Shenzhen Hansion Technology Co., Ltd.
| Type | rigid pcb |
| Base Material | FR4 Aluminum |
| Copper Thickness | 1-3oz |
| Board Thickness | 0.4-2.0mm |
| Min. Hole Size | 0.3mm |
| Min. Line Width | 0.2mm |
| Min. Line Spacing | 0.2mm |
| Surface Finishing | HASL ENIG OSP |
| Number of layer | 1-2layer |
| Solder mask | White Black |
| Design service | Available |
| Testing | Function testing |
| Component sizes | 1206,0805,0603 |
| Assembly technology | SMT and DIP |
| Reflow soldering | Nitrogen gas |
| Model Number | Customized |
| Place of Origin | Guangdong, China |
| Brand Name | HS |
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Product Specification
| Type | rigid pcb | Base Material | FR4 Aluminum |
| Copper Thickness | 1-3oz | Board Thickness | 0.4-2.0mm |
| Min. Hole Size | 0.3mm | Min. Line Width | 0.2mm |
| Min. Line Spacing | 0.2mm | Surface Finishing | HASL ENIG OSP |
| Number of layer | 1-2layer | Solder mask | White Black |
| Design service | Available | Testing | Function testing |
| Component sizes | 1206,0805,0603 | Assembly technology | SMT and DIP |
| Reflow soldering | Nitrogen gas | Model Number | Customized |
| Place of Origin | Guangdong, China | Brand Name | HS |
| High Light | 0.4-2.0mm Board Thickness FR4 PCB ，0.3mm Min. Hole Size PCB Assembly ，0.2mm Min. Line Width Printed Circuit Board | ||
PCB name | FR4 PCB | Warranty | 3years |
Solder mask | White Black | PCB clone | Acceptable |
Number of layer | 1-2layer | Other service | SMT and DIP assembly |
Company Details
Business Type:
Manufacturer
Year Established:
2014
Total Annual:
7500000-9516000
Employee Number:
145~150
Ecer Certification：
Verified Supplier
Specialized in Aluminum Substrates & Copper Substrates Production: High-Efficiency Heat Dissipation, Conquer Extreme Environments Focused on R&D and manufacturing of high-performance thermal management substrates, we provide industrial-grade solutions with aluminum substrates and coppe... Specialized in Aluminum Substrates & Copper Substrates Production: High-Efficiency Heat Dissipation, Conquer Extreme Environments Focused on R&D and manufacturing of high-performance thermal management substrates, we provide industrial-grade solutions with aluminum substrates and coppe...
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