Rogers4350 FR4 Multilayer PCB Prototype Board 1-60 Layers

Product Specification

Rogers4350 FR4 Mixed Dielectric Hybrid Stack-Up PCB Prototype

General info.:

Base material: rogers 4350 0.203mm+fr4

Layer:4

Surface finish:Immersion gold

Board size: 15.9*8.5cm

Final board thickness:1.5mm

Min trace width:0.2mm

Solder mask and silk: Yes

Stack up file:

Prototype time:8-10 days

4layers with 3 cores,calculate as 8layers.fake 8layer

Mixed high frequency construction can reduce costs when the need for RF dielectric is local and only between some layers. The rest of the dielectric can be FR4 or halogen-free FR4. It is also possible to combine PTFE () materials with FR4.

Cross section of mixed Rogers 4350B, high Tg FR4 and embedded C-coin:

Multilayer PCB production

The production of multilayer PCBs involves several steps, from design and fabrication to assembly and testing. Here is an overview of the typical production process:

1,Design: The design process involves creating the schematic and layout of the PCB using specialized PCB design software. The design includes defining the layer stack-up, trace routing, component placement, and signal integrity considerations. Design rules and constraints are set to ensure manufacturability and reliability.

2,CAM (Computer-Aided Manufacturing) Processing: Once the PCB design is complete, it undergoes CAM processing. CAM software converts the design data into manufacturing instructions, including generating Gerber files, drill files, and layer-specific information required for fabrication.

3,Material Preparation: The PCB fabrication process begins with material preparation. The core material, typically FR-4 fiberglass epoxy, is cut into appropriate panel sizes. Copper foil sheets are also prepared in the required thicknesses for the inner and outer layers.

4,Inner Layer Processing: The inner layer processing involves a series of steps:

a. Cleaning: The copper foil is cleaned to remove any contaminants.

b. Lamination: The copper foil is laminated to the core material using heat and pressure, creating a panel with copper-clad surfaces.

c. Imaging: A photosensitive layer called the photoresist is applied to the panel. The inner layer artwork from the Gerber files is used to expose the photoresist layer, defining the copper traces and pads.

d. Etching: The panel is etched to remove the unwanted copper, leaving behind the desired copper traces and pads.

e. Drilling: Precision holes are drilled in the panel to create vias and component mounting holes.

5,Outer Layer Processing: The outer layer processing involves similar steps as the inner layer, including cleaning, lamination, imaging, etching, and drilling. However, the outer layer processing also includes the application of soldermask and silkscreen layers on the surface for protection and component identification.

6,Multilayer Lamination: Once the inner and outer layers are processed, they are stacked together with layers of prepreg material. The stack is then placed in a hydraulic press and subjected to heat and pressure to bond the layers together, forming a solid multilayer structure.

7,Plating and Surface Finish: The plated-through holes (vias) are electroplated with copper to ensure electrical connectivity between the layers. The exposed copper surfaces are then treated with a surface finish, such as tin, lead-free solder, or gold, to protect them from oxidation and facilitate soldering during assembly.

8,Routing and V-Cut: After the multilayer lamination, the PCB panel is routed to separate individual PCBs. V-cut or scoring techniques may also be used to create perforation lines, allowing easy separation of PCBs after assembly.

9,Assembly: The assembled components and soldering take place on the multilayer PCB. This involves the placement of electronic components onto the PCB, soldering them to the copper pads, and any necessary reflow or wave soldering processes.

10,Testing and Inspection: Once the assembly is complete, the PCBs undergo various testing and inspection procedures to ensure functionality, electrical continuity, and quality. This includes automated optical inspection (AOI), functional testing, and other tests as per the specific requirements.

Packaging and Shipping: The final step involves packaging the PCBs to protect them during transportation and shipping them to the desired destination.