Shenzhen Hansion Technology Co., Ltd.
| Base Material | Aluminum Base |
| Copper Thickness | 1-3oz |
| Board Thickness | 0.8-1.6mm |
| Min Hole Size | 0.2mm |
| Min Line Width | 0.1mm |
| Min Line Spacing | 0.1mm |
| Surface Finishing | HASL OSP ENIG |
| Number of Layers | 1layer |
| Solder Mask Colors | White Black Green Blue Red,etc. |
| Board Thickness Tolerance | ±10% |
| Copper Plating Hole | 18-40 um |
| Impedance Control | ±10% |
| Warp&Twist | 0.70% |
| Min Trace Width | 0.075mm |
| Min Space Width | 0.1mm |
| Model Number | LED PCB manufacturer |
| Place of Origin | Guangdong, China |
| Brand Name | HS |
| Certification | CE UL ROHS ISO9001 |
View Detail Information
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Product Specification
| Base Material | Aluminum Base | Copper Thickness | 1-3oz |
| Board Thickness | 0.8-1.6mm | Min Hole Size | 0.2mm |
| Min Line Width | 0.1mm | Min Line Spacing | 0.1mm |
| Surface Finishing | HASL OSP ENIG | Number of Layers | 1layer |
| Solder Mask Colors | White Black Green Blue Red,etc. | Board Thickness Tolerance | ±10% |
| Copper Plating Hole | 18-40 um | Impedance Control | ±10% |
| Warp&Twist | 0.70% | Min Trace Width | 0.075mm |
| Min Space Width | 0.1mm | Model Number | LED PCB manufacturer |
| Place of Origin | Guangdong, China | Brand Name | HS |
| Certification | CE UL ROHS ISO9001 | ||
| High Light | 1-3oz Copper Thickness LM301B LED PCB ，0.8-1.6mm Board Thickness Aluminum LED PCB ，0.2mm Min. Hole Size Plant Grow LED PCB | ||
| item | Manufacture Capability |
| Material | FR4,CEM-1, Aluminium, Polyamide |
| Layer No. | 1-12 |
| Finished board thickness | 0.1 mm-4.0mm |
| Board Thickness Tolerance | ±10% |
| Cooper thickness | 0.5 OZ-3OZ (18 um-385 um) |
| Copper Plating Hole | 18-40 um |
| Impedance Control | ±10% |
| Warp&Twist | 0.70% |
| Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
| Images | |
| Min Trace Width (a) | 0.075mm (3mil) |
| Min Space Width (b) | 0.1mm (4 mil) |
| Min Annular Ring | 0.1mm (4 mil) |
| SMD Pitch (a) | 0.2 mm(8 mil) |
| BGA Pitch (b) | 0.2 mm (8 mil) |
| Solder Mask | |
| Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
| Solder mask Clearance (b) | 0.1mm (4 mil) |
| Min SMT Pad spacing (c) | 0.1mm (4 mil) |
| Solder Mask Thickness | 0.0007"(0.018mm) |
| Holes | |
| Min Hole size (CNC) | 0.2 mm (8 mil) |
| Min Punch Hole Size | 0.9 mm (35 mil) |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL | 2.5um |
| Lead free HASL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5u'' |
| OSP | 0.2-0.5um |
| Outline | |
| Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
| Beveling | 30°45° |
| Gold Finger angle | 15° 30° 45° 60° |
| Certificate | ROHS, ISO9001:2008, SGS, UL certificate |
Company Details
Business Type:
Manufacturer
Year Established:
2014
Total Annual:
7500000-9516000
Employee Number:
145~150
Ecer Certification：
Verified Supplier
Specialized in Aluminum Substrates & Copper Substrates Production: High-Efficiency Heat Dissipation, Conquer Extreme Environments Focused on R&D and manufacturing of high-performance thermal management substrates, we provide industrial-grade solutions with aluminum substrates and coppe... Specialized in Aluminum Substrates & Copper Substrates Production: High-Efficiency Heat Dissipation, Conquer Extreme Environments Focused on R&D and manufacturing of high-performance thermal management substrates, we provide industrial-grade solutions with aluminum substrates and coppe...
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