of FR-4 grade, offering excellent electrical performance and heat dissipation. |
| Delivery Time | 10-15Days | Function | Employing full flip-chip COB common cathode technology, it achieves pixel-level precise light control, delivering pure blacks and ultra-high contrast for a stunningly immersive visual experience. The surface light source design ensures a uniform and soft i |
| shape | Standard Rectangle | Payment Terms | T/T |
| Weight | Cabinet Weight: 4.7 kg (per cabinet) Module Weight: 1.2 kg (per module) | control system | NovaStar / Linsn / Colorlight Synchronous Control System (Sending Card + Receiving Card) |
| Mask | It covers the very front of the module, serving to protect and align the optics. Traditionally, it's made of PC (polycarbonate) and fiber. However, to achieve better display results, many high-end COB products have adopted a maskless design, with the surfa | Dimensions | 150×168.75mm |
| Encapsulation materials | This is the core of COB technology. LED chips are directly encapsulated on the PCB, and the surface is typically covered with highly transparent, aging-resistant materials such as epoxy resin or silicone to provide protection and optimize light output. Som | Supply Ability | 10000above |
| color | White and black colors are customizable | pattern | 1R1G1B SMD |
| Application | Home theaters, high-end conference rooms, control rooms, studios, exhibitions, high-end commercial displays, virtual filming, etc. | Feature | Seamless splicing – no visible gaps, creating a truly unified display surface. • Excellent heat dissipation – efficient thermal management for stable performance. • Superior flatness – ensures consistent image quality across the entire screen. • Low temper |
| Product name | Micro-type fully flip-chip common cathode COB display panel | Packaging Details | LED modules are packaged in cardboard boxes, rental displays are packaged in flight cases, and regular products are packaged in wooden crates. |
| service | 2-3 years warranty + free spare parts + lifetime remote support + RMA repair + on-site service available | Model Number | IS-P1.2（Indoor Small Pitch P1.2） |
| Certification | CE, CCC, FCC, ETC, CB, EMC, RoHs | Place of Origin | China |
| Brand Name | No brand | ||
| High Light | COB LED Display Panel ，Micro Type COB LED Display ，COB Common Cathode LED Display | ||
Micro-type fully flip-chip common cathode COB display panel
Main features:
Revolutionary Flip-Chip COB Technology
Engineered with state‑of‑the‑art flip‑chip COB (Chip‑on‑Board) technology and common‑cathode energy‑saving Micro LED chips, our display delivers an extraordinary 100W:1 ultra‑high contrast ratio – far surpassing conventional LED screens – while achieving exceptional ink‑color consistency across the entire panel. The result is stunning, lifelike imagery with pure blacks and brilliant highlights that captivate every viewer.
Sleek, Ultra‑Thin Profile
At just 28mm overall thickness, this display rivals the slimness of LCD TVs, setting a new industry benchmark for large‑format LED screens. Its minimalist design seamlessly integrates into any high‑end environment, from luxury homes to corporate boardrooms.
Intelligent Energy Efficiency
The common‑cathode architecture delivers the same brightness as traditional LEDs while consuming 50% less power and generating significantly less heat. The panel remains cool to the touch, enhancing both energy savings and long‑term reliability.
Built to Last – IP65 Protection
Engineered for demanding installations, the display boasts IP65‑rated dustproof, waterproof, and impact‑resistant construction, ensuring stable 24/7 operation in virtually any environment. Full ROHS certification underscores our commitment to environmental responsibility and user safety.
Seamless, Boundless Creativity
With gapless splicing and virtually invisible seams, the display enables infinite, seamless large‑format configurations that deliver an immersive, uninterrupted visual experience – perfect for command centers, exhibition halls, and immersive installations.
Effortless Maintenance
Fully front‑serviceable design with hot‑swappable modules allows for quick, tool‑free maintenance without accessing the rear, minimizing downtime and simplifying long‑term ownership.
Product Advantages:
• Seamless splicing – no visible gaps, creating a truly unified display surface.
• Excellent heat dissipation – efficient thermal management for stable performance.
• Superior flatness – ensures consistent image quality across the entire screen.
• Low temperature rise – keeps the panel cool even during extended operation.
• Long lifespan – built with durable components for years of reliable service.
• Fanless design – eliminates moving parts, reducing maintenance needs.
• Silent operation – zero noise, perfect for quiet environments like home theaters and conference rooms.
• Automatic alarm system – real‑time monitoring with instant fault alerts.
• Low failure rate – high reliability with minimal downtime.
