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Guangdong Chuangwei Electronic Equipment Manufactory

  • China,Dongguan ,Guangdong
  • Verified Supplier
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China Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W
China Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W

  1. China Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W
  2. China Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W

Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W

  1. MOQ: 1 Set
  2. Price: USD 2000-9999
  3. Get Latest Price
Delivery Time 3 work days
Packaging Details plywooden case
Max PCB Size 600*460mm
Max component height 11mm
Laser source UV, CO2
Cutting precision ±20 μm
Name PCB Laser Depaneling
Weight 500Kg
Payment Terms T/T L/C D/P Western Union
Brand Name ChuangWei
Model Number CWVC-5S
Certification CE Certification
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Delivery Time 3 work days Packaging Details plywooden case
Max PCB Size 600*460mm Max component height 11mm
Laser source UV, CO2 Cutting precision ±20 μm
Name PCB Laser Depaneling Weight 500Kg
Payment Terms T/T L/C D/P Western Union Brand Name ChuangWei
Model Number CWVC-5S Certification CE Certification
Place of Origin China
High Light medical Drying Cabinetdry storage cabinets

 

Industrial PCB Laser Depaneling with Different Laser Source 10/12/15/18W

 

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

 

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

 

Damages and fractures to substrates and circuits due to mechanical stress

Damages to PCB due to accumulated debris

Constant need for new bits, custom dies, and blades

Lack of versatility – each new application requires ordering of custom tools, blades, and dies

Not good for high precision, multi-dimensional or complicated cuts

Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

 

Advantages of Laser PCB depaneling/singulation

 

  • No mechanical stress on substrates or circuits

  • No tooling cost or consumables.

  • Versatility – ability to change applications by simply changing settings

  • Fiducial Recognition – more precise and clean cut

  • Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.

  • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

  • Extraordinary cut quality holding tolerances as small as < 50 microns.

  • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

 

Specification:

 

Parameter

 

 

 

 

 

 

 

 

Technical parameters

Main body of laser

1480mm*1360mm*1412 mm

Weight of the

1500Kg

Power

AC220 V

Laser

355 nm

Laser

 

Optowave 10W(US)

Material

≤1.2 mm

Precisio

±20 μm

Platfor

±2 μm

Platform

±2 μm

Working area

600*450 mm

Maximum

3 KW

Vibrating

CTI(US)

Power

AC220 V

Diameter

20±5 μm

Ambient

20±2 ℃

Ambient

<60 %

The Machine

Marble

 

Business Partners:

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler

  • Year Established:

    2004

  • Total Annual:

    4000000-5000000

  • Employee Number:

    100~120

  • Ecer Certification:

    Verified Supplier

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Get in touch with us

  • Reach Us
  • Guangdong Chuangwei Electronic Equipment Manufactory
  • 3F, Building E, Tongjin High-tech Park, Guan chang Road, Dalingshan Town, Dongguan City, Guangdong Province, China
  • https://www.pcb-depanelingrouter.com/

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