2 Layer Aluminum Core PCB Board 1.6mm with Copper Foil

China Factory 2 Layer Aluminum Base Copper core PCB Board

PCB parameter:

Board thickness: 1.6MM

Brand:Oneseine

Withstand voltage: AC2000V

Thermal conductivity: 2.0w/m.k

Copper foil thickness: 1OZ

Quality certification: ULE354470/ISO/SGS/IATF16949

Surface treatment: OSP

Test: 100% computer open and short circuit test

There are numerous PCB manufacturers around the world that specialize in the production of metal core PCBs. Here are a few well-known PCB manufacturers that offer metal core PCB fabrication services:

Advanced Circuits: Advanced Circuits is a PCB manufacturer based in the United States. They provide metal core PCB fabrication services using aluminum and copper core materials. They offer a range of options for layer count, thickness, copper weight, surface finish, and other customization features.

ITEQ: ITEQ is a global PCB manufacturer with production facilities in Europe and Asia. They offer a variety of metal core PCB options, including aluminum and copper core boards. ITEQ specializes in high-quality PCB manufacturing and provides custom solutions tailored to specific customer requirements.

King Credie Technology Limited: King Credie is a PCB manufacturer based in China that specializes in metal core PCB production. They offer aluminum and copper core PCBs for various applications and provide comprehensive PCB manufacturing services, including design, fabrication, and assembly.

Ventec International Group: Ventec is a leading global provider of high-quality PCB materials and solutions. They offer metal core PCBs with aluminum and copper cores, catering to applications that require efficient thermal management. Ventec focuses on delivering advanced materials and reliable PCB manufacturing services.

ONESEINE PCB: ONESEINE PCB is a PCB manufacturer with facilities in the China. They offer metal core PCBs using aluminum and copper core materials. ONESEINE PCB specializes in quick-turn PCB fabrication and prototyping, along with volume production services.

When selecting a metal core PCB factory, it's essential to consider factors such as manufacturing capabilities, quality standards, certifications, production lead times, pricing, and customer support. Conducting thorough research, reviewing customer testimonials, and requesting quotes from multiple manufacturers will help you make an informed decision based on your specific requirements.

Advanced Metal Core PCB Technology: Engineering Principles & Application-Specific Optimization

Material Science Evolution
Contemporary metal core PCBs leverage substrate innovations transcending conventional aluminum/copper dichotomies. Anodized Aluminum Alloys (6061-T6) dominate cost-sensitive thermal management (1.8-2.2 W/mK) with CTE-matched dielectrics like polyimide-ceramic composites (εr=4.1, 0.002 Df). For extreme power density (>500W/cm²), Direct Bonded Copper (DBC) substrates fuse oxygen-free copper (380 W/mK) to ceramic (Al₂O₃/AlN) via eutectic bonding, achieving thermal resistance <0.1K/W. Emerging Metal Matrix Composites (Al-SiC) deliver CTE 6.5 ppm/°C matching semiconductor packages, while Molybdenum-Copper Alloys solve thermal expansion challenges in hermetic aerospace modules. Flexible variants now incorporate nanostructured graphite layers (in-plane σ=1500 W/mK) for wearable biosensors.

Precision Fabrication Methodology

Modern production employs laser-ablation dielectric patterning achieving 20μm resolution for high-frequency applications. Critical innovations include:

Plasma Electrolytic Oxidation (PEO): Creates 50-100μm crystalline Al₂O₃ layers on aluminum cores, doubling dielectric strength versus standard anodization

Magnetic Pulse Clamping: Ensures void-free lamination under 300MPa pressure at 180°C

Electrophoretic Dielectric Deposition: Forms 30-80μm pinhole-free insulation layers with 25kV/mm breakdown

Conformal Cooling Channels: CNC-milled microfluidic paths in copper cores enable active liquid cooling

Thermal-Structural Co-Design Framework

Optimal thickness follows first-principles thermodynamics:

Core Thickness = √(P × Rth × A / k) where P=power, Rth=target θja, A=area, k=conductivity
(e.g., 200W LED array requires 2.4mm copper core vs 6.0mm aluminum)

Dielectric Optimization: 75-120μm polymer-ceramic blends balance thermal resistance (0.25°C-in²/W) and voltage isolation (>4kV)

Copper Weight Selection: 3oz minimum for power paths (ΔT<30°C at 50A), 10oz+ for IGBT baseplates

Topology-Driven Layout: Thermal vias arrayed at λ/4 intervals (λ=thermal wavelength) suppress hot spots

Reliability Engineering Protocols

Leading manufacturers implement:

Accelerated Life Testing: 2000hrs @ 150°C junction temperature per AEC-Q102

Thermomechanical Fatigue Modeling: FEA simulation of 10⁷ thermal cycles (-55↔+175°C)

Acoustic Micro-Imaging: Detects sub-10μm delamination in dielectric layers

Parylene Conformal Coating: 5-15μm vapor deposition prevents dendritic growth in humid environments

Performance Benchmarking

Recent studies (IEEE TPMS 2023) confirm:

AlN ceramic cores sustain 35kV/mm field strength at 200°C

Cu-Mo-Cu sandwiches reduce thermal impedance 62% vs monolithic copper

Nanodiamond-filled dielectrics achieve k=12 W/mK with 0.99 dissipation factor

Hybrid Al/grafcore laminates enable 500W/in² dissipation in 1.2mm profiles

Certification Ecosystem

Compliance now extends beyond UL/IEC to:

MIL-PRF-32535M for military power converters

ISO 1817 for chemical resistance in automotive underhood

IPC-7093B design standards for bottom-terminated components

JEDEC JESD51-14 thermal test methods