ONESEINE TECHNOLOGY CO.,LTD
| Packaging Details | Vacuun bag |
| Delivery Time | 5-8 working days |
| Payment Terms | T/T,Western Union |
| Supply Ability | 1000000000pcs/mon |
| Layer Count | 8 |
| Step Count | 1 |
| Finish | Gold Finger |
| Thickness | 32u |
| Technology | HDI |
| Product Type | PCB |
| Place of Origin | Shenzhen,China |
| Brand Name | ONESEINE |
| Certification | ISO9001,ISO14001 |
| Model Number | ONE-102 |
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Product Specification
| Packaging Details | Vacuun bag | Delivery Time | 5-8 working days |
| Payment Terms | T/T,Western Union | Supply Ability | 1000000000pcs/mon |
| Layer Count | 8 | Step Count | 1 |
| Finish | Gold Finger | Thickness | 32u |
| Technology | HDI | Product Type | PCB |
| Place of Origin | Shenzhen,China | Brand Name | ONESEINE |
| Certification | ISO9001,ISO14001 | Model Number | ONE-102 |
| High Light | HDI High TG PCB ，Goldfinger High TG PCB ，Multilayer pcb goldfinger | ||
8 Layers 1 Step Gold Finger 32u HDI Multilayer PCB Fabrication
PCB parameter:
Plate used: FR-4
Number of layers: 8
Board thickness: 1.0+/-0.1mm
Surface treatment: Immersion gold, OSP, electric gold finger 32u
Application area: memory board
Features: Drilling 1-3 4-5 6-8
Elite 8-Layer HDI PCBs: 32μm Microvias + 1-Step Gold Fingers for Mission-Critical Connectivity
China’s Advanced Fabrication for Aerospace, Medical & Defense Systems
The High-Density Reliability Crisis
When surgical robots, satellite payloads, and industrial automation demand 250,000+ mating cycles and 110GHz signal integrity, conventional PCBs fail at critical junctures:
Gold finger delamination after 10k insertions
Microvia cracking under thermal shock
Impedance drift >±10% in HDI designs
Signal loss spikes at millimeter-wave frequencies
Engineered Solution: Our 8-layer 32μm HDI PCBs with 1-step electrolytic gold fingers deliver:
50μ" Hard Gold (5× industry thickness)
Laser-drilled 32μm µvias (aspect ratio 1:1.2)
±3% impedance control @ 40GHz
Tg180 FR4/High-Speed Hybrid stackups
Why Global OEMs Specify This Technology
1. Gold Finger Dominance
1-Step Electrolytic Plating:
50μ" gold hardness >200HK (vs. 100HK ENIG)
300K mating cycles @ 50N force (MIL-G-45204)
Laser-Cut Bevels: 30°±0.5° with Ra<0.1μm
Wrap-Around Plating: 360° edge coverage prevents cracking
2. 32μm HDI Breakthroughs
Microvia-in-Pad: 0.15mm pitch BGA support
Stacked µvias: 8:1 aspect ratio for 16Gb/s signals
Copper Filling: 100% void-free via fill (X-ray verified)
3. Signal Integrity Mastery
Hybrid Dk Control: εr=3.48±0.02 (1-40GHz)
Near-Zero Loss: <0.002dB/mm @ 110GHz
EMI Shielding: -55dB crosstalk via hatched grounds
Certified Applications
Surgical Robotics
8-layer HDI + gold fingers for tool interfaces
0.008mm² misregistration (ISO 13485 compliant)
Survives 1,000 autoclave cycles
Satellite RF Switches
32μm µvias enable Ka-band beamforming
PIM <-168dBc @ 2x43dBm
NASA-STD-8739.4 certified
Industrial Backplanes
1-step gold fingers @ 250K hot-swap cycles
25Gbps ARINC 818 video transmission
UL 94V-0 + IP68 conformal coating
China’s Competitive Edge
Speed & Precision
10-Day Prototypes with full test reports
25-Day Volume Production (30k panels/month)
Cost Transformation
45% savings vs. North American fabs
Zero NRE for design optimization
Technical Partnership
Free HDI DFM analysis (IPC-2226)
Signal integrity simulations (HFSS 3D)
On-site failure forensics
Company Details
Business Type:
Manufacturer
Year Established:
2013
Total Annual:
1000000-5000000
Employee Number:
100~200
Ecer Certification：
Verified Supplier
ONESEINE TECHNOLOGY CO., LTD., a prominent manufacturer of printed circuit boards (PCBs) established in 2013 , specializes in the production of High-Frequency PCBs, Multilayer PCBs (1-24 layers), FR-4 PCBs, and Rigid-Flexible PCBs. Our comprehensive services encompass quick-turn prototyping, Rogers+... ONESEINE TECHNOLOGY CO., LTD., a prominent manufacturer of printed circuit boards (PCBs) established in 2013 , specializes in the production of High-Frequency PCBs, Multilayer PCBs (1-24 layers), FR-4 PCBs, and Rigid-Flexible PCBs. Our comprehensive services encompass quick-turn prototyping, Rogers+...
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