Shenzhen Shinelink Technology Ltd
| Payment Terms | T/T, Western Union, MoneyGram,Paypal |
| Supply Ability | 10000 Piece/Pieces per Day |
| Delivery Time | 5-7 days |
| Packaging Details | ESD Bag |
| Board thickness | 0.11mm-0.5mm |
| Service | OEM / ODM |
| Soldermask | Yellow PI Film |
| Features 1 | Gerber/PCB file needed |
| Features 2 | 100% E-test |
| Features 3 | 3 years guarantee |
| Brand Name | OEM / ODM |
| Model Number | SL80903S004 |
| Certification | UL, ROhs |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram,Paypal | Supply Ability | 10000 Piece/Pieces per Day |
| Delivery Time | 5-7 days | Packaging Details | ESD Bag |
| Board thickness | 0.11mm-0.5mm | Service | OEM / ODM |
| Soldermask | Yellow PI Film | Features 1 | Gerber/PCB file needed |
| Features 2 | 100% E-test | Features 3 | 3 years guarantee |
| Brand Name | OEM / ODM | Model Number | SL80903S004 |
| Certification | UL, ROhs | Place of Origin | China |
| High Light | flexible printed circuit boards ，flex printed circuit board | ||
PI Material FPC double sides 2.0oz copper thickness flexible pcb
Number of layers: 2 layers
Material: FPC
Board thickness: 1.6mm
Surface plating: ENIG
Min Trace: 3mil
Silkscreen:White
With 14+ years of experience exporting PCBs overseas, We understands the needs of your business and welcomes the opportunity to serve you.
Shinelink Company philosophy is simple- Deliver quality printed circuit boards on time.
We are ISO 9001:2008 certified.
Our dedication to building a quality product is the centerpiece of our business policy.
We are committed to fulfilling our customers' on-going quality requirements through continuous improvements to all of our internal processes. Our quality management system ensures the highest operating standards at all levels.
| Item | Mass production | Small batch production | ||
| Number of layers | UP TO 18L | UP TO L | ||
| Laminate type | FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more. | FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more. | ||
| Maximum board size | 610mm*1100mm | 610mm*1100mm | ||
| Board thickness | 0.1mm-7.00mm | ＜0.1mm and ＞7.00mm | ||
| Minimum line width/space | 3.5mil(0.0875mm) | 3mil(0.075mm) | ||
| Minimum line gap | +/-15% | +/-10% | ||
| Outer layer copper thickness | 35um-175um | 35um-210um | ||
| Inner layer copper thickness | 12um-175um | 12um-210um | ||
| Drilling hole size(Mechanical) | 0.15mm-6.5mm | 0.15mm-6.5mm | ||
| Finished hole size (Mechanical) | 0.15mm-6.0mm | 0.15mm-6.0mm | ||
| Board thickness hole size ratio | 14:1 | 16:1 | ||
| Board thickness tolerance(t=0.8mm) | ±8% | ±5% | ||
| Board thickness tolerance(t＜0.8mm) | ±10% | ±8% | ||
| Min. grid line width | 4mil(12, 18, 35um), 6mil(70um) | 4mil(12, 18, 35um), 6mil(70um) | ||
| Min. grid spacing | 6mil(12, 18, 35um), 8mil(70um) | 6mil(12, 18, 35um), 8mil(70um) | ||
| Hole size tolerance(Mechanical) | 0.05-0.075mm | 0.05mm | ||
| Hole position tolerance(Mechanical) | 0.005mm | 0.005mm | ||
| Solder mask color | Green, Blue, Black, White, Yellow, Red, Grey etc. | Green, Blue, Black, White, Yellow, Red, Grey etc. | ||
| Impedance control tolerance | +/-10% | +/-8% | ||
| Min. distance between drilling to conductor(non-blind buried orifice) | 8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L) | 6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L) | ||
| Min. Character width and height(35um base copper) | Line width: 5mil | Line width: 5mil; height: 27mil | ||
| Max. test voltage | 500V | 500V | ||
| Max. test current | 200mA | 200mA | ||
|
| Flash Gold | 0.025-0.075um | 0.025-0.5um | |
| Immersion Gold | 0.05-0.1um | 0.1-0.2um | ||
| Sn/Pb HASL | 1-70um | 1-70um | ||
| Lead-free HASL | 1-70um | 1-70um | ||
| Immersion Silver | 0.08-0.3um | 0.08-0.3um | ||
| OSP | 0.2-0.4um | 0.2-0.4um | ||
| Gold Finger | 0.375um | >=1.75um | ||
| Hard Gold Plating | 0.375um | >=1.75um | ||
| Immersion Sin | 0.8um |
| ||
| V-Cut rest thickness tolerance | ±0.1mm | ±0.1mm | ||
|
| Chamfer | The angle type of the chamfer | 30,45,60 | |
| Plug via hole | Max.size can be plugged | 0.6mm | ||
| Largest NPTH hole size | 6.5mm | >6.5mm | ||
| Largest PTH hole size | 6.5mm | >6.5mm | ||
| Min. solder spacer ring | 0.05mm | 0.05mm | ||
| Min. solder bridge width | 0.1mm | 0.1mm | ||
| Drilling diameter | 0.15mm-0.6mm | 0.15mm-0.6mm | ||
| Min. pad diameter with hole | 14mil( 0.15mm drilling) | 12mil( 0.1mm laser) | ||
| Min. BGA pad diameter | 10mil | 8mil | ||
| Chemical ENIG gold thickness | 0.025-0.1um(1-4U) | 0.025-0.1um | ||
| Chemical ENIG nickel thickness | 3-5um(120-200U) | 3-5um | ||
| Min. resistance test | Ω | 5 | ||
FPCB Picture
Company Details
Business Type:
Manufacturer,Trading Company
Year Established:
2005
Total Annual:
8 million-10 million
Employee Number:
250~300
Ecer Certification：
Active Member
The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs. Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper... The Leading Printed Circuit Board Manufacturer and PCB Assembly -Shinelink Technology Ltd We Offer a Full Range of Printed Circuit Board, PCB Capabilities to Fit All of Your PCB Needs. Shinelink Technology Ltd founded in the year 2005, located in Shenzhen,China. is an exper...
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