• Safe and secure – designed with multiple protections for worry‑free use
| Parameter | P0.78125 | P0.9375 | P1.25 | P1.5625 |
|---|---|---|---|---|
| Pixel Pitch (mm) | 0.78125 | 0.9375 | 1.25 | 1.5625 |
| Pixel Density (px/m²) | 1,638,400 | 1,137,778 | 640,000 | 409,600 |
| Cabinet Resolution (px) | 768 × 432 | 640 × 360 | 480 × 270 | 384 × 216 |
| Refresh Rate (Hz) | ≤ 3840 | |||
| Cabinet Size (mm) | 600 × 337.5 × 28 | |||
| LED Type | Flip‑chip Common‑Cathode COB Package | |||
| White Balance Brightness (CD/m²) | 200 ~ 1000 (adjustable) | |||
| Contrast Ratio | ≥ 1,000,000 : 1 | |||
| Gray Scale (Bit) | 13 ~ 16 |
Strict Aging Test Procedure
Before shipment, every display unit undergoes a rigorous aging test (burn‑in test) . During this process, the screen operates continuously under full‑load conditions for an extended period, simulating real‑world usage scenarios. This critical step ensures long‑term stability, identifies any potential component issues early, and guarantees that your display delivers reliable, flicker‑free performance from day one.
Pre‑Shipment Precision Calibration
Prior to packaging, our experienced engineers perform a comprehensive pre‑shipment calibration on each cabinet. Using advanced optical instruments, we fine‑tune brightness, color uniformity, and grayscale accuracy pixel by pixel. This meticulous process ensures that every unit achieves optimal visual consistency, so your screen arrives ready to deliver stunning, perfectly matched imagery – right out of the box.
Your Assurance of Quality
With our aging and calibration protocols, you can be confident that your display will perform flawlessly upon installation, providing the exceptional visual experience you expect.
| Aspect | SMD (Surface‑Mounted Device) | GOB (Glue‑on‑Board) | COB (Chip‑on‑Board) |
|---|---|---|---|
| Technology Principle | Individual LED chips are soldered onto the PCB surface via SMT process. | Based on SMD, a transparent protective adhesive layer is vacuum‑molded over the PCB and LED chips. | LED chips are directly bonded (die‑attached) onto the PCB substrate and encapsulated as a whole, eliminating the individual package step. |
| Light Source Type | Point light source | Point light source (optimized by the protective layer) | Surface light source |
| Pixel Density | Low to medium; difficult to achieve below P1.0 | Limited by SMD structure; hard to realize ultra‑fine pitch | Extremely high; supports pixel pitches below P0.5 |
| Protection Performance | Weak; exposed chips are vulnerable to moisture and physical impact | Strong – provides waterproof, dustproof, anti‑static, anti‑collision and other “ten‑fold” protective features | Strongest – integrated encapsulation offers excellent resistance to impact, moisture, dust and static electricity |
| Display Quality | Visible pixel grain at close viewing distances; physical gaps between chips | Good uniformity; 160° wide viewing angle; effectively reduces moiré patterns | Best – seamless splicing, fine image without graininess, near‑180° viewing angle, precise color rendition |
| Heat Dissipation | Average | Relatively poor (the adhesive layer may hinder heat dissipation) | Excellent – chips directly contact the PCB, low thermal resistance and fast heat conduction |
| Maintenance | Easy – individual LEDs can be replaced on‑site | Moderately easy – protective layer reduces damage rate; field repair possible | Difficult – a faulty module usually requires full replacement; high repair cost |
| Cost | Low (mature technology) | Medium (between SMD and COB) | High (complex process and high equipment investment) |
| Typical Applications | Outdoor advertising, stage backdrops, stadiums, and other medium‑to‑large pitch scenarios | Public transport, education, retail, and other environments requiring enhanced protection | High‑end conference rooms, command & control centers, home theaters, showrooms – any ultra‑fine‑pitch, premium setting |
| If you need... | Recommended |
|---|---|
| Ultimate image quality + ultra‑fine pitch, and budget is not a primary concern | COB |
| High protection with a good balance of performance and cost | GOB |
| Cost‑effectiveness, larger pitch, and easy on‑site maintenance | SMD |
Company Details
Bronze Gleitlager
,Bronze Sleeve Bushings
andGraphite Plugged Bushings
from Quality China Factory
Business Type:
Manufacturer
Year Established:
2015
Employee Number:
300~350
Ecer Certification：
Verified Supplier
Factory Strength – Why Choose Us 1. Advanced Manufacturing Capabilities As a professional LED display manufacturer, we operate a modern production facility equipped with industry-leading machinery. Our factory features fully automated SMT assembly lines with high-precision placement eq... Factory Strength – Why Choose Us 1. Advanced Manufacturing Capabilities As a professional LED display manufacturer, we operate a modern production facility equipped with industry-leading machinery. Our factory features fully automated SMT assembly lines with high-precision placement eq...
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