Studio Technology Co., Ltd.
| Supply Ability | 100,000 pieces/month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 100,000 pieces/month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | smt pcb prototyping ，smt flex pcb assembly ，fpc pcb prototyping | ||
Overview
Flexible circuits enable innovative product designs—wearables, foldable displays, medical devices, and compact automotive electronics—but their assembly requires specialized expertise beyond standard rigid PCB processing. Studio Electronics delivers Turnkey Flex PCB Assembly with professional SMT capabilities for FPC (Flexible Printed Circuit) and FFC (Flexible Flat Cable) applications. As a specialized provider of PCB assembly in China, we combine deep experience in flexible substrate handling with 12 fully automated SMT lines and dedicated FPC assembly fixtures to deliver reliable, high-quality flexible board assemblies—from component sourcing through final shipping.
Why Flex PCB Assembly Requires Specialized Expertise
Unlike rigid PCBs, flexible circuits present unique challenges:
| Challenge | Impact | Studio's Solution |
|---|---|---|
| Substrate Flexibility | Boards bend and warp during SMT processing | Custom rigid carriers (fixtures) with precision alignment pins; vacuum or magnetic hold-down |
| Moisture Absorption | Polyimide absorbs moisture; risk of delamination during reflow | Pre-baking at 80-100°C for 4-8 hours before assembly |
| Thermal Sensitivity | PI has lower Tg than FR4; standard reflow profiles cause damage | Controlled low-temperature reflow profiles; slower ramp rates; lower peak temperatures |
| Component Stress | Bend areas cause solder joint fatigue | Stiffener placement; strategic component positioning away from flex zones; dynamic bend testing |
Our Flex PCB Assembly Process – Step by Step
Stage 1: Component Sourcing & Incoming Inspection
We source all components per your BOM through authorized distributors. For low volume PCB assembly, we handle small-quantity procurement efficiently. Every component undergoes LCR testing and visual verification before entering production.
Stage 2: FPC Pre-Treatment
Flexible circuits are pre-baked to remove moisture—preventing delamination and bubbling during reflow. Each board is carefully handled to prevent creasing or damage.
Stage 3: Custom Carrier/Fixture Preparation
Every FPC design requires a dedicated rigid carrier (fixture) with precision tooling pins. Fixtures are customized for each board shape and component placement pattern, ensuring dimensional stability throughout the SMT process.
Stage 4: SMT Assembly
12 fully automated SMT lines with ±25μm accuracy handle component placement. Fixtures maintain FPC flatness during solder paste printing and component mounting. Automatic wave soldering and programmable soldering robots handle through-hole and mixed-technology requirements.
Stage 5: Controlled Reflow
FPC assemblies undergo low-temperature reflow profiles—lower peak temperatures (typically <235°C), slower ramp rates, and extended soak zones—to minimize thermal stress on polyimide substrates.
Stage 6: Quality Inspection
AOI, X-Ray, ICT, and Flying Probe testing—100% coverage. Flexible boards are carefully removed from fixtures for inspection. Dynamic bend testing verifies reliability for flex applications.
Stage 7: Final Assembly & Shipping
Professional anti-static packaging; customs clearance; global logistics.
FPC & FFC Assembly Expertise at a Glance
Carrier/Fixture Design – Custom carriers for every FPC design; precision alignment; reusability optimized for low volume PCB assembly runs
Controlled Reflow – Low-temperature profiles protecting PI substrates; nitrogen reflow available
Stiffener Application – FR4 or polyimide stiffeners for connector areas and high-stress zones
Dynamic Bend Testing – Verification of solder joint reliability under flex conditions
Full Turnkey Service – Component sourcing, PCB fabrication, assembly, testing, and shipping—all under one roof
Studio delivers Turnkey Flex PCB Assembly—SMT expertise for FPC and FFC applications, with the specialized handling flexible circuits demand.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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