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Studio Technology Co., Ltd.

  • China,Dongguan ,Guangdong
  • Verified Supplier
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China Advanced Turnkey PCB Manufacturing AOI SPI ICT FCT Turnkey Prototype Assembly
China Advanced Turnkey PCB Manufacturing AOI SPI ICT FCT Turnkey Prototype Assembly

  1. China Advanced Turnkey PCB Manufacturing AOI SPI ICT FCT Turnkey Prototype Assembly

Advanced Turnkey PCB Manufacturing AOI SPI ICT FCT Turnkey Prototype Assembly

  1. MOQ: No MOQ
  2. Price: Quote based on your specs
  3. Get Latest Price
Delivery Time 5-25 working days(varies by product)
Packaging Details ESD Protective Packaging
Payment Terms T/T
Supply Ability 100,000 pieces/month
Place of Origin China

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  1. Product Details
  2. Company Details

Product Specification

Delivery Time 5-25 working days(varies by product) Packaging Details ESD Protective Packaging
Payment Terms T/T Supply Ability 100,000 pieces/month
Place of Origin China
High Light advanced turnkey pcb manufacturingturnkey pcb manufacturing aoifct turnkey prototype assembly
Advanced Turnkey PCB Manufacturing – AOI, SPI, ICT & FCT
Overview

Quality verification requires more than just visual inspection—it demands a comprehensive testing ecosystem that catches defects at every stage of production. Studio Electronics delivers advanced turnkey PCB manufacturing backed by a complete inspection suite including AOI, SPI, 3D X-Ray, ICT, FCT, and Flying Probe testing. As a premier provider of PCB assembly in China, we deploy these advanced testing technologies at strategic checkpoints throughout production—from solder paste inspection before reflow to functional testing of fully assembled boards. Every board is verified, every defect is caught, and every delivery meets your quality expectations.

 
Our Multi-Layered Inspection Ecosystem
Inspection Stage Equipment What We Verify
Pre-Reflow 3D SPI (Solder Paste Inspection) Paste volume, height, area; prevents printing defects before components are placed
Post-Reflow Visual AOI (Automated Optical Inspection) Component presence, polarity, alignment, solder joint quality
Hidden Joint 3D X-Ray Inspection BGA, QFN, LGA voids, bridging, insufficient solder
Electrical Validation ICT (In-Circuit Tester) Component values (R, C, L); shorts/opens detection
Functional Verification FCT (Functional Circuit Test) Full board performance under simulated operating conditions
Fixture-less Testing Flying Probe Tester Rapid electrical verification; ideal for low volume PCB assembly
 

Advanced Equipment Supporting Our Inspection Capabilities
  • 12 Fully Automated SMT Lines – High-speed placement with ±25μm accuracy; 01005 to BGA capability; up to 100,000 CPH

  • Automatic Wave Soldering – Programmable closed-loop control; ±1°C accuracy for consistent THT soldering

  • Programmable Automated Soldering Robots – ±0.05mm positional accuracy; precision selective soldering

  • 3D SPI – Micron-level paste measurement; real-time feedback to screen printer

  • 3D AOI – AI-assisted defect classification; high-speed optical inspection

  • 3D X-Ray – Automated void calculation; detects sub-10μm defects

  • Reliability Laboratory – Thermal shock, temperature cycling, damp heat, vibration, and burn-in testing

 

How Our Inspection Ecosystem Protects Your Quality
  • SPI (3D Solder Paste Inspection) – Every board is inspected for paste volume, height, and area before components are placed. Data is collected per board, and boards with anomalies are rejected before reflow—saving components and reducing rework cost. Real-time feedback to the screen printer ensures immediate correction of paste printing issues.

  • AOI (Automated Optical Inspection) – After reflow, high-speed AOI inspects component presence, polarity, alignment, and solder joint quality. AI-assisted defect classification ensures accurate detection with low false-call rates. Inspection data is logged per board serial number.

  • 3D X-Ray Inspection – For BGAs, QFNs, and other hidden-joint components, X-Ray provides full visibility of solder joints that the naked eye cannot see. Automated void calculation measures void percentage against your acceptance criteria. Bridging and insufficient solder are detected and reported.

  • ICT (In-Circuit Tester) – Bed-of-nails testing validates individual component values and detects electrical shorts or opens. Test results are logged per board and compared against specifications.

  • FCT (Functional Circuit Test) – Power-on testing simulates real-world operating conditions to confirm full board functionality. Custom test fixtures are developed for your specific product requirements, ensuring accurate and repeatable testing.

  • Flying Probe Tester – For low volume PCB assembly and prototype runs, Flying Probe testing provides fixture-less electrical verification with rapid changeover capability—eliminating test fixture costs for small batches.

 

Inspection Coverage by Production Volume
Volume Type Inspection Protocol
Prototypes (1-10 pieces) 100% SPI + 100% AOI + 100% X-Ray + Flying Probe + 100% FCT
Small Batch (11-250 pieces) 100% SPI + 100% AOI + 100% X-Ray + ICT + 100% FCT
Medium to High Volume (250+) 100% SPI + 100% AOI + 100% X-Ray + ICT (statistical FCT sampling with full coverage available on request)

Choose Studio for advanced turnkey PCB manufacturing and get the confidence that comes from knowing every board has passed through the most comprehensive inspection ecosystem in the industry—including AOI, SPI, X-Ray, ICT, FCT, and Flying Probe testing.

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer

  • Year Established:

    2003

  • Total Annual:

    30000000-40000000

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

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Get in touch with us

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  • Studio Technology Co., Ltd.
  • No. 1 Getian Road, Xin'an, Chang'an Town, Dongguan City, Guangdong Province, China
  • https://www.pcbassemblyturnkey.com/

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